Microstructure Optimization and Comprehensive Property Improvement of Al-4.47Zn-2.13Mg-1.2Cu Alloy by Non-isothermal Aging Treatment

JOM ◽  
2019 ◽  
Vol 72 (4) ◽  
pp. 1540-1551 ◽  
Author(s):  
X. Y. Liu ◽  
C. C. Wang ◽  
X. Wang ◽  
Z. J. Zhao ◽  
M. Wu ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Aging Treatment ◽  
Comprehensive Property ◽  
Isothermal Aging Treatment

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging

2006 ◽  
Vol 15-17 ◽  
pp. 1001-1007 ◽  
Author(s):  
Jeong Won Yoon ◽  
Seung Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Interfacial Reaction ◽  
Isothermal Aging ◽  
Aging Treatment ◽  
Interfacial Reactions ◽  
The Other ◽  
Other Hand ◽  
Electroless Ni ◽  
Isothermal Aging Treatment

The interaction between Cu/Sn-Ag and Sn-Ag/Ni interfacial reactions has been studied during isothermal aging at 150°C for up to 1000h using a Cu/Sn-3.5Ag/ENIG sandwich solder joint. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing. On the other hand, a (Cu,Ni)6Sn5 IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the (Cu,Ni)6Sn5 IMC layer formed on the Ni side has to be contributed from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the (Cu,Ni)6Sn5 IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment at 150°C was performed, any Ni was not detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the (Cu,Ni)6Sn5 IMC layer of the Cu/Sn-Ag/ENIG sandwich joint retarded effectively the consumption of the Ni from the electroless Ni-P layer.

Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

2008 ◽  
Vol 580-582 ◽  
pp. 239-242
Author(s):  
Fang Jie Cheng ◽  
Hiroshi Nishikawa ◽  
Tadashi Takemoto
Keyword(s):  
Isothermal Aging ◽  
Solder Matrix ◽  
Aging Treatment ◽  
Fracture Pattern ◽  
Tensile Behavior ◽  
Test Results ◽  
Sac305 Solder ◽  
Microstructural Coarsening ◽  
Notable Increase ◽  
Cast Condition

Effects of isothermal aging on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu-0.2Co (SAC305-0.2Co) solder was explored, and compared with the standard Sn-3.0Ag-0.5Cu (SAC305) solder. The addition of Co resulted in the formation of CoSn2 phase in SAC305-0.2Co solder matrix. The isothermal aging treatment induced microstructural coarsening for both solders. With aging, the eutectic network has been translated into block or granular shape particles. Meanwhile, the outline of the primary Sn phase became less distinct. The tensile test results indicated, under as cast condition, the Co had little effect on the ultimate tensile strength (UTS) of SAC305-0.2Co solder, whereas it suppressed the ductility. After aging, the UTS of SAC305 was obviously decreased, whereas the elongation hardly changed. For the SAC305-0.2Co, the tensile behavior showed two trends: one was the decrease of the UTS, which was similar to that of SAC305; the other was the notable increase of elongation. The examination of the fracture surfaces indicated that isothermal aging could alter the fracture pattern of SAC305-0.2Co solder from brittle to ductile.

Effect of Nickel Doping on Interfacial Reaction between Lead-Free Solder and Ni-P Substrate

2012 ◽  
Vol 488-489 ◽  
pp. 1375-1379 ◽  
Author(s):  
O. Saliza Azlina ◽  
A. Ourdjini ◽  
I. Siti Rabiatull Aisha
Keyword(s):  
Isothermal Aging ◽  
Environmental Concern ◽  
Aging Treatment ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Soldering ◽  
Nickel Doping ◽  
Free Solder ◽  
Sac Solder

Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and Sn-3.0Ag-0.5Cu-0.05Ni (SACN30505) on electroless nickel/ immersion palladium/immersion gold (ENEPIG) surface finish. The substrates were subjected to isothermal aging at 125°C for up to 2000 hours with solder size diameter of 500μm. The results indicated that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment a new IMC was formed between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Moreover, after soldering and isothermal aging, Ni-doped (SACN) solder represents a thicker IMC compared to SAC solder. Aging time of solder joints results in an increase of IMC’s thickness and changes their morphologies to become more spherical, dense and with larger grain size. In addition, the results also revealed that the thickness of intermetallics formed is proportional to the aging duration.

