AlN buffer layer growth for GaN epitaxy on (111) Si: Al or N first?

2009 ◽  
Vol 311 (12) ◽  
pp. 3278-3284 ◽  
Author(s):  
A. Le Louarn ◽  
S. Vézian ◽  
F. Semond ◽  
J. Massies
Keyword(s):  
Buffer Layer ◽  
Layer Growth ◽  
Aln Buffer

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1999 ◽  
Vol 4 (S1) ◽  
pp. 417-422 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.

Dependence of GaN Defect Structure on the Growth Temperature of the AlN Buffer Layer

2008 ◽  
Vol 1068 ◽  
Author(s):  
Yuen-Yee Wong ◽  
Edward Yi Chang ◽  
Tsung-Hsi Yang ◽  
Jet-Rung Chang ◽  
Yi-Cheng Chen ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Growth Temperature ◽  
Defect Structure ◽  
Defect Density ◽  
Layer Growth ◽  
Threading Dislocation ◽  
Higher Temperature ◽  
Lower Temperature ◽  
Aln Buffer ◽  
Gan Film

ABSTRACTThe defect structure of the GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) technique was found to be dependent on the AlN buffer layer growth temperature. This buffer growth temperature controlled the defect density in GaN film but had shown contrary effects on the density of screw threading dislocation (TD) and edge TD. The density of screw TD was high on lower temperature buffer but low on the higher temperature buffer. Meanwhile the density of edge TD had shown the opposite. Further examinations have suggested that the defect structure was closely related to the stress in the GaN film, which can be controlled by the growth temperature of the AlN buffer. Using the 525°C AlN buffer, optimum quality GaN film with relatively low screw and edge TDs were achieved.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1998 ◽  
Vol 537 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

AbstractThe surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than l nm RMS.

Effect of Aluminum Nitride Buffer Layer Temperature on Gallium Nitride Grown by OMVPE

1994 ◽  
Vol 339 ◽  
Author(s):  
L. B. Rowland ◽  
K. Doverspike ◽  
D. K. Gaskill ◽  
J. A. Freitas
Keyword(s):  
Gallium Nitride ◽  
Buffer Layer ◽  
Growth Temperature ◽  
Growth Conditions ◽  
Layer Growth ◽  
Buffer Layers ◽  
Double Crystal ◽  
Relative Crystallinity ◽  
Excitonic Emission ◽  
Aln Buffer

ABSTRACTGallium nitride layers were grown by organometallic vapor phase epitaxy on AlN buffer layers deposited in the range of 450–650°C. The GaN growth conditions were kept constant so that changes in film properties were due only to changes in the buffer layer growth temperature. A monotonie improvement in relative crystallinity as measured by double-crystal X-ray diffraction corresponded with a decrease in buffer layer growth temperature. Improvements in GaN electron transport at 300 and 77 K were also observed with decreasing AlN buffer layer temperature. Photoluminescence spectra for the lowest temperatures studied were dominated by sharp excitonic emission, with some broadening of the exciton linewidth observed as the buffer layer growth temperature was increased. The full width at half maximum of the excitonic emission was 2.7 meV for GaN grown on a 450°C buffer layer. These results indicate that minimizing AlN buffer layer temperature results in improvements in GaN film quality.

Influence of the AlN buffer layer growth on AlGaN/GaN films deposited on (111)Si substrates

2001 ◽  
Vol 45 (3) ◽  
pp. 417-421 ◽  
Author(s):  
H.M. Liaw ◽  
R. Venugopal ◽  
J. Wan ◽  
M.R. Melloch
Keyword(s):  
Buffer Layer ◽  
Layer Growth ◽  
Si Substrates ◽  
Aln Buffer

scholarly journals Improved Performance of GaN-Based Light-Emitting Diodes Grown on Si (111) Substrates with NH3 Growth Interruption

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 399
Author(s):  
Sang-Jo Kim ◽  
Semi Oh ◽  
Kwang-Jae Lee ◽  
Sohyeon Kim ◽  
Kyoung-Kook Kim
Keyword(s):  
Buffer Layer ◽  
Light Emitting Diodes ◽  
Defect Density ◽  
Strain Relaxation ◽  
Multiple Quantum Well ◽  
Light Output ◽  
Multiple Quantum ◽  
Light Emitting ◽  
Growth Interruption ◽  
Aln Buffer

We demonstrate the highly efficient, GaN-based, multiple-quantum-well light-emitting diodes (LEDs) grown on Si (111) substrates embedded with the AlN buffer layer using NH3 growth interruption. Analysis of the materials by the X-ray diffraction omega scan and transmission electron microscopy revealed a remarkable improvement in the crystalline quality of the GaN layer with the AlN buffer layer using NH3 growth interruption. This improvement originated from the decreased dislocation densities and coalescence-related defects of the GaN layer that arose from the increased Al migration time. The photoluminescence peak positions and Raman spectra indicate that the internal tensile strain of the GaN layer is effectively relaxed without generating cracks. The LEDs embedded with an AlN buffer layer using NH3 growth interruption at 300 mA exhibited 40.9% higher light output power than that of the reference LED embedded with the AlN buffer layer without NH3 growth interruption. These high performances are attributed to an increased radiative recombination rate owing to the low defect density and strain relaxation in the GaN epilayer.

The Effect of the Thickness of the Low Temperature AlN Nucleation Layer on the Material Properties of GaN Grown on a Double-Step AlN Buffer Layer by the MOCVD Method

2015 ◽  
Vol 45 (2) ◽  
pp. 859-866 ◽  
Author(s):  
Wei-Ching Huang ◽  
Chung-Ming Chu ◽  
Chi-Feng Hsieh ◽  
Yuen-Yee Wong ◽  
Kai-wei Chen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Buffer Layer ◽  
Material Properties ◽  
Double Step ◽  
Nucleation Layer ◽  
Aln Buffer

scholarly journals MOCVD Grown HgCdTe Heterostructures for Medium Wave Infrared Detectors

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 611
Author(s):  
Waldemar Gawron ◽  
Jan Sobieski ◽  
Tetiana Manyk ◽  
Małgorzata Kopytko ◽  
Paweł Madejczyk ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Infrared Detectors ◽  
Lattice Mismatch ◽  
Layer Growth ◽  
Ex Situ ◽  
Current Status ◽  
Organic Chemical ◽  
Infrared Band ◽  
Donor And Acceptor ◽  
Wide Range

This paper presents the current status of medium-wave infrared (MWIR) detectors at the Military University of Technology’s Institute of Applied Physics and VIGO System S.A. The metal–organic chemical vapor deposition (MOCVD) technique is a very convenient tool for the deposition of HgCdTe epilayers, with a wide range of compositions, used for uncooled infrared detectors. Good compositional and thickness uniformity was achieved on epilayers grown on 2-in-diameter, low-cost (100) GaAs wafers. Most growth was performed on substrates, which were misoriented from (100) by between 2° and 4° in order to minimize growth defects. The large lattice mismatch between GaAs and HgCdTe required the usage of a CdTe buffer layer. The CdTe (111) B buffer layer growth was enforced by suitable nucleation procedure, based on (100) GaAs substrate annealing in a Te-rich atmosphere prior to the buffer deposition. Secondary-ion mass spectrometry (SIMS) showed that ethyl iodide (EI) and tris(dimethylamino)arsenic (TDMAAs) were stable donor and acceptor dopants, respectively. Fully doped (111) HgCdTe heterostructures were grown in order to investigate the devices’ performance in the 3–5 µm infrared band. The uniqueness of the presented technology manifests in a lack of the necessity of time-consuming and troublesome ex situ annealing.

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