scholarly journals Image smoothing based on global sparsity decomposition and a variable parameter

2021 ◽  
Author(s):  
Xiang Ma ◽  
Xuemei Li ◽  
Yuanfeng Zhou ◽  
Caiming Zhang
Keyword(s):  
Removal Rate ◽  
Variable Parameter ◽  
Smoothing Parameter ◽  
Smoothing Effect ◽  
Image Smoothing ◽  
Sparse Decomposition ◽  
Alternating Direction ◽  
Texture Removal ◽  
Ideal Algorithm ◽  
Better Than

AbstractSmoothing images, especially with rich texture, is an important problem in computer vision. Obtaining an ideal result is difficult due to complexity, irregularity, and anisotropicity of the texture. Besides, some properties are shared by the texture and the structure in an image. It is a hard compromise to retain structure and simultaneously remove texture. To create an ideal algorithm for image smoothing, we face three problems. For images with rich textures, the smoothing effect should be enhanced. We should overcome inconsistency of smoothing results in different parts of the image. It is necessary to create a method to evaluate the smoothing effect. We apply texture pre-removal based on global sparse decomposition with a variable smoothing parameter to solve the first two problems. A parametric surface constructed by an improved Bessel method is used to determine the smoothing parameter. Three evaluation measures: edge integrity rate, texture removal rate, and gradient value distribution are proposed to cope with the third problem. We use the alternating direction method of multipliers to complete the whole algorithm and obtain the results. Experiments show that our algorithm is better than existing algorithms both visually and quantitatively. We also demonstrate our method’s ability in other applications such as clip-art compression artifact removal and content-aware image manipulation.

Screening of Coagulant for Washing Wastewater Treatment

2015 ◽  
Vol 1092-1093 ◽  
pp. 972-975
Author(s):  
Jing Yang
Keyword(s):  
Wastewater Treatment ◽  
Removal Rate ◽  
Experimental Results ◽  
The Other ◽  
Aluminium Chloride ◽  
Coagulation Tests ◽  
Cyclic Utilization ◽  
Washing Wastewater ◽  
Better Than

According to the problems exist in cyclic utilization of washing wastewater, the coagulation tests utilizing ferric trichloride (FeCl3), alums, poly aluminium chloride (PAC) and polyacrylamide (PAM) are studied, respectively. Experimental results show that PAC was much better than the other coagulants in the removal of LAS and chroma as a single coagulant. Cast 2.5mL PAC(10%) into quantitative washing wastewater, the removal rate of LAS and chroma reach 82.5% and 87.8%, respectively. When mix the every two kinds of coagulants, maintaining the same total amount of coagulant to 2.5mL, cast1.0mL PAC(10%) and 1.5mL alum (10%) into washing wastewater ,the removal rate of LAS and chroma reach 84.1% and 90.0%, respectively.

Effect of the Al2O3 powder addition on the metal removal rate and the surface roughness of the electrochemical grinding machining

2020 ◽  
Vol 234 (12) ◽  
pp. 1538-1548 ◽  
Author(s):  
Hossam M Yehia ◽  
Mohamed Hakim ◽  
Ahmed El-Assal
Keyword(s):  
Surface Roughness ◽  
Metal Removal ◽  
Removal Rate ◽  
Lower Surface ◽  
Maximum Effect ◽  
Metal Removal Rate ◽  
Powder Addition ◽  
Different Depths ◽  
Electrochemical Grinding ◽  
Better Than

The integrated electrochemical grinding machining has received wide acceptance in the aircraft turbine industry for the machining of blades, vanes, and honeycomb seal rings. Also, medical devices, instruments and forceps, shells, precision nozzles, instrument coupling, and air rotor motors that produced from stainless steel and new materials have all successfully been accomplished with electrochemical grinding. To improve the metal removal rate and to reduce the surface roughness ( Ra) of the electrochemical grinding at high voltages, an integration between the alumina abrasive jet and the electrochemical grinding machining has been performed. The effect of the Al2O3 abrasive content on the metal removal rate and the Ra of the K110 alloy steel using Everite electrochemical grinding 618 at different voltages, different feed rates, different electrolyte NaCl concentrations, and different depths of the cut were successfully investigated. The results revealed that the abrasive electrochemical grinding was better than the electrochemical grinding results. The maximum effect of the Al2O3 on the metal removal rate was achieved at 5 wt.%. The current density in the machining gap was affected by the addition of the Al2O3, where it was decreased at percentages over 5-wt.% Al2O3. The abrasive electrochemical grinding resulted in lower surface roughness than the electrochemical grinding process.

