Epitaxial gallium nitride thin films grown on silicon substrates utilizing gallium nitride seed-layer formed by liquid source precursor

2011 ◽  
Vol 29 (1) ◽  
pp. 130-133 ◽  
Author(s):  
Ky Nam Hoang ◽  
Hong Tak Kim ◽  
Woosuk Jun ◽  
Chinho Park
1999 ◽  
Vol 572 ◽  
Author(s):  
C. M. Lueng ◽  
H. L. W. Chan ◽  
W. K. Fong ◽  
C. Surya ◽  
C. L. Choy

ABSTRACTAluminum nitride (AlN) and gallium nitride (GaN) thin films have potential uses in high temperature, high frequency (e.g. microwave) acoustic devices. In this work, the piezoelectric coefficients of wurtzite AlN and GaN/AlN composite film grown on silicon substrates by molecular beam epitaxy were measured by a Mach-Zehnder type heterodyne interferometer. The effects of the substrate on the measured coefficients are discussed.


2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.


2020 ◽  
Vol 15 (2) ◽  
pp. 169-174
Author(s):  
Yu. V. Khrapovitskaya ◽  
M. Y. Chernykh ◽  
I. S. Ezubchenko ◽  
Yu. V. Grishchenko ◽  
I. O. Mayboroda ◽  
...  

2016 ◽  
Vol 42 (13) ◽  
pp. 14788-14792 ◽  
Author(s):  
Y.L. Zhang ◽  
W.L. Li ◽  
W.P. Cao ◽  
T.D. Zhang ◽  
T.R.G.L. Bai ◽  
...  

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Jose Recatala-Gomez ◽  
Pawan Kumar ◽  
Ady Suwardi ◽  
Anas Abutaha ◽  
Iris Nandhakumar ◽  
...  

Abstract The best known thermoelectric material for near room temperature heat-to-electricity conversion is bismuth telluride. Amongst the possible fabrication techniques, electrodeposition has attracted attention due to its simplicity and low cost. However, the measurement of the thermoelectric properties of electrodeposited films is challenging because of the conducting seed layer underneath the film. Here, we develop a method to directly measure the thermoelectric properties of electrodeposited bismuth telluride thin films, grown on indium tin oxide. Using this technique, the temperature dependent thermoelectric properties (Seebeck coefficient and electrical conductivity) of electrodeposited thin films have been measured down to 100 K. A parallel resistor model is employed to discern the signal of the film from the signal of the seed layer and the data are carefully analysed and contextualized with literature. Our analysis demonstrates that the thermoelectric properties of electrodeposited films can be accurately evaluated without inflicting any damage to the films.


2000 ◽  
Vol 29 (3) ◽  
pp. 306-310 ◽  
Author(s):  
Thomas Gehrke ◽  
Kevin J. Linthicum ◽  
Edward Preble ◽  
Pradeep Rajagopal ◽  
Carsten Ronning ◽  
...  

1997 ◽  
Vol 481 ◽  
Author(s):  
Patrick L. Smith ◽  
Richard Ortega ◽  
Bill Brennan

ABSTRACTThe formation of TiSi2 thin films using the SALICIDE process on doped and undoped silicon substrates was studied. XRD TEM, AES, RBS and four probe Rs were used to characterize the material. Unit cell parameters and energetics were determined. Results confirm electrical and chemical signatures consistent with the known C49 conversion to C54. However, XRD indicated a structurally different intermediate phase occurs during the C49 to C54 transformation. Modeling was performed based on C11b structure (14/mmm) type, with the Ti and Si atoms arranged similarly to those in MoSi2. The unit cell was determined to be a = 4.428 Å, b = 4.779 Å, c = 9.078 Å with a Fmmm space group and total pseudo-potential plane wave calculations based on crystallographic simulations of −103.96 ev/Atom.


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