Experimental investigation on effective thermal conductivity of powder-packed assembly gaps in heat pipe cooled reactor core

2022 ◽  
Vol 388 ◽  
pp. 111611
Author(s):  
Li Tao ◽  
Du Zhengyu ◽  
He Hui ◽  
He Xiaoqiang ◽  
Qu Wenhai ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Reactor Core

Experimental Investigation of a Three-Layer Oscillating Heat Pipe

2014 ◽  
Vol 136 (5) ◽  
Author(s):  
C. D. Smoot ◽  
H. B. Ma
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Transport ◽  
Total Power ◽  
Oscillating Heat Pipe ◽  
Layer Effect ◽  
Layering Effect ◽  
Heat Transport Capability

An experimental investigation of a compact, triple-layer oscillating heat pipe (OHP) has been conducted to determine the channel layer effect on the heat transport capability in an OHP. The OHP has dimensions 13 mm thick, 229 mm long, and 76 mm wide embedded with two-independent closed loops forming three layers of channels. The unique design of the investigated OHP can be readily used to explore the channel layering effect on the heat transport capability in the OHP. The experimental results show that the addition of channel layers can increase the total power and at the same time, it can increase the effective thermal conductivity of the OHP. When the OHP switches from one layer of channels to two layers of channels, the highest effective thermal conductivity can be increased from 5760 W/mK to 26,560 W/mK. At the same time, the dryout limit can be increased. With three layers of channels, the OHP investigated herein can transport a power up to 8 kW with a heat flux level of 103 W/cm2 achieving an effective thermal conductivity of 33,170 W/mK.

Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers

1993 ◽  
Vol 115 (3) ◽  
pp. 751-756 ◽  
Author(s):  
G. P. Peterson ◽  
A. B. Duncan ◽  
M. H. Weichold
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Silicon Wafers ◽  
Temperature Gradients ◽  
Cover Plate ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels 45 μm wide and 80 μm deep and the other that used an anisotropic etching process to produce triangular channels 120 μm wide and 80 μm deep. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer and indicated that incorporating an array of micro heat pipes as an integral part of semiconductor devices could significantly increase the effective thermal conductivity; decrease the temperature gradients occurring across the wafer; decrease the maximum wafer temperatures; and reduce the number and intensity of localized hot spots. At an input power of 4 W, reductions in the maximum chip temperature of 14.1°C and 24.9°C and increases in the effective thermal conductivity of 31 and 81 percent were measured for the machined rectangular and etched triangular heat pipe arrays, respectively. In addition to reducing the maximum wafer temperature and increasing the effective thermal conductivity, the incorporation of the micro heat pipe arrays was found to improve the transient thermal response of the silicon test wafers significantly.

Experimental Investigation of Effective Thermal Conductivity for LHP Wicks

2010 ◽  
Author(s):  
Gongming Xin ◽  
Kehang Cui ◽  
Yan Chen ◽  
Wenjing Du ◽  
Yong Zou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Effective Thermal Conductivity ◽  
Pure Copper ◽  
Pure Nickel ◽  
Loop Heat Pipe ◽  
Porosity Level ◽  
Nickel Powders ◽  
Copper Powders ◽  
Reasonable Prediction

In this study, the effective thermal conductivity (ETC) of sintered loop heat pipe wicks, with pure nickel powders, pure copper powders, Ni-10wt%Cu powders and Ni-20wt%Cu powders were experimentally investigated. The ETC of sintered Ni-Cu wicks is found less than those of sintered pure nickel wick and sintered pure copper wicks. In the same porosity level, addition of copper into nickel will reduce ETC of the sintered Ni-Cu wicks. The sintered Ni-20wt%Cu wick presents the lowest ETC among the tested wick samples. Compared to experimental results, Alexander model can provide a reasonable prediction in some wick samples.

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson
Keyword(s):  
Thermal Conductivity ◽  
Steady State ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Temperature Gradients ◽  
Bottom Surface ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.

