Finite element investigation on pretreatment temperature-dependent orthogonal cutting of unidirectional CFRP

2021 ◽  
pp. 114678
Author(s):  
La Han ◽  
Junjie Zhang ◽  
Yuan Liu ◽  
Qiumei Gu ◽  
Zengqiang Li
Keyword(s):  
Finite Element ◽  
Orthogonal Cutting ◽  
Temperature Dependent ◽  
Pretreatment Temperature

Extraction of the Coefficient of Thermal Expansion of Thin Films from Buckled Membranes

1998 ◽  
Vol 546 ◽  
Author(s):  
V. Ziebartl ◽  
O. Paul ◽  
H. Baltes
Keyword(s):  
Thin Films ◽  
Finite Element ◽  
Thermal Expansion ◽  
Silicon Nitride ◽  
Excellent Agreement ◽  
Energy Minimization ◽  
Coefficient Of Thermal Expansion ◽  
Temperature Dependent ◽  
Minimization Method ◽  
Energy Minimization Method

AbstractWe report a new method to measure the temperature-dependent coefficient of thermal expansion α(T) of thin films. The method exploits the temperature dependent buckling of clamped square plates. This buckling was investigated numerically using an energy minimization method and finite element simulations. Both approaches show excellent agreement even far away from simple critical buckling. The numerical results were used to extract Cα(T) = α0+α1(T−T0 ) of PECVD silicon nitride between 20° and 140°C with α0 = (1.803±0.006)×10−6°C−1, α1 = (7.5±0.5)×10−9 °C−2, and T0 = 25°C.

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

2012 ◽  
Vol 134 (3) ◽  
Author(s):  
Thomas Fellner ◽  
Elena Zukowski ◽  
Jürgen Wilde ◽  
H. Kück ◽  
H. Richter ◽  
...  
Keyword(s):  
Finite Element ◽  
Three Dimensional ◽  
Base Material ◽  
Creep Model ◽  
Assembly Process ◽  
Temperature Dependent ◽  
Reliability Modeling ◽  
Finite Element Software ◽  
Press Fit ◽  
Temperature Loads

This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional three-dimensional substrates, produced by thermoplastic injection moulding for large-series applications. The assembly process and subsequently the durability of press-fit interconnections has been modeled and proved with a finite element software. Especially, a simulation tool for process optimizations was created and applied. In order to obtain realistic results, a creep model for the investigated base material, a liquid-crystal polymer (LCP), was generated and verified by experiments. Required friction coefficients between metal pin and base material were determined by adapting simulations and experiments. Retention forces of pins pressed into substrate holes during as well after the assembly process, and after temperature loads were predicted by simulations. Additionally, the decreasing extraction forces over time due to creep in the thermoplastic base material have been predicted for different storage temperatures as well with finite element analyses. Following, the numerical results of the process and reliability modeling were verified by experiments. It is concluded that the behavior of the mechanical contact of the pin-substrate system, can be suitably described time- and temperature-dependent.

Finite Element and Experimental Analysis of Edge Defects Formation during Orthogonal Cutting of SiCp/Al Composites

2012 ◽  
Vol 500 ◽  
pp. 146-151 ◽  
Author(s):  
Ning Hou ◽  
Li Zhou ◽  
Shu Tao Huang ◽  
Li Fu Xu
Keyword(s):  
Finite Element ◽  
Chip Formation ◽  
Defect Formation ◽  
Orthogonal Cutting ◽  
Cutting Speed ◽  
Rake Angle ◽  
Critical Transition ◽  
Cutting Depth ◽  
Edge Defect ◽  
Edge Defects

In this paper, a finite element method was used to dynamically simulate the process of the edge defects formation during orthogonal cutting SiCp/Al composites. The influence of the cutting speed, cutting depth and rake angle of the PCD insert on the size of the edge defects have been investigated by using scanning electron. According to the simulated results, it can be provided that the cutting layer material has an effect on transfer stress and hinder the chip formation in the critical transition stage, and the critical transition point and distance are defined in this stage. The negative shear phenomenon is found when the chip transit to the edge defects in the flexure deformation stage, so the process of the chip formation is the basis of the edge defects formation. In addition, the relationship between the nucleation and propagation direction of the crack and the variation of the edge defect shape on the workpiece was investigated by theory, and it found that the negative shear angle formation is the primary cause of the edge defect formation. A mixed mode crack is found in the crack propagation stage. The sizes of edge defects were measured by the experiment and simulation, and the edge defect size decrease with the increasing of tool rake angle, while increase with increasing cutting depth and cutting speed.

