A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill

2000 ◽  
Vol 40 (7) ◽  
pp. 1191-1198 ◽  
Author(s):  
D.J. Xie
Keyword(s):  
Fatigue Life ◽  
Experimental Method ◽  
Flip Chip ◽  
Solder Joints ◽  
Creep Fatigue

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

1998 ◽  
Vol 120 (4) ◽  
pp. 322-327 ◽  
Author(s):  
H. Doi ◽  
K. Kawano ◽  
A. Yasukawa ◽  
T. Sato
Keyword(s):  
Mechanical Properties ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Failure Mode ◽  
Flip Chip ◽  
Solder Joints ◽  
Alumina Substrate ◽  
Heat Spreader ◽  
Flip Chips ◽  
Heat Spreaders

The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.

Analysis of Stress Distribution in SnAgCu Solder Joint

2006 ◽  
Vol 5-6 ◽  
pp. 359-366 ◽  
Author(s):  
J. Gong ◽  
C. Liu ◽  
P.P. Conway ◽  
Vadim V. Silberschmidt
Keyword(s):  
Residual Stresses ◽  
Flip Chip ◽  
Solder Joints ◽  
Electronic Packages ◽  
Snagcu Solder ◽  
Snpb Solder ◽  
Creep Fatigue ◽  
Element Approach ◽  
Reliability Of Solder Joints ◽  
Free Material

SnAgCu solder is a promising lead-free material for interconnections in electronic packages. However, its melting temperature (490°K) is considerably higher than that of the traditional SnPb solder (456°K). At the same time, SnAgCu has much better creep resistance at high temperature. These properties may cause large residual stresses during manufacturing processes due to the mismatch of thermal properties of electronic components that can influence the reliability of solder joints in electronic packages. This paper studies the residual stresses in solder joints in a flip chip package under different cooling conditions and their influence on the subsequent cyclic test by means of a finite element approach. The results show that the initial temperature of 453°K is high enough to induce residual stresses due to manufacturing procedures. Simulations, based on traditional creep-fatigue models, demonstrate that the residual stresses affect the mechanical behaviour of solder joints in several initial thermal cycles but have little effect on their reliability.

The Creep-Fatigue Interaction in Solders and Solder Joints

1990 ◽  
Vol 112 (2) ◽  
pp. 100-103 ◽  
Author(s):  
D. S. Stone
Keyword(s):  
Fatigue Crack ◽  
Fatigue Life ◽  
Solder Joints ◽  
Fatigue Cracks ◽  
Solution Concentration ◽  
Grain Boundary Sliding ◽  
Cycle Frequency ◽  
Low Frequencies ◽  
Creep Fatigue ◽  
Failure Life

Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder and substrate. Either an intragranular or intergranular path may be taken depending upon conditions of loading. Intragranular fatigue dominates when the cycle frequency is high, in which case failure life is governed by the Coffin-Manson law. Intergranular failure occurs at low frequencies because grain boundary sliding at low frequencies allows the grain boundaries to become exposed to the atmosphere, which in turn causes oxidation. This model predicts the effects of frequency, strain amplitude, and grain size on fatigue life. In the second model, the fatigue crack travels within the interface region between solder and substrate. Here, the strain introduced in the solder joint during fatigue is not relevant; instead, the stress transferred to the interface is more important. The second model considers the effect of solid solution concentration on fatigue life. The predictions of both models agree reasonably well with published fatigue data from solders and solder joints.

Selection of Proper Fatigue Model for Flip Chip Package Reliability

2005 ◽  
Vol 502 ◽  
pp. 393-398 ◽  
Author(s):  
Young Eui Shin ◽  
Yeon Sung Kim ◽  
Hyoung-Il Kim ◽  
Jong Min Kim ◽  
Kyong Ho Chang ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Flip Chip ◽  
Constitutive Models ◽  
Experimental Result ◽  
Element Analysis ◽  
Cross Sectional ◽  
Joint Reliability ◽  
Fatigue Model ◽  
Creep Fatigue ◽  
Number Of Cycles

