Nondestructive method for evaluation of electrical parameters of AlGaN/GaN HEMT heterostructures

2013 ◽  
Vol 10 (3) ◽  
pp. 490-493 ◽  
Author(s):  
Bogdan Paszkiewicz ◽  
Mateusz Wosko ◽  
Regina Paszkiewicz ◽  
Marek Tlaczala
Keyword(s):  
Nondestructive Method ◽  
Electrical Parameters ◽  
Gan Hemt

scholarly journals Estudo dos efeitos da dose total ionizante (TID) em um transistor comercial de lata mobilidade de elétrons (HEMT), baseado na hetroestrutura AIGaN/GaN

2020 ◽  
Author(s):  
◽  
A. C. Vilas Bôas
Keyword(s):  
High Electron Mobility Transistor ◽  
Harsh Environments ◽  
Particle Accelerators ◽  
High Electron ◽  
Electrical Characteristics ◽  
Electrical Parameters ◽  
X Ray ◽  
Gan Hemt ◽  
Gan Heterostructure ◽  
Temperature Test

This work presents a systematic study on a commercial high electron mobility transistor based on the AlGaN / GaN heterostructure (GaN HEMT). The study evaluates its robustness to different radiation doses, more specifically, its robustness to the effects of the total ionizing dose (TID) irradiated from an X-ray source with an effective energy of 10 keV. The accumulated dose varies from up to 350 krad (Si). Therefore, for this purpose, three tests were performed on the commercial transistor, GS61008T. First, the acquisition of parameters: threshold voltage (VTH), Transconductance (gm), off current (Ioff) and sub-threshold slope (S) before, during and after exposure to radiation. Then, the switching test, where the rise (tr) and fall (tf) times were aquired, pre and post irradiation, in two diffrent frequency, 100 Hz and 100 kHz. Moreover, the temperature test, where the sample varied from 223 K (-50ºC) to 348 K (75 ºC) to evaluate its robustness for the temperature variation after having accumulated 350 krad (Si). In addition, for a better understanding of the effects of TID on the sample, all tests were performed in two different polarization modes. The on mode (VGS = 3 V and VDS = 0 V), and the off mode (VGS = VDS = 0 V). The characteristic electrical parameters of the transistor were extracted using the characteristic curves IDxVD, IDxVG and IDxt. Curves, that were obtained using National Instrument’s PXI, with programmable sources and an X-ray diffractometer. The results showed that for the devices analyzed, for this GaN COTS the effects resulting from ionizing radiation (TID), with doses up to 350 krad (Si), are minimal, and also showed a quick and effective recovery of their electrical characteristics after annealing at room temperature, especially when irradiated polarized at on mode. Therefore, indicating that they are good candidates for use in harsh environments, as is the case of aerospace environments, particle accelerators environments and nuclear reactors

The Influence Of The Led Luminaires Electrical Parameters On Their Correlated Colour Temperature During Operation Mode

2020 ◽  
pp. 89-96
Author(s):  
Sergei S. Kapitonov ◽  
Alexei S. Vinokurov ◽  
Sergei V. Prytkov ◽  
Sergei Yu. Grigorovich ◽  
Anastasia V. Kapitonova ◽  
...  
Keyword(s):  
Operation Mode ◽  
Light Sources ◽  
Electrical Parameters ◽  
Colour Temperature ◽  
Radiation Spectra ◽  
Service Period ◽  
Close Proximity ◽  
Definition Of ◽  
Comprehensive Study

The article describes the results of comprehensive study aiming at increase of quality of LED luminaires and definition of the nature of changes in their correlated colour temperature (CCT) in the course of operation. Dependences of CCT of LED luminaires with remote and close location of phosphor for 10 thousand hours of operation in different electric modes were obtained; the results of comparison between the initial and final radiation spectra of the luminaires are presented; using mathematical statistics methods, variation of luminaire CCT over the service period claimed by the manufacturer is forecast; the least favourable electric operation modes with the highest CCT variation observed are defined. The obtained results have confirmed availability of the problem of variation of CCT of LED luminaires during their operation. Possible way of its resolution is application of more qualitative and therefore expensive LEDs with close proximity of phosphor or LEDs with remote phosphor. The article may be interesting both for manufacturers and consumers of LED light sources and lighting devices using them.

