Experimental Investigation of Graphene Oxide Nanofluids on Thermal Performance of Heat Pipe

2019 ◽  
Author(s):  
Weilin Zhao ◽  
Jun Xu ◽  
Jinkai Li
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Air Cooling ◽  
Coating Film ◽  
Water Cooling ◽  
Condenser Section ◽  
Wick Structure

Abstract The graphene oxide-deionized water (GO-DW) and graphene oxide-ethylence glycol (GO-EG) nanofluids were synthesized. The better suspension of nanofluids was achieved. The thermal conductivity of both nanofluids was analyzed. It indicates that GO nanoparticles can strengthen the thermal conductivity of DW base fluids by 22.6%–61.7% and EG base fluids by 15.3%–32.8%. Four copper heat pipes charged with GO-DW and GO-EG nanofluids as well as DW and EG base fluids were experimentally researched, it is discovered that the addition of GO nonoparticles in heat pipe can elevate the condenser wall temperature and reduce the temperature difference. Future analysis finds that, with respect to DW and EG fluids heat pipe, the thermal resistances of GO-DW and GO-EG nanofluids heat pipe are respectively decreased 42.6–52.4% and 31.9%–38.4% for air cooling, and 15.5–16.7% and 11.5%–18.9% for water cooling at condenser section. Besides, the wick structure of GO-DW nanofluids heat pipe was examined by Scanning Electron Microscope, and the effective thermal conductivity of fluid-wick combination was evaluated. The outcomes demonstrate that the evaporator wick surface contains about 0375–1.24μm coating film of GO nanoparticles. Assumed the coating film is 0.75μm, the effective thermal conductivity of fluid-wick combination is respectively enhanced by 66.92 % for GO-DW nonofluids heat pipe and 37.32% for GO-EG nonofluids heat pipe at 70 °C.

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson
Keyword(s):  
Thermal Conductivity ◽  
Steady State ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Temperature Gradients ◽  
Bottom Surface ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.

Evaporation, Condensation, and Flow in an Idealized Micro Heat Pipe

2002 ◽  
Author(s):  
Jin Zhang ◽  
Harris Wong
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Rigorous Analysis ◽  
Evaporation And Condensation ◽  
Micro Heat Pipe ◽  
Complicated Geometry ◽  
Micro Heat Pipes

Micro heat pipes have been used in cooling micro electronic components. However their effective thermal conductivity is low compared with that of conventional heat pipes. Due to the complexity of the coupled heat and mass transport, and to the complicated three-dimensional bubble geometry inside micro heat pipes, there is a lack of rigorous analysis. As a result, the relatively low effective thermal conductivity remains unexplained. We have conceptualized an idealized micro heat pipe that eliminates the complicated geometry, but retains the essential physics. Given the simplified geometry, many effects can be studied, such as thermocapillary flow, and evaporation and condensation physics. In this talk, we will present the flow field induced by evaporation.

scholarly journals CHARACTERIZATION OF HEAT CONDUCTIVITY OF ECCENTRICALLY ROTATING HEAT PIPES USED FOR COOLING OF MOTOR SPINDLES

2021 ◽  
Vol 2021 (3) ◽  
pp. 4698-4705
Author(s):  
B. Denkena ◽  
◽  
B. Bergmann ◽  
K. Kono ◽  
R. Ishiguro ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Heat Exchangers ◽  
Thermal Characteristics ◽  
Heat Pipes ◽  
Simulation Based ◽  
Wick Structure ◽  
Parameter Values

Heat losses within motor spindles lead to undesired effects such as machining inaccuracies and de-creasing lifetime of the motor and bearings. To reduce thermal loads, complex shaft cooling concepts with costly sealing techniques exist. For this reason, a novel, less costly cooling concept has been de-veloped based on heat pipes with high thermal conductivity and fin-shaped heat exchangers. The de-sign and integration of these heat exchanger elements into a motor spindle is carried out using the fi-nite element method. The aim is to optimize the efficiency of the heat pipes and heat exchangers for optimal shaft cooling performance. For a simulation-based development of a prototype spindle, un-known thermal characteristics of the heat transfer elements must be determined. In this paper, the de-termination of the thermal conductivity of the heat pipes is described. The determination of conductivi-ty is done experimentally. First, the developed test rig and the applied procedure for the determination of the conductivity are shown. Subsequently, the experimental results are presented and discussed. Two types of heat pipes were analyzed: Copper heat pipes with sintered wick structure and nickel-plated copper heat pipes with axial grooves. The influences of rotational speed, heat flow rates and the angle between the heat pipe and main axis of rotation were investigated. The results indicate a distinct dependency of the conductivity on the varied parameters. However, changes of parameter values have very different quantitative and qualitative effects on the determined conductivities de-pending on the type of heat pipe.

