scholarly journals An Electron Backscatter Diffraction and Cathode-Luminescence Study of Microstructures in the Damage Zone and the Actively Creeping Core of the San Andreas Fault Zone

2021 ◽  
Author(s):  
Alan Boyle ◽  
Jafar Hadizadeh
Keyword(s):  
Fault Zone ◽  
San Andreas Fault ◽  
Electron Backscatter Diffraction ◽  
Damage Zone ◽  
Cathode Luminescence ◽  
Luminescence Study ◽  
San Andreas ◽  
Electron Backscatter ◽  
Backscatter Diffraction

scholarly journals Low-Velocity Damage Zone on the San Andreas Fault at Depth near SAFOD Site at Parkfield Delineated by Fault-Zone Trapped Waves

2007 ◽  
Vol SpecialIssue ◽  
pp. 73-77 ◽  
Author(s):  
Y.-G. Li ◽  
P. E. Malin ◽  
J. E. Vidal
Keyword(s):  
Fault Zone ◽  
San Andreas Fault ◽  
Damage Zone ◽  
Trapped Waves ◽  
Low Velocity ◽  
San Andreas

No abstract available. <br><br> doi:<a href="http://dx.doi.org/10.2204/iodp.sd.s01.09.2007" target="_blank">10.2204/iodp.sd.s01.09.2007</a>

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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