scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1999 ◽  
Vol 4 (S1) ◽  
pp. 417-422 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1998 ◽  
Vol 537 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

AbstractThe surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than l nm RMS.

Effect of Aluminum Nitride Buffer Layer Temperature on Gallium Nitride Grown by OMVPE

1994 ◽  
Vol 339 ◽  
Author(s):  
L. B. Rowland ◽  
K. Doverspike ◽  
D. K. Gaskill ◽  
J. A. Freitas
Keyword(s):  
Gallium Nitride ◽  
Buffer Layer ◽  
Growth Temperature ◽  
Growth Conditions ◽  
Layer Growth ◽  
Buffer Layers ◽  
Double Crystal ◽  
Relative Crystallinity ◽  
Excitonic Emission ◽  
Aln Buffer

ABSTRACTGallium nitride layers were grown by organometallic vapor phase epitaxy on AlN buffer layers deposited in the range of 450–650°C. The GaN growth conditions were kept constant so that changes in film properties were due only to changes in the buffer layer growth temperature. A monotonie improvement in relative crystallinity as measured by double-crystal X-ray diffraction corresponded with a decrease in buffer layer growth temperature. Improvements in GaN electron transport at 300 and 77 K were also observed with decreasing AlN buffer layer temperature. Photoluminescence spectra for the lowest temperatures studied were dominated by sharp excitonic emission, with some broadening of the exciton linewidth observed as the buffer layer growth temperature was increased. The full width at half maximum of the excitonic emission was 2.7 meV for GaN grown on a 450°C buffer layer. These results indicate that minimizing AlN buffer layer temperature results in improvements in GaN film quality.

Effect of N/Ga Flux Ratio in GaN Buffer Layer Growth by MBE on (0001) Sapphire on Defect Formation in the GaN Main Layer

1999 ◽  
Vol 572 ◽  
Author(s):  
S. Ruvimov ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
Y. Kim ◽  
G. S. Sudhir ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Defect Formation ◽  
Flux Ratio ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Simultaneous Increase ◽  
Growth Stages ◽  
Dislocation Generation ◽  
Gan Buffer Layer

ABSTRACTTransmission electron microscopy was employed to study the effect of N/Ga flux ratio in the growth of GaN buffer layers on the structure of GaN epitaxial layers grown by molecular-beamepitaxy (MBE) on sapphire. The dislocation density in GaN layers was found to increase from 1×1010 to 6×1010 cm−2 with increase of the nitrogen flux from 5 to 35 sccm during the growth of the GaN buffer layer with otherwise the same growth conditions. All GaN layers were found to contain inversion domain boundaries (IDBs) originated at the interface with sapphire and propagated up to the layer surface. Formation of IDBs was often associated with specific defects at the interface with the substrate. Dislocation generation and annihilation were shown to be mainly growth-related processes and, hence, can be controlled by the growth conditions, especially during the first growth stages. The decrease of electron Hall mobility and the simultaneous increase of the intensity of “green” luminescence with increasing dislocation density suggest that dislocation-related deep levels are created in the bandgap.

Effect of Buffer Design on AlGaN/AlN/GaN Heterostrucutres by MBE

2003 ◽  
Vol 798 ◽  
Author(s):  
Gon Namkoong ◽  
W. Alan ◽  
A. S. Brown ◽  
M. Losurdo ◽  
M. M. Giangregorio ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Buffer Layer ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Structural Quality ◽  
Epitaxial Layers ◽  
Etch Pit Density ◽  
Etch Pit ◽  
Sheet Charge ◽  
Aln Buffer

ABSTRACTThe effect of the buffer layers on the subsequent GaN epitaxial layers and electrical properties of AlGaN/AlN/GaN heterojunction structures nitrided at various temperatures was investigated. For AlN buffer layers, two different growth conditions of AlN buffer layers were introduced to avoid Al droplets. We found that etch pit density and structural quality of GaN epitaxial layer strongly depends on the growth conditions of AlN buffer layers. When using a double buffer layer (low temperature GaN on high temperature AlN) for 200 °C nitridation, the etch pit density was measured to high 107 cm-2 in GaN epitaxial layers. Furthermore, we observed that electrical properties of AlGaN/AlN/GaN heterostructures depend on growth conditions of buffer layers and nitridation temperatures. The mobility in Al0.33Ga0.67N/AlN/GaN structures grown on single AlN buffer layers for 200 °C nitridation were 1300 cm2/Vs at a sheet charge of 1.6×1013 cm-2. Using the double buffer layer for 200 °C nitridation, the mobility increased to 1587 cm2/Vs with a sheet charge of 1.25×1013 cm-2.

Study of the growth mechanism and properties of InN films grown by MOCVD

2003 ◽  
Vol 798 ◽  
Author(s):  
Abhishek Jain ◽  
Joan M. Redwing
Keyword(s):  
Thin Films ◽  
Buffer Layer ◽  
Growth Temperature ◽  
Room Temperature ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Film Morphology ◽  
Buffer Layer Thickness ◽  
Aln Buffer

ABSTRACTThin films of InN were grown on (0001) Sapphire by MOCVD. The effect of growth conditions and buffer layer on the film morphology was studied. Growth temperature and TMI flow rate were important factors in the growth of InN. The use of a low temperature AlN buffer layer was also found to improve the morphology and crystal quality of the films. Thin (<40Å) AlN buffer layers produced the best results while polycrystalline InN was obtained when the buffer layer thickness exceeded 60Å. Delamination of the InN films was observed to occur at growth temperature, which limited the thickness of the films to less than 300 nm. A room temperature mobility of 792 cm2/Vs and an electron concentration of 2.1×1019 cm-3 were measured in an approximately 200 nm thick InN layer grown on sapphire.