Effects of Isothermal Aging on Microstructure Evolution of Biomedical Co-Cr-Mo Alloy

2015 ◽  
Vol 658 ◽  
pp. 31-35 ◽  
Author(s):  
Pitak Khaimanee ◽  
Paiboon Choungthong ◽  
Vitoon Uthaisangsuk
Keyword(s):  
Aging Time ◽  
Isothermal Aging ◽  
Aging Treatment ◽  
Hardness Test ◽  
Orthopedic Implants ◽  
Phase Fraction ◽  
X Ray Diffraction ◽  
X Ray ◽  
Heat Treated ◽  
Microstructure Examination

Cobalt based alloys have been widely used in orthopedic implants. These alloys are an allotropic metal, which commonly exhibits two crystal structures, namely, FCC and HCP lattice. In this work, developed microstructure and hardness of a Co-Cr-Mo alloy after isothermal aging treatment were investigated. The applied aging procedure included soaking at the temperature of 850°C for five different holding times of 1, 3, 6, 9 and 12 h with subsequent water quenching. Microstructure examination, X-ray diffraction analysis and micro-hardness test were carried out for both as-received and heat-treated cobalt based alloys. The results showed that the FCC to HCP phase transformation occurred during the isothermal aging. It was observed that phase fraction of the identified HCP phase increased with longer aging time. Microstructure of the samples aged for 12 h showed very fine lamellae morphologies similar to a pearlitic structure with different orientations within each FCC grain. Apparently, these occurred lamellae structures could be well correlated with the formation of the HCP martensite. Additionally, it was found that in the Co-Cr-Mo alloy sigma phase precipitated early at the grain boundaries and further grew along these boundaries by increasing aging time. The hardness value of the examined alloy slightly increased with larger HCP phase fraction. The increased aging time certainly led to higher amount of the HCP martensite and consequently increased hardness and possible wear resistance properties.

Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

2011 ◽  
Vol 415-417 ◽  
pp. 1181-1185 ◽  
Author(s):  
Osman Saliza Azlina ◽  
Ali Ourdjini ◽  
Siti Rabiatull Aisha Idris ◽  
Mohd Ariff Azmah Hanim
Keyword(s):  
Isothermal Aging ◽  
Aging Treatment ◽  
Electroless Nickel ◽  
Lead Free ◽  
Green Product ◽  
Hazardous Substance ◽  
Lead Free Solder ◽  
Reflow Soldering ◽  
Packaging Industry ◽  
Free Solder

In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this requirement. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and electroless nickel/ immersion palladium/immersion gold (ENEPIG). Reliability of solder joint is also examined by performing solid state isothermal aging at 125°C and 150°C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time and temperature of solder joints results in an increase of IMC’s thickness and changes their morphologies to become more spherical, dense and with larger grain size. In addition, the results also revealed that the thickness of intermetallics formed is proportional to the aging duration and temperature.

scholarly journals Influence of Aging Treatment on Microstructure and Tensile Properties of a Hot Deformed UNS S32750 Super Duplex Stainless Steel (SDSS) Alloy

Metals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 353 ◽  
Author(s):  
Elisabeta Mirela Cojocaru ◽  
Doina Raducanu ◽  
Anna Nocivin ◽  
Ion Cinca ◽  
Adrian Nicolae Vintila ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Stainless Steel ◽  
Duplex Stainless Steel ◽  
Isothermal Aging ◽  
Electron Backscatter Diffraction ◽  
Aging Treatment ◽  
Impact Testing ◽  
Super Duplex Stainless Steel ◽  
Δ Phase ◽  
Backscatter Diffraction

