Galvanic corrosion of electroless nickel/immersion gold plated non-permanent electric contacts used in electronic devices–direct evidence of triggering mechanism

2019 ◽  
Vol 96 ◽  
pp. 562-569 ◽  
Author(s):  
E.F. Monlevade ◽  
I.A.P. Cardoso ◽  
E.F.L. Maciel ◽  
N. Alonso-Falleiros
Keyword(s):  
Direct Evidence ◽  
Galvanic Corrosion ◽  
Electronic Devices ◽  
Electroless Nickel ◽  
Triggering Mechanism ◽  
Electroless Nickel Immersion Gold ◽  
Electric Contacts

ENPLATE NI-423

Alloy Digest ◽  
1986 ◽  
Vol 35 (11) ◽  
Keyword(s):  
Wear Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
High Speed ◽  
Chemical Reduction ◽  
Electronic Devices ◽  
Electroless Nickel ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Phosphorus Alloy

Abstract ENPLATE NI-423 is a nickel-phosphorus alloy deposited by chemical reduction without electric current. It is deposited by a stable, relatively high-speed functional electroless nickel process that produces a low-stress coating with good ductility and excellent resistance to corrosion. Its many uses include equipment for chemicals and food, aerospace components, molds and electronic devices. This datasheet provides information on composition, physical properties, and hardness. It also includes information on corrosion and wear resistance as well as heat treating, machining, joining, and surface treatment. Filing Code: Ni-343. Producer or source: Enthone Inc..

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

2014 ◽  
Vol 896 ◽  
pp. 660-663
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Phaklen Ehkan ◽  
Fairul Afzal Ahmad Fuad ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Design Of Experiment ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Bump Height ◽  
Process Robustness ◽  
Electroless Nickel Immersion Gold ◽  
Optimization Of Process Parameters ◽  
Chip Technology ◽  
Higher Temperature

Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

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