Experimental Investigation of Thermal Conduction Performance on Silicon-Based Micro Flat Heat Pipe

2015 ◽  
Vol 645-646 ◽  
pp. 1032-1037
Author(s):  
Cong Ming Li ◽  
Yi Luo ◽  
Chuan Peng Zhou ◽  
Liang Liang Zou ◽  
Xiao Dong Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Axial Direction ◽  
Filling Ratio ◽  
Parallel Structure ◽  
Working Fluid ◽  
Vacuum Degree ◽  
Structure Dimension

There are several factors that affect heat transfer of heat pipe, for example, structure dimension, filling ratio and vacuum degree of charging. This paper studied the thermal conductivity of micro flat heat pipes (MFHPs) with different structure dimension and with different filling ratio, when the charging vacuum degree of MFHP was decided. When electric power was 2W or 4W, MFHPs with parallel grooves and nonparallel grooves, charged by working fluid with different filling ratio, were carried out. And the filling ratio is 30%, 40% and 50%, respectively. The better thermal performance of MFHP can be evaluated by lower thermal resistance and higher effective thermal conductivity. The experiment results show that MFHP has the highest effective thermal conductivity when the filling ratio is 40%; and the thermal performance of MFHP with nonparallel structure in axial direction is better than that of MFHP with parallel structure.

Evaporation, Condensation, and Flow in an Idealized Micro Heat Pipe

2002 ◽  
Author(s):  
Jin Zhang ◽  
Harris Wong
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Rigorous Analysis ◽  
Evaporation And Condensation ◽  
Micro Heat Pipe ◽  
Complicated Geometry ◽  
Micro Heat Pipes

Micro heat pipes have been used in cooling micro electronic components. However their effective thermal conductivity is low compared with that of conventional heat pipes. Due to the complexity of the coupled heat and mass transport, and to the complicated three-dimensional bubble geometry inside micro heat pipes, there is a lack of rigorous analysis. As a result, the relatively low effective thermal conductivity remains unexplained. We have conceptualized an idealized micro heat pipe that eliminates the complicated geometry, but retains the essential physics. Given the simplified geometry, many effects can be studied, such as thermocapillary flow, and evaporation and condensation physics. In this talk, we will present the flow field induced by evaporation.

Experimental Investigation of Graphene Oxide Nanofluids on Thermal Performance of Heat Pipe

2019 ◽  
Author(s):  
Weilin Zhao ◽  
Jun Xu ◽  
Jinkai Li
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Air Cooling ◽  
Coating Film ◽  
Water Cooling ◽  
Condenser Section ◽  
Wick Structure

Abstract The graphene oxide-deionized water (GO-DW) and graphene oxide-ethylence glycol (GO-EG) nanofluids were synthesized. The better suspension of nanofluids was achieved. The thermal conductivity of both nanofluids was analyzed. It indicates that GO nanoparticles can strengthen the thermal conductivity of DW base fluids by 22.6%–61.7% and EG base fluids by 15.3%–32.8%. Four copper heat pipes charged with GO-DW and GO-EG nanofluids as well as DW and EG base fluids were experimentally researched, it is discovered that the addition of GO nonoparticles in heat pipe can elevate the condenser wall temperature and reduce the temperature difference. Future analysis finds that, with respect to DW and EG fluids heat pipe, the thermal resistances of GO-DW and GO-EG nanofluids heat pipe are respectively decreased 42.6–52.4% and 31.9%–38.4% for air cooling, and 15.5–16.7% and 11.5%–18.9% for water cooling at condenser section. Besides, the wick structure of GO-DW nanofluids heat pipe was examined by Scanning Electron Microscope, and the effective thermal conductivity of fluid-wick combination was evaluated. The outcomes demonstrate that the evaporator wick surface contains about 0375–1.24μm coating film of GO nanoparticles. Assumed the coating film is 0.75μm, the effective thermal conductivity of fluid-wick combination is respectively enhanced by 66.92 % for GO-DW nonofluids heat pipe and 37.32% for GO-EG nonofluids heat pipe at 70 °C.

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