POD based computation of Joint Interface Modes

2011 ◽  
pp. 19-28 ◽  
Author(s):  
Wolfgang Witteveen ◽  
Karim Sherif
Keyword(s):  
Joint Interface

Influence of surface roughness, friction coefficient, and wrap angle on clinching joint strength and its correlation with belt friction phenomenon

2021 ◽  
pp. 135065012110253
Author(s):  
Santosh Kumar ◽  
Vimal Edachery ◽  
Swamybabu Velpula ◽  
Avinash Govindaraju ◽  
Sounak K. Choudhury ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Friction Coefficient ◽  
Joint Strength ◽  
Joint Interface ◽  
Cross Sectional ◽  
Lap Shear ◽  
Mathematical Correlation ◽  
Mechanical Clinching ◽  
Wrap Angle

Clinching is an economical sheet joining technique that does not require any consumables. Besides, after its usage, the joints can be recycled without much difficulty, making clinching one of the most sustainable and eco-friendly manufacturing processes and a topic of high research potential. In this work, the influence of surface roughness on the load-bearing capacity (strength) of joints made by the mechanical clinching method in cross-tensile and lap-shear configuration is explored. Additionally, a correlating mathematical model is established between the joint strength and its surface parameters, namely, friction coefficient and wrap angle, based on the belt friction phenomenon. This correlation also explains the generally observed higher strength in lap-shear configuration compared to cross-tensile in clinching joints. From the mathematical correlation, through friction by increasing the average surface roughness, it is possible to increase the strength of the joint. The quality of the thus produced joint is analyzed by cross-sectional examination and comparison with simulation results. Experimentally, it is shown that an increment of >50% in the joint strength is achieved in lap-shear configuration by modifying the surface roughness and increasing the friction coefficient at the joint interface. Further, the same surface modification does not significantly affect the strength in cross-tensile configuration.

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021 ◽  
pp. 095440542098823
Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri
Keyword(s):  
Liquid Phase ◽  
Mechanical Test ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Joint Interface ◽  
Test Results ◽  
X Ray Diffraction ◽  
X Ray ◽  
Metallic Particles ◽  
Powder Interlayer

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

scholarly journals Finite Element Modeling of Residual Stress at Joint Interface of Titanium Alloy and 17-4PH Stainless Steel

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 629
Author(s):  
Nana Kwabena Adomako ◽  
Sung Hoon Kim ◽  
Ji Hong Yoon ◽  
Se-Hwan Lee ◽  
Jeoung Han Kim
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Stainless Steel ◽  
Finite Element Modeling ◽  
Equivalent Stress ◽  
Stress Gradient ◽  
Joint Interface ◽  
Element Modeling ◽  
Actual Experiment ◽  
Maximum Equivalent Stress

Residual stress is a crucial element in determining the integrity of parts and lifetime of additively manufactured structures. In stainless steel and Ti-6Al-4V fabricated joints, residual stress causes cracking and delamination of the brittle intermetallic joint interface. Knowledge of the degree of residual stress at the joint interface is, therefore, important; however, the available information is limited owing to the joint’s brittle nature and its high failure susceptibility. In this study, the residual stress distribution during the deposition of 17-4PH stainless steel on Ti-6Al-4V alloy was predicted using Simufact additive software based on the finite element modeling technique. A sharp stress gradient was revealed at the joint interface, with compressive stress on the Ti-6Al-4V side and tensile stress on the 17-4PH side. This distribution is attributed to the large difference in the coefficients of thermal expansion of the two metals. The 17-4PH side exhibited maximum equivalent stress of 500 MPa, which was twice that of the Ti-6Al-4V side (240 MPa). This showed good correlation with the thermal residual stress calculations of the alloys. The thermal history predicted via simulation at the joint interface was within the temperature range of 368–477 °C and was highly congruent with that obtained in the actual experiment, approximately 300–450 °C. In the actual experiment, joint delamination occurred, ascribable to the residual stress accumulation and multiple additive manufacturing (AM) thermal cycles on the brittle FeTi and Fe2Ti intermetallic joint interface. The build deflected to the side at an angle of 0.708° after the simulation. This study could serve as a valid reference for engineers to understand the residual stress development in 17-4PH and Ti-6Al-4V joints fabricated with AM.

Effect of Creep on the Residual Stresses in Tube-to-Tubesheet Joints

2010 ◽  
Author(s):  
Nor Eddine Laghzale ◽  
Abdel-Hakim Bouzid
Keyword(s):  
Contact Pressure ◽  
Analytical Model ◽  
Nuclear Power ◽  
Structural Integrity ◽  
Environmental Safety ◽  
Maintenance Cost ◽  
Joint Interface ◽  
Plant Safety ◽  
Material Creep ◽  
Nuclear Power Plant Safety

Steam generators are the subject of major concern in nuclear power plant safety. Within these generators, in addition to the structural integrity, the gross tightness barrier, which separates the primary and secondary circuits, is primarily ensured by the presence of a residual contact pressure at the tube-to-tubesheet joint interface. Any leakage is unacceptable, and its consequences are very heavy in terms of the human and environmental safety as well as maintenance cost. Some studies have been conducted to understand the main reasons for such a failure. However, no analytical model able to predict the attenuation of the residual contact pressure under the effect of material creep relaxation behavior. The development of a simple analytical model able to predict the change of the residual contact pressure as a function of time is laid out in this paper. The results from the analytical model are checked and compared with those of finite elements.

