High-temperature diffusion barriers from Si-rich silicon-nitride

2006 ◽  
Vol 38 (12-13) ◽  
pp. 1687-1691 ◽  
Author(s):  
G. Bilger ◽  
T. Voss ◽  
T. Schlenker ◽  
A. Strohm
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
Diffusion Barriers ◽  
Temperature Diffusion

Evaluation of high-Temperature diffusion barriers for the Pt-Mo system

1988 ◽  
Vol 19 (9) ◽  
pp. 2163-2170 ◽  
Author(s):  
Richard P. Walters ◽  
Bernard S. Covino
Keyword(s):  
High Temperature ◽  
Diffusion Barriers ◽  
Temperature Diffusion

High-temperature diffusion barriers for protective coatings

2004 ◽  
Vol 188-189 ◽  
pp. 153-157 ◽  
Author(s):  
J.A. Haynes ◽  
Y. Zhang ◽  
K.M. Cooley ◽  
L. Walker ◽  
K.S. Reeves ◽  
...  
Keyword(s):  
High Temperature ◽  
Protective Coatings ◽  
Diffusion Barriers ◽  
Temperature Diffusion

Lattice Imaging of Grain Boundaries in Ceramics

1977 ◽  
Vol 35 ◽  
pp. 114-115
Author(s):  
D. R. Clarke ◽  
G. Thomas
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Silicon Nitride ◽  
Grain Boundaries ◽  
High Temperature Strength ◽  
Current Interest ◽  
Lattice Imaging ◽  
Special Significance ◽  
Structural Applications ◽  
Refractory Ceramics

Grain boundaries have long held a special significance to ceramicists. In part, this has been because it has been impossible until now to actually observe the boundaries themselves. Just as important, however, is the fact that the grain boundaries and their environs have a determing influence on both the mechanisms by which powder compaction occurs during fabrication, and on the overall mechanical properties of the material. One area where the grain boundary plays a particularly important role is in the high temperature strength of hot-pressed ceramics. This is a subject of current interest as extensive efforts are being made to develop ceramics, such as silicon nitride alloys, for high temperature structural applications. In this presentation we describe how the techniques of lattice fringe imaging have made it possible to study the grain boundaries in a number of refractory ceramics, and illustrate some of the findings.

TEM Studies of Grain Boundary Films in Si3N4 Ceramics

1991 ◽  
Vol 49 ◽  
pp. 930-931
Author(s):  
H.-J. Kleebe ◽  
J.S. Vetrano ◽  
J. Bruley ◽  
M. Rühle
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Silicon Nitride ◽  
Hot Isostatic Pressing ◽  
Amorphous Film ◽  
Liquid Phase Sintering ◽  
Second Phase ◽  
High Temperature Mechanical Properties ◽  
Triple Points ◽  
Boundary Films

It is expected that silicon nitride based ceramics will be used as high-temperature structural components. Though much progress has been made in both processing techniques and microstructural control, the mechanical properties required have not yet been achieved. It is thought that the high-temperature mechanical properties of Si3N4 are limited largely by the secondary glassy phases present at triple points. These are due to various oxide additives used to promote liquid-phase sintering. Therefore, many attempts have been performed to crystallize these second phase glassy pockets in order to improve high temperature properties. In addition to the glassy or crystallized second phases at triple points a thin amorphous film exists at two-grain junctions. This thin film is found even in silicon nitride formed by hot isostatic pressing (HIPing) without additives. It has been proposed by Clarke that an amorphous film can exist at two-grain junctions with an equilibrium thickness.

Electron Microscopy of Silicon Nitride-Based Ceramics

1991 ◽  
Vol 49 ◽  
pp. 926-927
Author(s):  
Gareth Thomas
Keyword(s):  
Electron Microscopy ◽  
High Temperature ◽  
Silicon Nitride ◽  
World Wide ◽  
Sintering Temperature ◽  
Liquid Phase Sintering ◽  
High Temperature Strength ◽  
Sintering Additives ◽  
Glass Forming ◽  
Dense Product

Silicon nitride and silicon nitride based-ceramics are now well known for their potential as hightemperature structural materials, e.g. in engines. However, as is the case for many ceramics, in order to produce a dense product, sintering additives are utilized which allow liquid-phase sintering to occur; but upon cooling from the sintering temperature residual intergranular phases are formed which can be deleterious to high-temperature strength and oxidation resistance, especially if these phases are nonviscous glasses. Many oxide sintering additives have been utilized in processing attempts world-wide to produce dense creep resistant components using Si3N4 but the problem of controlling intergranular phases requires an understanding of the glass forming and subsequent glass-crystalline transformations that can occur at the grain boundaries.

The reaction of amorphous Ni-Nb films with Si in the presence of a native SiO2 layer

1990 ◽  
Vol 48 (4) ◽  
pp. 664-665
Author(s):  
N. Rozhanski ◽  
A. Barg
Keyword(s):  
High Temperature ◽  
Crystallization Temperature ◽  
Diffusion Barriers ◽  
Sio2 Layer ◽  
Si Substrate ◽  
Cross Sectional ◽  
Plan View ◽  
Temperature Range ◽  
Sputter Deposited

Amorphous Ni-Nb alloys are of potential interest as diffusion barriers for high temperature metallization for VLSI. In the present work amorphous Ni-Nb films were sputter deposited on Si(100) and their interaction with a substrate was studied in the temperature range (200-700)°C. The crystallization of films was observed on the plan-view specimens heated in-situ in Philips-400ST microscope. Cross-sectional objects were prepared to study the structure of interfaces.The crystallization temperature of Ni5 0 Ni5 0 and Ni8 0 Nb2 0 films was found to be equal to 675°C and 525°C correspondingly. The crystallization of Ni5 0 Ni5 0 films is followed by the formation of Ni6Nb7 and Ni3Nb nucleus. Ni8 0Nb2 0 films crystallise with the formation of Ni and Ni3Nb crystals. No interaction of both films with Si substrate was observed on plan-view specimens up to 700°C, that is due to the barrier action of the native SiO2 layer.

Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates

2017 ◽  
Vol 43 (6) ◽  
pp. 5080-5088 ◽  
Author(s):  
Hiroyuki Miyazakia ◽  
Shoji Iwakiri ◽  
Kiyoshi Hirao ◽  
Shinji Fukuda ◽  
Noriya Izu ◽  
...  
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
Crack Formation ◽  
Temperature Cycling ◽  
Active Metal

Polymer-derived silicon nitride aerogels as shape stabilizers for low and high-temperature thermal energy storage

2021 ◽  
Author(s):  
Andrea Zambotti ◽  
Edoardo Caldesi ◽  
Massimo Pelizzari ◽  
Francesco Valentini ◽  
Alessandro Pegoretti ◽  
...  
Keyword(s):  
High Temperature ◽  
Energy Storage ◽  
Silicon Nitride ◽  
Thermal Energy ◽  
Thermal Energy Storage

scholarly journals High Temperature Strength and Whisker/Matrix Interface of β Silicon Nitride Whisker Reinforced 6061 Aluminum Alloy

1992 ◽  
Vol 33 (7) ◽  
pp. 659-668 ◽  
Author(s):  
Katsuaki Suganuma ◽  
Genn Sasaki ◽  
Teruaki Fujita ◽  
Mitsuhiro Tokuse
Keyword(s):  
Aluminum Alloy ◽  
High Temperature ◽  
Silicon Nitride ◽  
High Temperature Strength ◽  
Matrix Interface ◽  
6061 Aluminum Alloy
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