Effect of grain size on ultrasonic softening of pure aluminum

Ultrasonics ◽  
2015 ◽  
Vol 63 ◽  
pp. 111-117 ◽  
Author(s):  
F. Ahmadi ◽  
M. Farzin ◽  
M. Mandegari
Keyword(s):  
Grain Size ◽  
Pure Aluminum ◽  
Ultrasonic Softening

Texture and Microstructure Effects on Electromigration Behavior of Aluminum Metallization

1991 ◽  
Vol 225 ◽  
Author(s):  
D. B. Knorr ◽  
K. P. Rodbell ◽  
D. P. Tracy
Keyword(s):  
Grain Size ◽  
Standard Deviation ◽  
Pure Aluminum ◽  
Time To Failure ◽  
X Ray Diffraction ◽  
Aluminum Films ◽  
Failure Data ◽  
Transmission Electron ◽  
Aluminum Metallization ◽  
Microstructure Effects

ABSTRACTPure aluminum films are deposited under a variety of conditions to vary the crystallographic texture. After patterning and annealing at 400°C for 1 hour, electromigration tests are performed at several temperatures. Failure data are compared on the basis of t50 and standard deviation. Microstructure is quantified by transmission electron microscopy for grain size and grain size distribution and by X-ray diffraction for texture. A strong (111) texture significantly improves the electromigration lifetime and decreases the standard deviation in time to failure. This improvement correlates with both the fraction and sharpness of the (111) texture component.

Microstructure and Mechanical Properties of Twist Extruded Pure Aluminum Processed by Post-Rolling

2011 ◽  
Vol 264-265 ◽  
pp. 183-187 ◽  
Author(s):  
S. Ranjbar Bahadori ◽  
Seyed Ali Asghar Akbari Mousavi ◽  
A.R. Shahab
Keyword(s):  
Grain Size ◽  
Pure Aluminum ◽  
Rolling Process ◽  
Extrusion Process ◽  
Ultrafine Grained ◽  
Twist Extrusion ◽  
Aluminum Sample ◽  
Deformation Processes ◽  
Ultrafine Grained Materials ◽  
Extrusion Method

Interest in processing of bulk ultrafine-grained materials has grown significantly over the last years. Severe plastic deformation processes such as twist extrusion have been the essence of these researches and used to decrease the bulk grain size. The bulk gain size can reduce if twist extrusion process combines with a conventional forming technique. In this study, the effects of reduction by employing the rolling process after the twist extrusion method were considered. The twist extrusion process of the commercially pure aluminum sample was carried out using a twisted die with 60º die angle, and the samples were processed through rolling subsequently. As a result of rolling, average microstructure grain size decreased significantly and the hardness amount increased accordingly

scholarly journals Investigation on grain size effect in high strain rate ductility of 1100 pure aluminum

2017 ◽  
Author(s):  
N. Bonora ◽  
N. Bourne ◽  
A. Ruggiero ◽  
G. Iannitti ◽  
G. Testa
Keyword(s):  
Grain Size ◽  
Size Effect ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Pure Aluminum ◽  
Grain Size Effect

Effect of Copper Addition to Aluminum on its Metallurgical, Mechanical Characteristics and Surface Roughness after Rolling

2016 ◽  
Vol 689 ◽  
pp. 12-16
Author(s):  
Adnan I.O. Zaid ◽  
Safwan M.A. Al-Qawabah
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Surface Quality ◽  
Pure Aluminum ◽  
Weight Ratio ◽  
Rolling Process ◽  
Copper Addition ◽  
Commercially Pure ◽  
Effect Of Copper ◽  
Cast Condition

Aluminum and its alloys are widely used materials in industrial and engineering applications. They are second in use after steel due to their attractive properties e.g. strength-to-weight ratio, their electrical and thermal conductivities, and corrosion resistance. However, against these attractive properties commercially pure aluminum has certain limitations in the cast condition because it solidifies in large grain size columnar structure which reduces its mechanical strength and surface quality. It is, therefore, always alloyed with other elements to reduce or eliminate these defects. In this paper, the effect of copper addition at a rate of 4% Wt. to commercially pure aluminum both in the cast and after rolling conditions is investigated. Aluminum sheets and aluminum-4% copper sheets were cold rolled in three successive passes, from 4 mm to 3mm to 1.3 mm. After each pass, the grain size, Vickers micro-hardness and surface roughness were determined and discussed. It was found that addition of 4% Cu to commercially pure Al in the cast condition resulted in refining its microstructure both in the cast and after rolling conditions. Furthermore, the rolling process resulted in enhancement of the surface quality only after the first and second passes.