scholarly journals The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 518 ◽  
Author(s):  
Congcong Cao ◽  
Keke Zhang ◽  
Baojin Shi ◽  
Huigai Wang ◽  
Di Zhao ◽  
...  
Keyword(s):  
Shear Strength ◽  
Fracture Mechanism ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Joint Interface ◽  
Interface Microstructure ◽  
Average Thickness ◽  
Thermal Cycles ◽  
Initial State ◽  
Cycle Loading

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

Comparative Study of Copper Brazing with Ag-Cu-Zn and Ag-Cu-P Filler in Heat Treatment Furnace

2014 ◽  
Vol 937 ◽  
pp. 154-157 ◽  
Author(s):  
Rong Wang ◽  
Ya Juan Jin
Keyword(s):  
Heat Treatment ◽  
Eutectic Structure ◽  
Copper Surface ◽  
Joint Interface ◽  
Heat Treatment Furnace ◽  
Wetting Ability ◽  
Treatment Furnace ◽  
Brazed Joints ◽  
And Diffusion ◽  
Better Than

Wetting and spreading ability of Ag-Cu-Zn filler and Ag-Cu-P filler on copper surface under heat treatment furnace was studied. The microstructures of brazed joints of Ag-Cu-Zn and Ag-Cu-P filler under the same parameter were also observed. The microstructure shows that the wetting ability of Ag-Cu-Zn filler on the copper surface is better than Ag-Cu-P and its structure is uniformed and regulated. It is founded that there were obvious dissolution and diffusion between base metal and filler for the copper/Ag-Cu-Zn/copper joint, there were white and black eutectic structure formed in the joint interface.

Kinetics-Based Modeling of Bond-Metal Dissolution and IMC During Soldering

2006 ◽  
Author(s):  
Mohammad Faizan ◽  
Guo-X. Wang
Keyword(s):  
Intermetallic Phase ◽  
Molten Solder ◽  
Lead Free ◽  
Joint Interface ◽  
Environment Friendly ◽  
Soldering Process ◽  
Substrate Dissolution ◽  
Soldering Reaction ◽  
Lead Free Solders ◽  
Kinetics Of

Soldering has become an indispensable joining process in the electronic packaging industry. The industry is aiming for the use of environment friendly lead-free solders. All the lead-free solders are high tin-containing alloys. During the soldering process, an intense interaction of metallization on PCB and tin from the solder occurs at the metallization/solder interface. Intermetallic compound (IMC) is formed at the interface and subsequently PCB bond-metal (substrate) is dissolved into the molten solder. In the present study the terms bond-metal and substrate will be used interchangeably and the term 'substrate' refers to the top layer of the PCB which comes in contact with the molten solder during soldering reaction. Thickness of the intermetallic phase formed at the joint interface and amount of substrate lost is critical in achieving reliable solder joints. During the wet phase of soldering process, the IMC does not grow as layered structure; rather it takes the shape of scallops. The growth of scalloped IMC during the solder/substrate interaction entails complicated physics. Understanding of the actual kinetics involved in the formation of IMC phase is important in controlling the process to achieve desired results. This paper presents theoretical analysis of the kinetics involved in the formation of the scalloped intermetallic phase. The intermetallic phase growth is experimentally investigated to support the underlying kinetics of the process. Numerical model has been suggested to translate the physics of the process. The model is based on the basic mass diffusion equations and can predict the substrate dissolution and IMC thickness as a function of soldering time.

Enhancement of composite scarf joint interface strength through carbon nanotube reinforcement

2008 ◽  
Vol 43 (20) ◽  
pp. 6695-6703 ◽  
Author(s):  
Y. W. Kwon ◽  
R. Slaff ◽  
S. Bartlett ◽  
T. Greene
Keyword(s):  
Carbon Nanotube ◽  
Interface Strength ◽  
Joint Interface ◽  
Scarf Joint

Energy Balancing Method to Identify Nonlinear Damping of Bolted-Joint Interface

2016 ◽  
Vol 693 ◽  
pp. 318-323 ◽  
Author(s):  
Xin Liao ◽  
Jian Run Zhang
Keyword(s):  
Dry Friction ◽  
Harmonic Excitation ◽  
Joint Interface ◽  
Damping Factor ◽  
Viscous Damping ◽  
Bolted Joint ◽  
Energy Balancing ◽  
Stick Slip ◽  
Non Linear ◽  
Linear Damping

The interface of bolted joint commonly focuses on the research of non-linear damping and stiffness, which affect structural response. In the article, the non-linear damping model of bolted-joint interface is built, consisting of viscous damping and Coulomb friction. Energy balancing method is developed to identify the dry-friction parameter and viscous damping factor. The corresponding estimation equations are acquired when the input is harmonic excitation. Then, the vibration experiments with different bolted preloads are conducted, from which amplitudes in various input levels are used to work out the interface parameters. Also, the fitting curves of dry-friction parameters are also obtained. Finally, the results illustrate that the most interface of bolted joint in lower excitation levels occurs stick-slip motion, and the feasibility of the identification approach is demonstrated.

scholarly journals Publisher Correction to: Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface

2018 ◽  
Vol 62 (5) ◽  
pp. 1119-1119
Author(s):  
Šimeková Beáta ◽  
Hodúlová Erika ◽  
Kovaříková Ingrid
Keyword(s):  
Microstructural Characterization ◽  
Joint Interface
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