Thermal Effects on the Vibration of Functionally Graded Deep Beams with Porosity

2017 ◽  
Vol 09 (05) ◽  
pp. 1750076 ◽  
Author(s):  
Şeref Doğuşcan Akbaş
Keyword(s):  
Mechanical Properties ◽  
Finite Element Method ◽  
Finite Element ◽  
Thermal Effects ◽  
Functionally Graded ◽  
Deep Beam ◽  
Material Distribution ◽  
Governing Equations ◽  
Temperature Dependent ◽  
Deep Beams

The purpose of this study is to investigate the thermal effects on the free vibration of functionally graded (FG) porous deep beams. Mechanical properties of the FG deep beam are temperature-dependent and vary across the height direction with different porosity models. The governing equations problem is obtained by using the Hamilton’s principle. In the solution of the problem, plane piecewise solid continua model and finite element method are used. The effects of porosity parameters, material distribution, porosity models and temperature rising on the vibration characteristics are presented and discussed with porosity effects for FG deep beams.

scholarly journals Prediction of Characteristic Length and Fracture Toughness in Ductile-Brittle Transition

2008 ◽  
Author(s):  
Z. X. Wang ◽  
H. M. Li ◽  
Y. J. Chao ◽  
P. S. Lam
Keyword(s):  
Finite Element Method ◽  
Fracture Toughness ◽  
Finite Element ◽  
Characteristic Length ◽  
Crack Tip ◽  
Critical Distance ◽  
Transition Regime ◽  
Temperature Dependent ◽  
Brittle Transition ◽  
Element Method

Finite element method was used to analyze the three-point bend experimental data of A533B-1 pressure vessel steel obtained by Sherry, Lidbury, and Beardsmore [1] from −160 to −45 °C within the ductile-brittle transition regime. As many researchers have shown, the failure stress (σf) of the material could be approximated as a constant. The characteristic length, or the critical distance (rc) from the crack tip, at which σf is reached, is shown to be temperature dependent based on the crack tip stress field calculated by the finite element method. With the J-A2 two-parameter constraint theory in fracture mechanics, the fracture toughness (JC or KJC) can be expressed as a function of the constraint level (A2) and the critical distance rc. This relationship is used to predict the fracture toughness of A533B-1 in the ductile-brittle transition regime with a constant σf and a set of temperature-dependent rc. It can be shown that the prediction agrees well with the test data for wide range of constraint levels from shallow cracks (a/W = 0.075) to deep cracks (a/W = 0.5), where a is the crack length and W is the specimen width.

Finite-element modelling of thermo-mechanical stress distribution in laser beam ceramic tile grout sealing process

2006 ◽  
Vol 220 (10) ◽  
pp. 1497-1508 ◽  
Author(s):  
A Liaqat ◽  
S Safdar ◽  
M A Sheikh
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Laser Beam ◽  
Mechanical Stress ◽  
Ceramic Tile ◽  
Element Model ◽  
Ceramic Tiles ◽  
Temperature Dependent ◽  
Heat Effects

Laser tile grout sealing is a special process in which voids between the adjoining ceramic tiles are sealed by a laser beam. This process has been developed by Lawrence and Li using a customized grout material and a high power diode laser (HPDL). The process has been optimally carried out at laser powers of 60–120 W and at scanning speeds of 3–15 mm/s. Modelling of the laser tile grout sealing process is a complex task as it involves a moving laser beam and five different materials: glazed enamel, grout material, ceramic tile, epoxy bedding, and ordinary Portland cement substrate. This article presents the finite element model (FEM) of the laser tile grout sealing process. The main aim of this model is to accurately predict the thermo-mechanical stress distribution induced by the HPDL beam in the process. For an accurate representation of the process, the laser was modelled as a moving heat source. A three-dimensional transient thermal analysis was carried out to determine the temperature distribution. Temperature-dependent material properties and latent heat effects, due to melting and solidification of the glazed enamel, were taken into account in the FEM, thereby allowing a more realistic and accurate thermal analysis. The results of the thermal analysis were used as an input for the stress analysis with temperature-dependent mechanical properties. The results obtained from the FEM are compared with the published experimental results.

FEM Simulation of the Residual Stress in the Machined Surface Layer for High-Speed Machining

2006 ◽  
Vol 315-316 ◽  
pp. 140-144 ◽  
Author(s):  
Su Yu Wang ◽  
Xing Ai ◽  
Jun Zhao ◽  
Z.J. Lv
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Surface Layer ◽  
Residual Stresses ◽  
High Speed ◽  
Metal Cutting ◽  
Orthogonal Cutting ◽  
High Speed Machining ◽  
Machined Surface ◽  
Cutting Model

An orthogonal cutting model was presented to simulate high-speed machining (HSM) process based on metal cutting theory and finite element method (FEM). The residual stresses in the machined surface layer were obtained with various cutting speeds using finite element simulation. The variations of residual stresses in the cutting direction and beneath the workpiece surface were studied. It is shown that the thermal load produced at higher cutting speed is the primary factor affecting the residual stress in the machined surface layer.

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