A Titanium Based Flat Heat Pipe

2008 ◽  
Author(s):  
Changsong Ding ◽  
Gaurav Soni ◽  
Payam Bozorgi ◽  
Brian Piorek ◽  
Carl D. Meinhart ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
Heat Pipe ◽  
Carrying Capacity ◽  
High Aspect Ratio ◽  
Capillary Flow ◽  
Titanium Substrate ◽  
Heat Pipes ◽  
Working Fluid ◽  
Wick Structure

We are developing innovative heat pipes based on Nano-Structured Titania (NST) with a potential for high heat carrying capacity and high thermal conductivity. These heat pipes have a flat geometry as opposed to a cylindrical geometry found in conventional heat pipes. The flatness will enable a good contact with microprocessor chips and thus reduce the thermal contact resistance. We refer to it as a Thermal Ground Plane (TGP) because of its flat and thin geometry. It will provide the ability to cool the future generations of power intensive microprocessor chips and circuit boards in an efficient way. It also brings the potential to function in high temperature (>150°C) fields because of its high yield strength and compatibility [1]. The TGP is fabricated with Titanium. It adopts the recently developed high aspect ratio Ti processing techniques [2] and laser packaging techniques. The three main components of the TGP are 1) a fine wick structure based on arrays of high aspect ratio Ti pillars and hair like structures of Nano-Structured Titania (NST), 2) A shallow Ti cavity welded onto the wick structure and 3) the working fluid, water, sealed between the cavity and the wick. The heat carrying capacity and the thermal conductivity of a heat pipe are generally determined by the speed of capillary flow of the working fluid through its wick. The TGP wick has the potential to generate high flow rates and to meet the growing challenges faced by electronics cooling community. The TGP wick structure, developed by etching high aspect ratio pillars in a titanium substrate and growing nano scale hairs on the surface of the pillars, is super hydrophilic and capable of wicking water at velocities ∼ 10−2 m/s over distances of several centimeters. The thermal conductivity of the current TGP device was measured to be k = 350 W/m·K. The completed TGP device has the potential of attaining a higher conductivity by improving the wicking material and of carrying higher power density. Washburn equation [3] for dynamics of capillary flow has been employed to explain the results of our experiments. The experiment shows a good agreement with Washburn equation.

Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers

1993 ◽  
Vol 115 (3) ◽  
pp. 751-756 ◽  
Author(s):  
G. P. Peterson ◽  
A. B. Duncan ◽  
M. H. Weichold
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Silicon Wafers ◽  
Temperature Gradients ◽  
Cover Plate ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels 45 μm wide and 80 μm deep and the other that used an anisotropic etching process to produce triangular channels 120 μm wide and 80 μm deep. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer and indicated that incorporating an array of micro heat pipes as an integral part of semiconductor devices could significantly increase the effective thermal conductivity; decrease the temperature gradients occurring across the wafer; decrease the maximum wafer temperatures; and reduce the number and intensity of localized hot spots. At an input power of 4 W, reductions in the maximum chip temperature of 14.1°C and 24.9°C and increases in the effective thermal conductivity of 31 and 81 percent were measured for the machined rectangular and etched triangular heat pipe arrays, respectively. In addition to reducing the maximum wafer temperature and increasing the effective thermal conductivity, the incorporation of the micro heat pipe arrays was found to improve the transient thermal response of the silicon test wafers significantly.

Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures

2009 ◽  
Author(s):  
Pramod Chamarthy ◽  
H. Peter J. de Bock ◽  
Boris Russ ◽  
Shakti Chauhan ◽  
Brian Rush ◽  
...  
Keyword(s):  
Heat Pipe ◽  
High Performance ◽  
Gravitational Force ◽  
Driving Forces ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
High Permeability ◽  
Permeability Characteristics ◽  
Wick Structure ◽  
Initial Results

Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick’s capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.

