Dissolution of electroless Ni metallization by lead-free solder alloys

2005 ◽  
Vol 388 (1) ◽  
pp. 75-82 ◽  
Author(s):  
Ahmed Sharif ◽  
Y.C. Chan ◽  
M.N. Islam ◽  
M.J. Rizvi
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder ◽  
Electroless Ni

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

2011 ◽  
Author(s):  
Takahiro Kano ◽  
Ikuo Shohji ◽  
Tetsuyuki Tsuchida ◽  
Toshikazu Ookubo
Keyword(s):  
Reaction Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Ball Joints ◽  
Electroless Ni

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

scholarly journals Electrochemical migration of lead-free solder alloys in Na2SO4 environment

2017 ◽  
Author(s):  
Balint Medgyes ◽  
Sandor Adam ◽  
Lajos Tar ◽  
Vadimas Verdingovas ◽  
Rajan Ambat ◽  
...  
Keyword(s):  
Lead Free ◽  
Electrochemical Migration ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

scholarly journals The Influences Which Constitutive Models for Lead-Free Solder Alloys in General FEA Programs Give to Accumulated Inelastic Strain Behavior

2016 ◽  
Vol 5 (4) ◽  
pp. 266-274
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Masaaki TAKABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI ◽  
...  
Keyword(s):  
Constitutive Models ◽  
Inelastic Strain ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Strain Behavior ◽  
Free Solder

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

scholarly journals Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering

2019 ◽  
Author(s):  
Mohamed Amine Alaya ◽  
Laszlo Gal ◽  
Tamas Hurtony ◽  
Balint Medgyes ◽  
Daniel Straubinger ◽  
...  
Keyword(s):  
Vapour Phase ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder
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