Investigation of Titanium as Thin Film Deposited Material Thereon Effect on Mechanical Properties

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.

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Optical, electrical and mechanical properties of TiN thin film obtained from a TiO2 sol-gel coating and rapid thermal nitridation

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2021.127089 ◽

2021 ◽

pp. 127089

Author(s):

Arnaud Valour ◽

Maria Alejandra Usuga Higuita ◽

Gaylord Guillonneau ◽

Nicolas Crespo-Monteiro ◽

Damien Jamon ◽

...

Keyword(s):

Thin Film ◽

Mechanical Properties ◽

Sol Gel ◽

Tio2 Sol ◽

Thermal Nitridation

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The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

MRS Proceedings ◽

10.1557/proc-766-e8.10 ◽

2003 ◽

Vol 766 ◽

Cited By ~ 7

Author(s):

Jin-Heong Yim ◽

Jung-Bae Kim ◽

Hyun-Dam Jeong ◽

Yi-Yeoul Lyu ◽

Sang Kook Mah ◽

...

Keyword(s):

Thin Film ◽

Mechanical Properties ◽

Dielectric Constant ◽

Pore Structure ◽

Pore Diameter ◽

Dielectric Films ◽

Low Dielectric Constant ◽

Cyclodextrin Derivatives ◽

Low Dielectric ◽

Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

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Natural aging of Ni60Nb40 metallic glass thin film: Evolution of microstructure and mechanical properties

Vacuum ◽

10.1016/j.vacuum.2021.110441 ◽

2021 ◽

pp. 110441

Author(s):

M. Li ◽

D.H. Lu ◽

J. Tan ◽

L. Chen

Keyword(s):

Thin Film ◽

Mechanical Properties ◽

Metallic Glass ◽

Natural Aging ◽

Microstructure And Mechanical Properties ◽

Evolution Of Microstructure

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Measurements of Residual Stress in the Layers of Thin Film Micro-Gas Sensors

MRS Proceedings ◽

10.1557/proc-657-ee5.19 ◽

2000 ◽

Vol 657 ◽

Author(s):

Youngman Kim ◽

Sung-Ho Choo

Keyword(s):

Thin Film ◽

Mechanical Properties ◽

Residual Stress ◽

Gas Sensor ◽

Gas Sensors ◽

Micro Gas Sensor ◽

Thin Film Layer ◽

Film Layer ◽

The Difference ◽

Stress States

ABSTRACTThe mechanical properties of thin film materials are known to be different from those of bulk materials, which are generally overlooked in practice. The difference in mechanical properties can be misleading in the estimation of residual stress states in micro-gas sensors with multi-layer structures during manufacturing and in service.In this study the residual stress of each film layer in a micro-gas sensor was measured according to the five difference sets of film stacking structure used for the sensor. The Pt thin film layer was found to have the highest tensile residual stress, which may affect the reliability of the micro-gas sensor. For the Pt layer the changes in residual stress were measured as a function of processing variables and thermal cycling.

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Measurement of Young's Modulus and Poisson's Ratio of Thin Film by Combination of Bulge Test and Nano-Indentation

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.33-37.969 ◽

2008 ◽

Vol 33-37 ◽

pp. 969-974 ◽

Cited By ~ 1

Author(s):

Bong Bu Jung ◽

Seong Hyun Ko ◽

Hun Kee Lee ◽

Hyun Chul Park

Keyword(s):

Thin Film ◽

Mechanical Properties ◽

Young’S Modulus ◽

Poisson’S Ratio ◽

Young's Modulus ◽

Applied Pressure ◽

Indentation Test ◽

Poisson's Ratio ◽

Bulge Test ◽

Nano Indentation

This paper will discuss two different techniques to measure mechanical properties of thin film, bulge test and nano-indentation test. In the bulge test, uniform pressure applies to one side of thin film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as the elastic modulus and the residual stress. Nano-indentation measurements are accomplished by pushing the indenter tip into a sample and then withdrawing it, recording the force required as a function of position. . In this study, modified King’s model can be used to estimate the mechanical properties of the thin film in order to avoid the effect of substrates. Both techniques can be used to determine Young’s modulus or Poisson’s ratio, but in both cases knowledge of the other variables is needed. However, the mathematical relationship between the modulus and Poisson's ratio is different for the two experimental techniques. Hence, achieving agreement between the techniques means that the modulus and Poisson’s ratio and Young’s modulus of thin films can be determined with no a priori knowledge of either.

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Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films

Journal of Materials Research ◽

10.1557/jmr.1988.0931 ◽

1988 ◽

Vol 3 (5) ◽

pp. 931-942 ◽

Cited By ~ 300

Author(s):

T. P. Weihs ◽

S. Hong ◽

J. C. Bravman ◽

W. D. Nix

Keyword(s):

Thin Film ◽

Thin Films ◽

Mechanical Properties ◽

Single Layer ◽

Beam Theory ◽

New Technique ◽

Young’S Moduli ◽

Silicon Micromachining ◽

A New Technique

The mechanical deflection of cantilever microbeams is presented as a new technique for testing the mechanical properties of thin films. Single-layer microbeams of Au and SiO2 have been fabricated using conventional silicon micromachining techniques. Typical thickness, width, and length dimensions of the beams are 1.0,20, and 30 μm, respectively. The beams are mechanically deflected by a Nanoindenter, a submicron indentation instrument that continuously monitors load and deflection. Using simple beam theory and the load-deflection data, the Young's moduli and the yield strengths of thin-film materials that comprise the beams are determined. The measured mechanical properties are compared to those obtained by indenting similar thin films supported by their substrate.

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