scholarly journals The removal of Rhodamine B by H2O2 or ClO2 combined with hydrodynamic cavitation

2019 ◽  
Vol 80 (8) ◽  
pp. 1571-1580
Author(s):  
Kun Wang ◽  
Ri-ya Jin ◽  
Yi-na Qiao ◽  
Zeng-di He ◽  
Ying Wang ◽  
...  
Keyword(s):  
Water Pollution ◽  
Human Health ◽  
Rhodamine B ◽  
Removal Rate ◽  
Hydrodynamic Cavitation ◽  
Operating Parameters ◽  
Initial Ph ◽  
The Individual ◽  
Better Than ◽  
Maximum Removal

Abstract Rhodamine B (RhB), widely used as an industrial dye, is a toxic organic that is hazardous to human health and can cause water pollution. In this study, the removal rate of RhB was investigated by the following methods: hydrodynamic cavitation (HC) operated individually, and HC combined with oxidants H2O2 or ClO2. The effect of different operating parameters including pressure (2–6 bar) and initial pH (2–8) on the extent of degradation was investigated using an orifice plate as the cavitation device to achieve maximum removal of RhB. Under the parameters of HC, the effect of different loadings was investigated: H2O2 (n(RhB):n(H2O2) was varied from 1:17.60 to 1:211.28) and ClO2 (n(RhB):n(ClO2) was varied from 1:8.87 to 1:177.53). A combination of cavitation and H2O2 or ClO2 resulted in degradations of 80.6% and 95.3%. The results indicated that the combination of HC and oxidants was better than the individual HC process for the degradation of RhB. When combining HC with H2O2 or ClO2, the synergistic coefficients of 62.54 and 74.79 were obtained. The combination of HC and ClO2 was proven to be more effective for the removal of RhB compared to HC alone and the hybrid process of HC and H2O2.

Performance of PAC/PDM composite coagulants for removal of algae from Lake Taihu waters in summer

2010 ◽  
Vol 62 (2) ◽  
pp. 330-339 ◽  
Author(s):  
Y. J. Zhang ◽  
X. L. Zhao ◽  
X. X. Li ◽  
Ch. Liu ◽  
L. L. Zhu
Keyword(s):  
Water Quality ◽  
Intrinsic Viscosity ◽  
Removal Rate ◽  
Lake Taihu ◽  
Raw Water ◽  
Removal Rates ◽  
Polyaluminum Chloride ◽  
Enhanced Coagulation ◽  
Algae Removal ◽  
Better Than

The enhanced coagulation of algae-rich raw water from Lake Taihu in summer was studied by use of composite coagulants. The composite coagulants were composed of polyaluminum chloride (PAC) and polydimethyldiallylammonium chloride (PDM) with various intrinsic viscosity values (0.55–3.99 dL/g) and different mass percentages (5–20%) in the formulation. For raw water with temperature of 28–29°C and algae content of 3.60 × 104–3.70 × 104 cells/ml, the algae-removal rates of 89.0% and 89.3–93.1% could be realized by using PAC and PAC/PDM (0.55/5%–3.99/20%) with dosages of 8.37 mg/L and 5.93–3.58 mg/L, respectively, when 2 NTU residual turbidity of treated water after sedimentation was required. Compared with using PAC only, the removal rate of CODMn using PAC/PDM increased at least 4.4% when the dosage was 8 mg/L, and increased at least 5.0% when the dosage was 10 mg/L. The composite coagulants could still function well when raw water quality deteriorated and algae content reached 8.00 × 104 cells/ml. The enhanced coagulation efficiency of PAC/PDM (0.55/5%) could be better than that of PAC combined with prechlorination process when the same dosages are used.