In this present study, the influence of isothermal aging temperature and duration on microstructural and mechanical properties of a hot-deformed UNS S32750 super duplex stainless steel (SDSS) alloy was investigated by SEM-EBSD (scanning electron microscopy-electron backscatter diffraction) and tensile testing techniques. An isothermal aging treatment, at temperatures between 400 and 600 °C and treatment duration between 3 and 120 h, was applied to a commercial UNS S32750 SDSS alloy. Microstructural characteristics of all thermomechanical (TM) processed states, such as distribution and morphology of constituent phases, grain’s modal orientation (MO), and obtained mechanical properties were analysed correlated with the TM processing conditions. The obtained experimental results show that the constituent phases, in all TM processed states, are represented by elongated γ-phase grains within the δ-phase matrix. The R-phase was observed in the case of aging treatment performed at 600 °C for 120 h. Within the δ-phase matrix, dynamically recrystallized grains were identified as a result of applying hot deformation and isothermal aging treatments. Also, it was observed that aging treatment parameters can significantly influence the mechanical behaviour exhibited by the UNS S32750 SDSS alloy, in terms of elongation to fracture and absorbed energy during impact testing.

Effect of Prior Deformation on Properties of Cu-Cr-RE Alloys

2011 ◽  
Vol 239-242 ◽  
pp. 1253-1259
Author(s):  
Zheng Hua Guo ◽  
Ge Wang Shuai ◽  
Ping Fang
Keyword(s):  
Electrical Conductivity ◽  
Rare Earth ◽  
Rare Earth Elements ◽  
Isothermal Aging ◽  
Aging Treatment ◽  
Alloying Element ◽  
Pinning Effect ◽  
Solution Treated ◽  
Rare Earth Intermetallic Compounds ◽  
Rare Earth Intermetallic

The variations of hardness and electrical conductivity of a deformed supersaturated Cu-Cr alloy have been investigated during isothermal aging. The influence of trace rare earth elements (La, Y or Nd) as a second alloying element was also studied. The results showed that the heavily deformed alloys exhibited an instant increase in both hardness and electrical conductivity due to an accelerated precipitation after a short aging treatment. Compared with the solution treated Cu-0.8wt %Cr-0.05wt. %La and Cu-0.8wt %Cr-0.05wt. %Y alloy, the as-cast Cu-0.8 wt. %Cr-0.05 wt. %Nd exhibited a retarded recrystallization which should be attributed to the pinning effect of primary Cr precipitates lying in the grain boundaries. Rare earth elements can act as a useful second alloying element to inhibit recrystallization of the deformed alloys due to the occurrence of some copper-rare earth intermetallic compounds and rare earth oxides.

Analysis of Phase Transformation Kinetics by Intrinsic Stress Evolutions During the Isothermal Aging of Amorphous Ni(P) and Sn/Ni(P) Films

2004 ◽  
Vol 19 (4) ◽  
pp. 1257-1264 ◽  
Author(s):  
J.Y. Song ◽  
Jin Yu ◽  
T.Y. Lee
Keyword(s):  
Phase Transformation ◽  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Early Stage ◽  
Interface Reaction ◽  
Aging Treatment ◽  
In Situ Stress ◽  
Intrinsic Stress ◽  
Stress Changes

The kinetics for the crystallization of amorphous Ni(P) films and the formation of intermetallic compounds in Sn/Ni(P) films during isothermal aging treatment were studied with in situ intrinsic stress measurements. The intrinsic stress changes from crystallization were about 200 and 150 MPa for Ni(14P) and Ni(11.7P) films, respectively, and according to Johnson–Mehl–Avrami analysis, the Avrami exponents were about 3.6 ± 0.46 and 4.2 ± 0.39, and the activation energies were 242 and240 kJ/mol, respectively, for the crystallization of Ni(14P) and Ni(11.7P) films. The stress due to the formation of intermetallic compounds such as Ni3Sn4 and Ni3P in Sn/Ni(11.7P) films was about 320 MPa. Application of in situ stress measurementsto the empirical growth model during isothermal phase transformation of Sn/Ni(P) showed that the intermetallic compounds growth was interface reaction-controlled (n = 0.91 ± 0.08) in the early stage and then became diffusion-controlled (n =0.38 ± 0.01), and the activation energy was about 35.9 kJ/mol.

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