There have been diverse fatigue models and approaches to properly estimate solder joint reliability. However, it is one of the most difficult problems to determine which solder constitutive models and fatigue models can be applied best. In this paper, both viscoplastic and elastic-plastic-creep solder constitutive models could be utilized to calculate accumulated inelastic response under 208 K to 423 K(-65 °C to 150 °C) thermal cycling condition. And two different fatigue models, Darveaux and creep-fatigue model were applied to find solder joints fatigue life for flip chip assembly. Moreover, each fatigue life was compared to experimental result for the validation of finite element analysis. The actual number of cycles to failure was obtained from cross sectional view of the package with SEM.

Optimization of Copper Column Flip Chip Packages Incorporating a Variable Interconnect Compliance Configuration

2007 ◽  
Author(s):  
Andrew A. O. Tay ◽  
Siow Ling Ho
Keyword(s):  
Fatigue Life ◽  
Flip Chip ◽  
Solder Joints ◽  
Wafer Level ◽  
Elastic Plastic ◽  
Creep Analysis ◽  
Reliability Of Solder Joints ◽  
The Impact ◽  
Plastic Creep ◽  
Copper Column

This paper describes a parametric study of the reliability of solder joints in wafer level flip chip packages that employ copper column interconnects. In this study, the impact of the change in the compliance of the copper column interconnects on the fatigue life of the solder joints were investigated by varying the diameter of the copper column interconnects. 2-D elastic-plastic finite element analyses were carried out on packages with constant interconnect diameter as well as those with variable interconnect diameters within the same package. The effect of changing the pitch and the pad size were also studied. It was found that an effective strategy in increasing the fatigue life and hence the reliability of the solder joints is by distributing copper columns of lower compliance (greater diameter) near the center of the package and increasing the compliance of the copper columns (decreasing their diameter) towards the perimeter of the chip package. In addition, elastic-plastic-creep analysis was also performed on the packages. It was observed that the results from the elastic-plastic analysis and the elastic-plastic-creep analysis exhibit the same trend.

scholarly journals Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Energies ◽  
2019 ◽  
Vol 12 (12) ◽  
pp. 2391 ◽  
Author(s):  
Liangyu Wu ◽  
Xiaotian Han ◽  
Chenxi Shao ◽  
Feng Yao ◽  
Weibo Yang
Keyword(s):  
Fatigue Life ◽  
Ambient Temperature ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Thermal Loading ◽  
Solder Joints ◽  
Power Conversion ◽  
Cyclic Thermal Loading ◽  
Thermal Fatigue Life ◽  
Conversion Time

Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Under cyclic thermal loading, a theoretical heat transfer and thermal stress model is developed for the flip chip components and the thermal fatigue lives of flip chip component solder joints are analyzed. The model based simulation results show the effects of environmental and power parameters on thermal fatigue life. It is indicated that under cyclic thermal loading, the solder joint with the shortest life in a package of flip chip components is located at the outer corner point of the array. Increment in either power density or ambient temperature or the decrease in either power conversion time or ambient pressure will result in short thermal fatigue lives of the key solder joints in the flip chip components. In addition, thermal fatigue life is more sensitive to power density and ambient temperature than to power conversion time and ambient air pressure.

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

2020 ◽  
Vol 234 (21) ◽  
pp. 4277-4287 ◽  
Author(s):  
Ayda Halouani ◽  
Abel Cherouat ◽  
Mariem Miladi Chaabane ◽  
Mohamed Haddar
Keyword(s):  
Fatigue Life ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Microscopy Imaging ◽  
Damage Initiation ◽  
Low Profile ◽  
Quad Flat Package ◽  
Initiation And Propagation ◽  
Creep Fatigue

An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been calculated according to a strain life Coffin–Manson and energy-based Morrow fatigue models. Scanning electron microscopy imaging at the end of thermal cycle was used to evaluate the damage initiation and propagation. The effect of the solder volume on fatigue life of solder joints was discussed. Through analyses of theoretical results and experimental data on fatigue life, cracks initiation and propagation have been highlighted and their possible causes have been discussed.

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