Study on Precision Polishing of a Mini Roller Mold

2010 ◽  
Vol 126-128 ◽  
pp. 551-556
Author(s):  
Choung Lii Chao ◽  
Ying Ching Hsiao ◽  
Wen Chen Chou ◽  
Chia Wei Kuo ◽  
Wen Lang Lai ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Surface Finish ◽  
Empirical Model ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Condition ◽  
Microscopic Analysis ◽  
Semi Empirical ◽  
Better Than

This research aimed to design and develop a polishing system for precision polishing mini roller mold to nanometer surface finish. An experimental polishing system was built in the present study to polish nickel plated specimens with various polishing compounds. The polished specimens were subsequently examined by Alfa-step, OM and SEM for surface finish, morphology and microscopic analysis respectively. The obtained surface condition and material removal rate were correlated to the polishing parameters such as spindle speed, abrasive concentration, and abrasive grit size for the improvement of the polishing effect. Mini-rollers of 5mm in diameter, 50mm in length were successfully polished to a surface roughness better than 2nm Ra in several hours without damaging the roundness and cylindricalness using abrasive of 0.3μm, 10,000rpm polishing speed and 0.5mm gap distance between polisher and the specimen. A semi-empirical model of polishing was also developed in the study for predicting the materials removal rate.

Experimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper Film

2010 ◽  
Vol 126-128 ◽  
pp. 316-319
Author(s):  
Jhy Cherng Tsai ◽  
Wei Ching Lin
Keyword(s):  
Experimental Data ◽  
Experimental Investigation ◽  
Citric Acid ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Copper Film ◽  
Copper Base ◽  
Polishing Pressure ◽  
Better Than

Abrasive Free Polishing (AFP) is a polishing technology without abrasives and widely employed in copper-base semiconductor fabrications. This paper investigates the effect of passivants, added to the slurry, on the material removal rate (MRR) and the non-uniformity (NU) via experiments. Two kinds of passivants, Benzotriazole (BTA) and citric acid (CA) are added to the slurry for the experiments. Experimental results showed that the MRR increases when polishing pressure increases while NU decreases at the same time. Both MRR and NU tends to increase when rotational speed increases, though MRR and NU at 40 rpm are lower than that at 30 and 50 rpm in the slurry with CA. Experimental data also showed that AFP using the slurry with CA performs better than that with BTA.

Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry

2010 ◽  
Vol 64 ◽  
pp. 65-70 ◽  
Author(s):  
Toshiro K. Doi ◽  
Tsutomu Yamazaki ◽  
Syuhei Kurokawa ◽  
Yoji Umezaki ◽  
Osamu Ohnishi ◽  
...  
Keyword(s):  
Manganese Oxide ◽  
Chemical Mechanical Polishing ◽  
High Performance ◽  
Removal Rate ◽  
Comparison Study ◽  
Resource Saving ◽  
Glass Substrates ◽  
Closed Type ◽  
Quality Surface ◽  
Better Than

While investigating polishing mechanism of glass substrates with ceria abrasives (CeO2), we found its oxidizing properties worked effectively for the polishing. This finding has inspired us to speculate about the possibility of the manganese oxide abrasives as an alternative for ceria as they also have oxidizing properties. Therefore, focusing on the valence of the manganese, we have experimentally manufactured MnO, MnO2, Mn2O3 and Mn3O4 abrasives, and conducted a comparison study of the characteristics obtained with ceria slurry and manganese oxide slurries. As a result, the surface roughness of below Ra 0.8nm obtained with Mn2O3 slurry was found better than that with the conventional ceria slurry, on top of which, its removal rate was as good as or equal to that of ceria. Using a novel, closed type CMP (Chemical Mechanical Polishing) machine, we conducted another glass polishing experiment with ceria and manganese oxide slurries. The inside of the CMP machine was filled with high-pressure gases such as oxygen, air and nitrogen and kept at 500kPa to make the polishing environment radical. Through this experiment, we found an effective polishing method for high-quality surface. The removal rates were several times better than that of the conventional polishing performed in an open CMP machine.

