Inorganic Thin Films | ScienceGate

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

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Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.518 ◽

2016 ◽

Vol 13 (3) ◽

pp. 95-101 ◽

Cited By ~ 1

Author(s):

Carol Putman ◽

Rachel Cramm Horn ◽

J. Ambrose Wolf ◽

Daniel Krueger

Keyword(s):

Thin Film ◽

Thin Films ◽

Low Temperature ◽

Physical Vapor Deposition ◽

High Reliability ◽

Interface Energy ◽

Film Adhesion ◽

Molecular Stability ◽

Thin Film Adhesion ◽

Inorganic Thin Films

Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high-reliability, high-density microelectronics. The functionality and robustness of rework have been increased through the incorporation of a physical vapor deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for radio frequency (RF) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. Although previous work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e., thermodynamic) parameters in the literature. This article analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxide coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability between pair of materials at specific temperature. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

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First principles study of reactions in alucone growth: the role of the organic precursor

Dalton Transactions ◽

10.1039/d0dt01376e ◽

2020 ◽

Vol 49 (25) ◽

pp. 8710-8721

Author(s):

Arbresha Muriqi ◽

Michael Nolan

Keyword(s):

Thin Films ◽

Molecular Mechanism ◽

First Principles ◽

Organic Precursor ◽

First Principles Study ◽

Inorganic Thin Films ◽

Aluminium Alkoxides

First principles investigation of the molecular mechanism of the growth of hybrid organic–inorganic thin films of aluminium alkoxides, known as “alucones”.

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Fractionation of block copolymers for pore size control and reduced dispersity in mesoporous inorganic thin films

Nanoscale ◽

10.1039/d0nr05132b ◽

2020 ◽

Vol 12 (35) ◽

pp. 18455-18462

Author(s):

Alberto Alvarez-Fernandez ◽

Barry Reid ◽

Jugal Suthar ◽

Swan Yia Choy ◽

Maximiliano Jara Fornerod ◽

...

Keyword(s):

Thin Films ◽

Block Copolymers ◽

Pore Size ◽

Size Control ◽

Widespread Application ◽

Inorganic Thin Films ◽

Pore Size Control

Inorganic mesoporous coatings find widespread application. In many cases, control over the pore dimensions is of paramount importance. To this end, we establish a powerful route to pore size and dispersity control.

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Chemical Vapor Deposition of Inorganic Thin Films

Thin Film Processes ◽

10.1016/b978-0-12-728250-3.50012-x ◽

1978 ◽

pp. 257-331 ◽

Cited By ~ 22

Author(s):

WERNER KERN ◽

VLADIMIR S. BAN

Keyword(s):

Thin Films ◽

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Chemical Vapor ◽

Inorganic Thin Films

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Scanning Probe Microscopy on Inorganic Thin Films for Solar Cells

Advanced Characterization Techniques for Thin Film Solar Cells ◽

10.1002/9783527699025.ch13 ◽

2016 ◽

pp. 343-369

Author(s):

Sascha Sadewasser ◽

Iris Visoly-Fisher

Keyword(s):

Thin Films ◽

Solar Cells ◽

Scanning Probe Microscopy ◽

Scanning Probe ◽

Probe Microscopy ◽

Inorganic Thin Films

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Atomic Layer Deposition of Inorganic Thin Films on 3D Polymer Nanonetworks

Applied Sciences ◽

10.3390/app9101990 ◽

2019 ◽

Vol 9 (10) ◽

pp. 1990 ◽

Cited By ~ 8

Author(s):

Jinseong Ahn ◽

Changui Ahn ◽

Seokwoo Jeon ◽

Junyong Park

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Atomic Layer ◽

Deposition Process ◽

Interference Lithography ◽

Technical Requirement ◽

Layer Deposition ◽

Direct Laser ◽

Inorganic Thin Films ◽

Polymer Template

Atomic layer deposition (ALD) is a unique tool for conformally depositing inorganic thin films with precisely controlled thickness at nanoscale. Recently, ALD has been used in the manufacture of inorganic thin films using a three-dimensional (3D) nanonetwork structure made of polymer as a template, which is pre-formed by advanced 3D nanofabrication techniques such as electrospinning, block-copolymer (BCP) lithography, direct laser writing (DLW), multibeam interference lithography (MBIL), and phase-mask interference lithography (PMIL). The key technical requirement of this polymer template-assisted ALD is to perform the deposition process at a lower temperature, preserving the nanostructure of the polymer template during the deposition process. This review focuses on the successful cases of conformal deposition of inorganic thin films on 3D polymer nanonetworks using thermal ALD or plasma-enhanced ALD at temperatures below 200 °C. Recent applications and prospects of nanostructured polymer–inorganic composites or hollow inorganic materials are also discussed.

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