Experimental Investigation of Thermal Conduction Performance on Silicon-Based Micro Flat Heat Pipe

2015 ◽  
Vol 645-646 ◽  
pp. 1032-1037
Author(s):  
Cong Ming Li ◽  
Yi Luo ◽  
Chuan Peng Zhou ◽  
Liang Liang Zou ◽  
Xiao Dong Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Axial Direction ◽  
Filling Ratio ◽  
Parallel Structure ◽  
Working Fluid ◽  
Vacuum Degree ◽  
Structure Dimension

There are several factors that affect heat transfer of heat pipe, for example, structure dimension, filling ratio and vacuum degree of charging. This paper studied the thermal conductivity of micro flat heat pipes (MFHPs) with different structure dimension and with different filling ratio, when the charging vacuum degree of MFHP was decided. When electric power was 2W or 4W, MFHPs with parallel grooves and nonparallel grooves, charged by working fluid with different filling ratio, were carried out. And the filling ratio is 30%, 40% and 50%, respectively. The better thermal performance of MFHP can be evaluated by lower thermal resistance and higher effective thermal conductivity. The experiment results show that MFHP has the highest effective thermal conductivity when the filling ratio is 40%; and the thermal performance of MFHP with nonparallel structure in axial direction is better than that of MFHP with parallel structure.

Investigation on the Use of Nanofluids to Enhance Heat Pipe Performance

Solar Energy ◽  
2005 ◽  
Author(s):  
Tomer Israeli ◽  
T. Agami Reddy ◽  
Young I. Cho
Keyword(s):  
Thermal Conductivity ◽  
Surface Tension ◽  
Thermal Resistance ◽  
Copper Oxide ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Experimental Studies ◽  
Heat Pipes ◽  
Thermal Network ◽  
Overall Resistance

This paper reports on preliminary experimental results on using nanofluids to enhance the thermal performance of heat pipes. Our experience with preparing copper oxide (CuO) nanofluids is described. Contrary to earlier studies which report infinite shelf life, we found that nanofluid stability lasted for about three weeks only; an issue which merits further study. We have also conducted various experiments to measure the variation of thermal conductivity and surface tension with CuO nanofluid concentration. Actual experiments on nanofluid heat pipes were also performed which indicated an average 12.5% decrease in the overall thermal resistance of the heat pipe using nanofluid of 3% vol concentration. This observed improvement is fairly consistent with our predictions using a simple analytical thermal network model for heat pipe overall resistance and the measured nanofluid conductivity. The results, though encouraging, need more careful and elaborate experimental studies before the evidence can be deemed conclusive.

scholarly journals Thermal analysis of heat pipe using self rewetting fluids

2011 ◽  
Vol 15 (3) ◽  
pp. 879-888 ◽  
Author(s):  
Rathinasamy Senthilkumar ◽  
Subaiah Vaidyanathan ◽  
Sivaramanb Balasubramanian
Keyword(s):  
Surface Tension ◽  
Heat Pipe ◽  
Heat Transport ◽  
Pure Water ◽  
Heat Pipes ◽  
The Self ◽  
Working Fluid ◽  
Surface Tension Gradient ◽  
Condenser Section ◽  
Maximum Heat

This paper discuses the use of self rewetting fluids in the heat pipe. In conventional heat pipes, the working fluid used has a negative surface-tension gradient with temperature. It is an unfavourable one and it decreases the heat transport between the evaporator section and the condenser section. Self rewetting fluids are dilute aqueous alcoholic solutions which have the number of carbon atoms more than four. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature up to a certain limit. The experiments are conducted to improve the heat-transport capability and thermal efficiency of capillary assisted heat pipes with the self rewetting fluids like aqueous solutions of n-Butanol and n-Pentanol and its performance is compared with that of pure water. The n-Butanol and n-Pentanol are added to the pure water at a concentration of 0.001moles/lit to prepare the self rewetting fluids. The heat pipes are made up of copper container with a two-layered stainless steel wick consisting of mesh wrapped screen. The experimental results show that the maximum heat transport of the heat pipe is enhanced and the thermal resistances are considerably decreased than the traditional heat pipes filled with water. The fluids used exhibit an anomalous increase in the surface tension with increasing temperature.

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