Effect of 4% Cu Addition to Commercially Pure Aluminum Grain Refined by 0.15% V on its Ductility and Surface Roughness

2017 ◽  
Vol 887 ◽  
pp. 116-121
Author(s):  
Safwan M. Al-Qawabah ◽  
Adnan I.O. Zaid ◽  
Nabeel Alshabatat
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Tensile Strength ◽  
Ultimate Tensile Strength ◽  
Surface Quality ◽  
Pure Aluminum ◽  
Commercially Pure ◽  
Pronounced Reduction

In this paper, the effect of addition of 4%wt. copper to commercially pure aluminum grain refined by 0.15% vanadium on its grain size, hardness, ultimate tensile strength, UTS, ductility and surface roughness is investigated. It is found that when they are added individually or together causes pronounced reduction in grain size, i.e., effective refiners. Similarly, they increase its hardness and ultimate tensile strength but reduce its ductility. Regarding their effect on the surface quality, they enhance the surface quality if added individually. However, they reduce it if added together, i.e. they increase its surface roughness.

scholarly journals Texture and Microtexture of Pure (6N) and Commercially Pure Aluminum after Deformation by Extrusion with Forward-Backward Rotating Die (Kobo)

2016 ◽  
Vol 61 (1) ◽  
pp. 461-468 ◽  
Author(s):  
M. Bieda ◽  
S. Boczkal ◽  
P. Koprowski ◽  
K. Sztwiertnia ◽  
K. Pieła
Keyword(s):  
Electron Microscopy ◽  
Grain Size ◽  
Electron Backscatter Diffraction ◽  
Pure Aluminum ◽  
Pure Aluminium ◽  
Commercially Pure ◽  
Transmission Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Crystallographic Orientations

Pure aluminium (6N) and commercially pure aluminium (99.7) was deformed by KOBO method. Microstructure and texture of both materials after deformation was analyzed by means of scanning and transmission electron microscopy. Advanced methods of crystallographic orientations measurements like Electron Backscatter Diffraction - EBSD (SEM) and microdiffraction (TEM) was used. Grain size distribution and misorientation between grains in cross and longitudinal sections of the samples were analyzed. Differences in size and homogeneity of the grains were observed in both materials. Pure aluminium was characterized by larger grain size in both sections of extruded material. Whereas commercially pure aluminium reveals smaller grain size and more homogeneous and stable microstructure.

Effect of Line Width on Electromigration of Textured Pure Aluminum Films

1993 ◽  
Vol 309 ◽  
Author(s):  
D.B. Knorr ◽  
K.P. Rodbell
Keyword(s):  
Grain Size ◽  
Line Width ◽  
Pure Aluminum ◽  
Narrow Line ◽  
Dominant Effect ◽  
Aluminum Films ◽  
Narrow Line Width ◽  
Failure Distribution ◽  
Texture Effect ◽  
Line Widths

AbstractThree conditions of pure aluminum films were deposited, patterned into electromigration test structures, and annealed at 400°C for I hour. The grain size distribution was essentially the same for all conditions, but the textures were substantially different. Electromigration failure distributions were developed at 225°C and 1 MA/cm2 for line widths of both 1.8 μm and 0.5 μm. Three conditions were tested at the wider line width while the strongest and weakest textures were evaluated in the narrow line width. Texture exerts a dominant effect at the wider line width where the lines are polycrystalline. The values of t50 increase as texture becomes stronger although σ varies from <0.5 for strong textures to >1 for a bimodal failure distribution in the weakest texture. In the narrow lines, the texture effect is substantially reduced, and the failure distributions are bimodal with a few early fails followed by a monomodal distribution characterized by a low cr. The electromigration behavior is discussed in terms of both texture and the line width to grain size ratio.

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