Optimization of Deposition Parameters of a DLC Layer Using (RF) PECVD Technology
Keyword(s):
1972 ◽
Vol 30
◽
pp. 492-493
1972 ◽
Vol 30
◽
pp. 512-513
1991 ◽
Vol 49
◽
pp. 1068-1069
High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes)
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2015 ◽
Vol 19
(2)
◽
pp. 105-112
High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes)
◽
2015 ◽
Vol 19
(2)
◽
pp. 179-187
◽
2006 ◽
Vol 514-516
◽
pp. 475-482
◽
Keyword(s):
Keyword(s):