A Predistortion Diode Linearizer Technique with Automatic Average Power Bias Control for a Class-F GaN HEMT Power Amplifier

2011 ◽  
Vol E94-C (7) ◽  
pp. 1193-1198 ◽  
Author(s):  
Akihiro ANDO ◽  
Yoichiro TAKAYAMA ◽  
Tsuyoshi YOSHIDA ◽  
Ryo ISHIKAWA ◽  
Kazuhiko HONJO
Keyword(s):  
Power Amplifier ◽  
Average Power ◽  
Gan Hemt ◽  
Class F

Thermal Laser Stimulation Technique for AlGaN/GaN HEMT Technologies Improvement

2013 ◽  
Author(s):  
Dominique Carisetti ◽  
Nicolas Sarazin ◽  
Nathalie Labat ◽  
Nathalie Malbert ◽  
Arnaud Curutchet ◽  
...  
Keyword(s):  
Surface States ◽  
Leakage Currents ◽  
Laser Stimulation ◽  
Long Term Stability ◽  
Field Plate ◽  
Gan Hemt ◽  
Die Surface ◽  
Scan Speed ◽  
Stimulation Technique

Abstract To improve the long-term stability of AlGaN/GaN HEMTs, the reduction of gate and drain leakage currents and electrical anomalies at pinch-off is required. As electron transport in these devices is both coupled with traps or surface states interactions and with polarization effects, the identification and localization of the preeminent leakage path is still challenging. This paper demonstrates that thermal laser stimulation (TLS) analysis (OBIRCh, TIVA, XIVA) performed on the die surface are efficient to localize leakage paths in GaN based HEMTs. The first part details specific parameters, such as laser scan speed, scan direction, wavelength, and laser power applied for leakage gate current paths identification. It compares results obtained with Visible_NIR electroluminescence analysis with the ones obtained by the TLS techniques on GaN HEMT structures. The second part describes some failure analysis case studies of AlGaN/GaN HEMT with field plate structure which were successful, thanks to the OBIRCh technique.

Photon Emission Spectral Signatures of AlGaN/GaN HEMT for Functional and Reliability Analysis

2008 ◽  
Author(s):  
Arkadiusz Glowacki ◽  
Christian Boit ◽  
Richard Lossy ◽  
Joachim Würfl
Keyword(s):  
Reliability Analysis ◽  
Gate Voltage ◽  
Near Infrared ◽  
Photon Emission ◽  
Electrical Characterization ◽  
Spectral Signatures ◽  
Operating Modes ◽  
Gan Hemt ◽  
Spectrally Resolved ◽  
Performance Variations

Abstract Non-degraded and degraded AlGaN/GaN HEMT devices have been characterized electrically and investigated in various operating modes using integral and spectrally resolved photon emission (PE). In degraded devices the PE dependence on the gate voltage differs from the non-degraded devices. Various types of dependencies on the gate voltage have been identified when investigating local degradation sites. PE spectroscopy was performed at various bias conditions. For both devices broad spectra have been obtained in a wavelength regime from visible to near-infrared, including local performance variations. Signatures of the degradation have been determined in the electrical characterization, in integral PE distribution and in the PE spectrum.

IR Thermography for Temperature Measurements and Fault Location on AlGaN/GaN HEMTs and MMICs

2015 ◽  
Author(s):  
Lény Baczkowski ◽  
Franck Vouzelaud ◽  
Dominique Carisetti ◽  
Nicolas Sarazin ◽  
Jean-Claude Clément ◽  
...  
Keyword(s):  
Fault Location ◽  
Hot Spot ◽  
Life Time ◽  
High Electron Mobility Transistors ◽  
Junction Temperature ◽  
High Electron ◽  
Ir Thermography ◽  
Operating Life ◽  
Gan Hemt ◽  
Electron Mobility Transistors

Abstract This paper shows a specific approach based on infrared (IR) thermography to face the challenging aspects of thermal measurement, mapping, and failure analysis on AlGaN/GaN high electron-mobility transistors (HEMTs) and MMICs. In the first part of this paper, IR thermography is used for the temperature measurement. Results are compared with 3D thermal simulations (ANSYS) to validate the thermal model of an 8x125pm AIGaN/GaN HEMT on SiC substrate. Measurements at different baseplate temperature are also performed to highlight the non-linearity of the thermal properties of materials. Then, correlations between the junction temperature and the life time are also discussed. In the second part, IR thermography is used for hot spot detection. The interest of the system for defect localization on AIGaN/GaN HEMT technology is presented through two case studies: a high temperature operating life test and a temperature humidity bias test.

Ultrascaled AIN/GaN HEMT Technology for mm-wave RT Applications

2011 ◽  
Author(s):  
Huili G. Xing ◽  
Debdeep Jena
Keyword(s):  
Gan Hemt
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