Transformation behavior of hydrides precipitated with or without stress in Zr-2.5Nb investigated by in-situ S/TEM thermal cycling

2021 ◽  
pp. 153428
Author(s):  
Fei Long ◽  
Sean Hanlon ◽  
Mark R. Daymond
Energies ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 72
Author(s):  
Sergiu Spataru ◽  
Peter Hacke ◽  
Dezso Sera

An in-situ method is proposed for monitoring and estimating the power degradation of mc-Si photovoltaic (PV) modules undergoing thermo-mechanical degradation tests that primarily manifest through cell cracking, such as mechanical load tests, thermal cycling and humidity freeze tests. The method is based on in-situ measurement of the module’s dark current-voltage (I-V) characteristic curve during the stress test, as well as initial and final module flash testing on a Sun simulator. The method uses superposition of the dark I-V curve with final flash test module short-circuit current to account for shunt and junction recombination losses, as well as series resistance estimation from the in-situ measured dark I-Vs and final flash test measurements. The method is developed based on mc-Si standard modules undergoing several stages of thermo-mechanical stress testing and degradation, for which we investigate the impact of the degradation on the modules light I-V curve parameters, and equivalent solar cell model parameters. Experimental validation of the method on the modules tested shows good agreement between the in-situ estimated power degradation and the flash test measured power loss of the modules, of up to 4.31 % error (RMSE), as the modules experience primarily junction defect recombination and increased series resistance losses. However, the application of the method will be limited for modules experiencing extensive photo-current degradation or delamination, which are not well reflected in the dark I-V characteristic of the PV module.


2011 ◽  
Vol 158 (8) ◽  
pp. A890 ◽  
Author(s):  
Kevin Rhodes ◽  
Roberta Meisner ◽  
Yoongu Kim ◽  
Nancy Dudney ◽  
Claus Daniel

Materials ◽  
2018 ◽  
Vol 11 (11) ◽  
pp. 2229 ◽  
Author(s):  
Flora Somidin ◽  
Hiroshi Maeno ◽  
Xuan Tran ◽  
Stuart D. McDonald ◽  
Mohd Mohd Salleh ◽  
...  

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η′-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η′-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.


Author(s):  
Erick Gutierrez ◽  
Kevin Lin ◽  
Douglas DeVoto ◽  
Patrick McCluskey

Abstract Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for high-power applications. Operation and environmental stresses can cause these power modules to progressively degrade over time, potentially leading to catastrophic failure of the device. This degradation process may cause some early performance symptoms related to the state of health of the power module, making it possible to detect reliability degradation of the IGBT module. Testing can be used to accelerate this process, permitting a rapid determination of whether specific declines in device reliability can be characterized. In this study, thermal cycling was conducted on multiple power modules simultaneously in order to assess the effect of thermal cycling on the degradation of the power module. In-situ monitoring of temperature was performed from inside each power module using high temperature thermocouples. Device imaging and characterization were performed along with temperature data analysis, to assess failure modes and mechanisms within the power modules. While the experiment aimed to assess the potential damage effects of thermal cycling on the die attach, results indicated that wire bond degradation was the life-limiting failure mechanism.


ChemSusChem ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 2240-2250 ◽  
Author(s):  
Lea de Biasi ◽  
Alexander Schiele ◽  
Maria Roca‐Ayats ◽  
Grecia Garcia ◽  
Torsten Brezesinski ◽  
...  

2011 ◽  
Vol 696 ◽  
pp. 63-69 ◽  
Author(s):  
Shigenari Hayashi ◽  
Isao Saeki ◽  
Yoshitaka Nishiyama ◽  
Takashi Doi ◽  
Shoji Kyo ◽  
...  

Very thin Fe-coatings, ~50nm, were found to suppress metastable Al2O3 formation on Fe-50Al and Ni-50Al alloys in our previous study. The authors proposed a mechanism whereby α-Al2O3 precipitates from the Al-saturated Fe2O3, which was formed during initial oxidation, since α-Al2O3 and α-Fe2O3 have isomorphous structures. In order to confirm the proposed mechanism, in-situ measurements were made of structural changes in the oxide scales formed on FeAl with and without Fe coating during heating and subsequent isothermal high temperature oxidation by synchrotron radiation with a two-dimensional X-ray detector. Diffraction peaks from Fe2O3 were initially observed at around 350°C on Fe-coated samples. The lattice parameter of the Fe2O3 initially increased linearly due to thermal expansion, but then rapidly decreased due to the formation of a solid solution of Fe2O3-Al2O3. α-Al2O3 started to appear at around 800°C, but no peaks from metastable Al2O3 were observed. The diffraction peaks from the α-Al2O3 on Fe-coated samples consisted of two distinct peaks, indicating that the α-Al2O3 had two different lattice parameters. These results suggest that the α-Al2O3 was formed not only by precipitation from the Al-saturated Fe2O3, but also by oxidation of Al in the substrate.


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