Remediation of City River Water by Combining Submerged Macrophyte and Bioenergizer

2011 ◽  
Vol 322 ◽  
pp. 189-194
Author(s):  
Li Min Ma ◽  
Hou Ran Song ◽  
De Lei Meng ◽  
Ben Tao Gong
Keyword(s):  
Removal Rate ◽  
Pilot Scale ◽  
Control Group ◽  
Treatment Efficiency ◽  
Potamogeton Crispus ◽  
Submerged Aquatic Plants ◽  
Growth Promoting ◽  
Experimental Treatments ◽  
Number Of Bacteria ◽  
Better Than

The eutrophication of water in an urban river was treated by combining two submerged aquatic plantsElodeanuttalliiandPotamogeton crispuswith a biological growth-promoting agent Bio-energizer (BE) on a pilot scale. The results showed that the two submerged plants could remove CODCr effectively and steadily, with a removal rate of 58% and 52.3% respectively. All experimental treatments were effective at removing TN, TP, NH4+-N, NO3+-N, but the treatment in which BE was added at the lower concentration (from 1 to 3 ml/m3) was better than that at the higher concentration (from 5 to 10 ml/m3).Elodea nuttalliiproduced the best treatment efficiency when 1 ml/m3BE was added to the experimental water. The rate of removal of TP and TN was 71.0%, and 72.4% within one week while that in the control group was 50% and 51% respectively. The number of bacteria changed during the different stages of the experiment.

Bromide Ion Removal by Coagulation in Drinking Water

2013 ◽  
Vol 448-453 ◽  
pp. 1188-1191
Author(s):  
Qi Zhu ◽  
Dong Mei Liu ◽  
Fu Yi Cui ◽  
Lei Fang
Keyword(s):  
Drinking Water ◽  
Water Samples ◽  
Removal Rate ◽  
Raw Water ◽  
Songhua River ◽  
Ion Removal ◽  
Bromide Ions ◽  
Bromide Ion ◽  
The Songhua River ◽  
Better Than

In order to prove the rules of bromide ion remove in coagulation treatment stage in drinking water, by carrying out laboratory coagulation test in simulated water and the Songhua River raw water samples, the effects of bromine ion removal by coagulation of PAC, FeCl3 and the compound ferrous were investigated. The results showed that when the dosage of PAC was 60mg/L, the average removal rate of bromine ion was 50.6% by coagulation in the simulated water samples, and the rate was 44.8% in raw water samples of the Songhua River. In the conditions of FeCl3 dosage 70mg/L, the average removal rate of bromine ion was 56.1% in the simulated water sample, and the rate was 55.2% in raw water. When Reduce the same turbidity of drinking water, the effect of bromide ions removal by FeCl3 coagulation was better than that of PAC. When the dosage of compound ferrous (Ferrosilicon ratio of 1:1) as coagulant was 16.8mg/L, the bromide ions removal rate up to 67.6%.

Experimental Investigation on the Roles of Chemical Corrosion and Mechanical Polishing on Copper CMP

2004 ◽  
Author(s):  
Jhy-Cherng Tsai ◽  
Yaw-Yi Shieh ◽  
Ming-Shih Tsai ◽  
Bau-Tong Dai
Keyword(s):  
Experimental Investigation ◽  
Corrosion Rate ◽  
Removal Rate ◽  
Copper Film ◽  
Mechanical Polishing ◽  
Copper Films ◽  
Linear Superposition ◽  
Chemical Corrosion ◽  
The Relationship ◽  
Better Than

This paper is an experimental investigation on the roles of chemical corrosion and mechanical polishing of the chemical mechanical polishing (CMP) of wafers with copper film of 1,000 nm thickness. Three types of experiments are designed and conducted: chemical corrosion, mechanical polishing, and CMP with φ0.3μm Al2O3 as abrasives. The results showed that copper films after PVD and annealing sustain tensile stress that intensifies corrosion rate. In general, the stress of copper film increases at higher annealing temperature and the corrosion rate increases correspondingly though the relationship is weak. The polishing rate of pure mechanical polishing is about the same as that of pure chemical corrosion, but surface roughness of mechanical polishing and CMP are much better than that of chemical corrosion. Furthermore, the removal rate of mechanical polishing and chemical corrosion, about 2nm/min, are relatively low compared to that of CMP, about 30nm/min, it indicates that the removal mechanism of CMP is not simply a linear superposition of chemical corrosion and mechanical polishing. The strong interaction and the combined reaction of chemical corrosion and mechanical polishing need further investigation.

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