Enhanced heat dissipation in helically finned heat sink through swirl effects in free convection

An analytical solution for a system consisting of a pin-fin heat sink and a chimney is presented. The result is applied to problems in which the size of the overall system is constrained. For a given heat dissipation and total system size, optimal values of the pin-fin diameter and heat-sink porosity are observed. The optima occur for systems with and without chimneys. The optimization is used to show that the minimum thermal resistance from a pin-fin heat sink is about two times larger than that of an idealized model based on inviscid flow.

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Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

Volume 1: Thermal Management ◽

10.1115/ipack2015-48630 ◽

2015 ◽

Cited By ~ 1

Author(s):

Nico Setiawan Effendi ◽

Kyoung Joon Kim

Keyword(s):

Thermal Resistance ◽

Heat Sink ◽

High Performance ◽

Heat Dissipation ◽

Computational Study ◽

Heat Sinks ◽

Channel Diameter ◽

Internal Channel ◽

Study Results ◽

Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

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Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux

Volume 1: Micro/Nanofluidics and Lab-on-a-Chip; Nanofluids; Micro/Nanoscale Interfacial Transport Phenomena; Micro/Nanoscale Boiling and Condensation Heat Transfer; Micro/Nanoscale Thermal Radiation; Micro/Nanoscale Energy Devices and Systems ◽

10.1115/mnhmt2016-6726 ◽

2016 ◽

Author(s):

Zhuo Cui

Keyword(s):

Heat Resistance ◽

Water Flow ◽

Heat Sink ◽

Heat Dissipation ◽

Convection Heat Transfer ◽

Cooling Water ◽

High Heat Flux ◽

Pin Fin ◽

Pin Fins ◽

Pin Fin Arrays

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.

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Heat-dissipation performance of cylindrical heat sink with perforated fins

International Journal of Thermal Sciences ◽

10.1016/j.ijthermalsci.2021.107132 ◽

2021 ◽

Vol 170 ◽

pp. 107132

Author(s):

Gihyun Song ◽

Dong-Hwa Kim ◽

Dong-Hyung Song ◽

Ju-Bin Sung ◽

Se-Jin Yook

Keyword(s):

Heat Sink ◽

Heat Dissipation

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Pin-Fin Heat Sink With Horizontal Base and Blocked Edges

Heat Transfer: Volume 2 ◽

10.1115/ht2008-56205 ◽

2008 ◽

Cited By ~ 1

Author(s):

D. Sahray ◽

H. Shmueli ◽

N. Segal ◽

G. Ziskind ◽

R. Letan

Keyword(s):

Heat Transfer ◽

Free Convection ◽

Contact Resistance ◽

Cross Section ◽

Heat Input ◽

Heat Sink ◽

Numerical Study ◽

Heat Sinks ◽

Transfer Enhancement ◽

Pin Fin

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.

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Design of Optimum Plate-Fin Natural Convective Heat Sinks

Journal of Electronic Packaging ◽

10.1115/1.1568361 ◽

2003 ◽

Vol 125 (2) ◽

pp. 208-216 ◽

Cited By ~ 94

Author(s):

Avram Bar-Cohen ◽

Madhusudan Iyengar ◽

Allan D. Kraus

Keyword(s):

Nusselt Number ◽

Specific Heat ◽

Rectangular Plate ◽

Heat Sink ◽

Heat Dissipation ◽

Thermal Design ◽

Heat Sinks ◽

And Performance ◽

Nusselt Number Correlation ◽

The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

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Evaporation-enhanced, dynamically-adaptive air (gas)-cooled heat sink for thermal management of high heat dissipation devices

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544288 ◽

2008 ◽

Author(s):

Andrei G. Fedorov ◽

J. Mark Meacham

Keyword(s):

Thermal Management ◽

Heat Sink ◽

Heat Dissipation ◽

High Heat

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Mathematical modeling and numerical simulation of heat dissipation in led bulbs

Thermal Science ◽

10.2298/tsci190521076a ◽

2020 ◽

Vol 24 (3 Part A) ◽

pp. 1877-1884 ◽

Cited By ~ 1

Author(s):

Diego Alarcón ◽

Eduardo. Balvís ◽

Ricardo Bendaña ◽

Alberto Conejero ◽

de Fernández ◽

...

Keyword(s):

Mathematical Modeling ◽

Numerical Simulation ◽

Numerical Simulations ◽

Heat Sink ◽

Heat Dissipation ◽

Thermal Contact ◽

Heat Sinks ◽

Experimental Measurements ◽

Heating And Cooling ◽

The Common

We present a detailed study of heating and cooling processes in LED luminaires with passive heat sinks. Our analysis is supported by numerical simulations as well as experimental measurements, carried on commercial systems used for outdoor lighting. We have focused our analysis on the common case of a single LED source in thermal contact with an aluminum passive heat sink, obtaining an excellent agreement with experimental measurements and the numerical simulations performed. Our results can be easily expanded, without loss of generality, to similar systems.

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Design and characterization of a copper microchannel heat sink for SiP cooling

Modern Physics Letters B ◽

10.1142/s0217984921400157 ◽

2021 ◽

pp. 2140015

Author(s):

Min Miao ◽

Hao Zhang ◽

Hejie Yu ◽

Lili Cao

Keyword(s):

Heat Flux ◽

Heat Sink ◽

Heat Dissipation ◽

Electrical Discharge Machining ◽

Copper Substrate ◽

Integrated System ◽

Peak Temperature ◽

Microchannel Heat Sink ◽

Set Up ◽

Electronic Hardware

With the increasing flourishing of miniaturized, multifunctional, and heterogeneously integrated system in package (SiP), heating problem is becoming more and more serious. In this paper, to meet the heat dissipation needs of the chips thus assembled and to achieve effective thermal management, linear, serpent and spiral shaped microchannel heat sinks were designed and fabricated into copper substrate by electrical discharge machining (EDM) and precision machining technology, acting both as the cooler and mounting base for passive and active SiP interposers. A test platform was set up to characterize the heat dissipation performance of the copper-based microchannel heat sink. The experimental and simulation results show that heat dissipation rate increases with the increasing heat flux density in the range 5–30 W/cm2 for the three microchannel designs, and the peak temperature can all be kept below 340 K (67[Formula: see text]C) even for the highest heat flux. The three designs are compared from the perspective of peak temperature, temperature distribution uniformity and pressure drop. In all, the solution proposed hereby provides a new and optimal option for in-situ cooling for densely integrated electronic hardware.

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