A short review on inorganic thin films from device perspective

2021 ◽  
pp. 231-275
Author(s):  
Dipak Kumar Baisnab ◽  
Supratim Mukherjee ◽  
Soumen Das
Keyword(s):  
Thin Films ◽  
Short Review ◽  
Inorganic Thin Films

Stretching-Driven Crystal Anisotropy and Optical Modulations of Flexible Wide Band Gap Inorganic Thin Films

2019 ◽  
Vol 11 (44) ◽  
pp. 41516-41522
Author(s):  
Hong Je Choi ◽  
Woosun Jang ◽  
Young Eun Kim ◽  
Aloysius Soon ◽  
Yong Soo Cho
Keyword(s):  
Thin Films ◽  
Band Gap ◽  
Wide Band ◽  
Wide Band Gap ◽  
Crystal Anisotropy ◽  
Inorganic Thin Films

Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000175-000182
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
Ambrose Wolf ◽  
Daniel Krueger
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Reliability ◽  
Interface Energy ◽  
Molecular Stability ◽  
Thin Film Adhesion ◽  
Inorganic Thin Films

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic

2016 ◽  
Vol 13 (3) ◽  
pp. 95-101 ◽  
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
J. Ambrose Wolf ◽  
Daniel Krueger
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Physical Vapor Deposition ◽  
High Reliability ◽  
Interface Energy ◽  
Film Adhesion ◽  
Molecular Stability ◽  
Thin Film Adhesion ◽  
Inorganic Thin Films

Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high-reliability, high-density microelectronics. The functionality and robustness of rework have been increased through the incorporation of a physical vapor deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for radio frequency (RF) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. Although previous work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e., thermodynamic) parameters in the literature. This article analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxide coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability between pair of materials at specific temperature. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

scholarly journals First principles study of reactions in alucone growth: the role of the organic precursor

2020 ◽  
Vol 49 (25) ◽  
pp. 8710-8721
Author(s):  
Arbresha Muriqi ◽  
Michael Nolan
Keyword(s):  
Thin Films ◽  
Molecular Mechanism ◽  
First Principles ◽  
Organic Precursor ◽  
First Principles Study ◽  
Inorganic Thin Films ◽  
Aluminium Alkoxides

First principles investigation of the molecular mechanism of the growth of hybrid organic–inorganic thin films of aluminium alkoxides, known as “alucones”.

scholarly journals Fractionation of block copolymers for pore size control and reduced dispersity in mesoporous inorganic thin films

Nanoscale ◽  
2020 ◽  
Vol 12 (35) ◽  
pp. 18455-18462
Author(s):  
Alberto Alvarez-Fernandez ◽  
Barry Reid ◽  
Jugal Suthar ◽  
Swan Yia Choy ◽  
Maximiliano Jara Fornerod ◽  
...  
Keyword(s):  
Thin Films ◽  
Block Copolymers ◽  
Pore Size ◽  
Size Control ◽  
Widespread Application ◽  
Inorganic Thin Films ◽  
Pore Size Control

Inorganic mesoporous coatings find widespread application. In many cases, control over the pore dimensions is of paramount importance. To this end, we establish a powerful route to pore size and dispersity control.

scholarly journals Vapor deposition routes to conformal polymer thin films

2017 ◽  
Vol 8 ◽  
pp. 723-735 ◽  
Author(s):  
Priya Moni ◽  
Ahmed Al-Obeidi ◽  
Karen K Gleason
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Sample Preparation ◽  
Vapor Phase ◽  
Vapor Deposition ◽  
Imaging Techniques ◽  
Polymer Thin Films ◽  
Chemical Vapor ◽  
Short Review ◽  
Deposition Sample

Vapor phase syntheses, including parylene chemical vapor deposition (CVD) and initiated CVD, enable the deposition of conformal polymer thin films to benefit a diverse array of applications. This short review for nanotechnologists, including those new to vapor deposition methods, covers the basic theory in designing a conformal polymer film vapor deposition, sample preparation and imaging techniques to assess film conformality, and several applications that have benefited from vapor deposited, conformal polymer thin films.

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