scholarly journals Structural properties of MOVPE GaN layers grown by a new multi-buffer aproach

1998 ◽  
Vol 3 ◽  
Author(s):  
J. Kozlowski ◽  
R. Paszkiewicz ◽  
R. Korbutowicz ◽  
M. Panek ◽  
B. Paszkiewicz ◽  
...  
Keyword(s):  
High Temperature ◽  
Electrical Properties ◽  
Buffer Layer ◽  
Growth Conditions ◽  
Optical Microscope ◽  
Lattice Parameter ◽  
Layer Growth ◽  
Buffer Layers ◽  
Molar Ratio ◽  
X Ray

GaN undoped layers of good morphology, good crystallinity and electrical properties were grown on c-plane sapphire substrates by the atmospheric pressure MOVPE technique using a new multi-buffer growth approach. A suitable buffer layer growth technique was worked out which enabled growth of GaN layers with properties superior to those grown in a conventional process scheme. Additional buffer layers, deposited with increasing temperature and increasing V/III molar ratio, were inserted between the low temperature buffer layer and the high temperature GaN layer grown on it. The c and a lattice constants of the high temperature GaN overgrown layer were evaluated from X-ray data. The layer mosaicity and c-lattice parameter variation were determined. The relationship between c and a lattice parameters and the second buffer layer growth scheme has been studied. The effect of second buffer layer growth conditions, buffer layer annealing time as well as the influence of V/III molar ratio during the high temperature GaN deposition on the crystalline and electrical properties of overgrown GaN epitaxial layers are presented. Characterization includes surface morphology examination by SEM and Nomarski optical microscope, X-ray diffraction and C-V measurements.

Effects of the Sputtering Time of AlN Buffer Layer on the Quality of ZnO Thin Films

2014 ◽  
Vol 881-883 ◽  
pp. 1117-1121 ◽  
Author(s):  
Xiang Min Zhao
Keyword(s):  
Thin Films ◽  
Buffer Layer ◽  
Rf Magnetron Sputtering ◽  
Buffer Layers ◽  
Zno Thin Films ◽  
Zno Films ◽  
Si Substrates ◽  
Atomic Force ◽  
Structure Morphology ◽  
Aln Buffer

ZnO thin films with different thickness (the sputtering time of AlN buffer layers was 0 min, 30 min,60 min, and 90 min, respectively) were prepared on Si substrates using radio frequency (RF) magnetron sputtering system.X-ray diffraction (XRD), atomic force microscope (AFM), Hall measurements setup (Hall) were used to analyze the structure, morphology and electrical properties of ZnO films.The results show that growth are still preferred (002) orientation of ZnO thin films with different sputtering time of AlN buffer layer,and for the better growth of ZnO films, the optimal sputtering time is 60 min.

AlN buffer layer growth for GaN epitaxy on (111) Si: Al or N first?

2009 ◽  
Vol 311 (12) ◽  
pp. 3278-3284 ◽  
Author(s):  
A. Le Louarn ◽  
S. Vézian ◽  
F. Semond ◽  
J. Massies
Keyword(s):  
Buffer Layer ◽  
Layer Growth ◽  
Aln Buffer

Preparation of InN by Means of AP-HCVD Using In Buffer Layers

2007 ◽  
Vol 1040 ◽  
Author(s):  
Hiroaki Yokoo ◽  
Naoki Wakiya ◽  
Naonori Sakamoto ◽  
Takato Nakamura ◽  
Hisao Suzuki
Keyword(s):  
Electrical Property ◽  
Surface Morphology ◽  
Buffer Layer ◽  
Atmospheric Pressure ◽  
Indium Nitride ◽  
Buffer Layers ◽  
Crystal Quality ◽  
X Ray Diffraction ◽  
X Ray ◽  
Quality Surface

AbstractWe have grown indium nitride (InN) films using In buffer layer on an a-plane sapphire substrate under atmospheric pressure by halide CVD (AP-HCVD). Growth was carried out by two steps: deposition In buffer layer at 900 °C and subsequent growth of InN layer at 650 °C. In order to compare, we also grown InN films on an a-plane sapphire. The InN films are investigated on crystal quality, surface morphology and electrical property using high-resolution X-ray diffraction (HR-XRD), X-ray pole figure, scanning electron microscope (SEM), Hall measurement. The results show that the crystal quality, surface morphology and electrical property of InN films are improved by using In buffer layer.

Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers

2006 ◽  
Vol 916 ◽  
Author(s):  
Kazuhiro Ito ◽  
Yu Uchida ◽  
Sang-jin Lee ◽  
Susumu Tsukimoto ◽  
Yuhei Ikemoto ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Light Emission ◽  
Chemical Vapor ◽  
Nucleation Site ◽  
Layer Growth ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Nitrogen Enrichment ◽  
Threading Dislocation ◽  
Sapphire Substrates

AbstractAbout 20 years ago, the discovery of an AlN buffer layer lead to the breakthrough in epitaxial growth of GaN layers with mirror-like surface, using a metal organic chemical vapor deposition (MOCVD) technique on sapphire substrates. Since then, extensive efforts have been continued to develop a conductive buffer layer/substrate for MOCVD-grown GaN layers to improve light emission of GaN light-emitting diodes. In the present study, we produced MOCVD-grown, continuous, flat epitaxial GaN layers on nitrogen enriched TiN buffer layers with the upper limit of the nitrogen content of TiN deposited at room temperature (RT) on sapphire substrates. It was concluded that the nitrogen enrichment would reduce significantly the TiN/GaN interfacial energy. The RT deposition of the TiN buffer layers suppresses their grain growth during the nitrogen enrichment and the grain size refining must increase nucleation site of GaN. In addition, threading dislocation density in the GaN layers grown on TiN was much lower than that in the GaN layers grown on AlN.

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