Thermal conductivity and dielectric constant of spark plasma sintered aluminum nitride

2003 ◽  
Vol 347 (1-2) ◽  
pp. 300-305 ◽  
Author(s):  
K.A Khor ◽  
K.H Cheng ◽  
L.G Yu ◽  
F Boey
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Aluminum Nitride ◽  
Sintered Aluminum ◽  
Spark Plasma

Effect of Silicon Compounds on the Properties of Pressureless Sintered Aluminum Nitride

2014 ◽  
Vol 602-603 ◽  
pp. 565-569
Author(s):  
Chang Lu Fu ◽  
Shang Hua Wu ◽  
Yan Ling Cheng ◽  
Jun Yu Fu ◽  
Ruo Jun Wu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Aluminum Nitride ◽  
Fracture Mode ◽  
Room Temperature ◽  
Pressureless Sintering ◽  
Sintering Aids ◽  
Silicon Compounds ◽  
Sintered Aluminum ◽  
Microstructure Density

In this paper, the aluminum nitride (AlN) was fabricated by pressureless sintering with YF3 and various silicon compounds as the sintering aids. The phase, microstructure, density and thermal conductivity were characterized by XRD, SEM and laser thermal diffusivity method. The sample densities were detected varied from 3.17 to 3.30g/cm3 and room-temperature thermal conductivity varied from 196 to 233 W/m·K. Samples sintered with YF3 additives have the highest thermal conductivity. The sintering aids with SiO2, Si3N4 and SiC would decrease the density and the thermal conductivity obviously, and also change the fracture mode from the intergranular to transgranular , which is a key for the toughness of the AlN substrate.

Aluminum Nitride fibers from a Thermoplastic Organoaluminum Precursor

1987 ◽  
Vol 108 ◽  
Author(s):  
John D. Bolt ◽  
Fred N. Tebbe
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Thermal Expansion ◽  
High Temperature ◽  
Aluminum Nitride ◽  
Melt Spinning ◽  
Elevated Temperatures ◽  
Fine Particles ◽  
Bulk Ceramic ◽  
Higher Temperature

ABSTRACTA new organoaluminum polymer (EtAINH)n(Et2AlNH2)m·AlEt3 derived from triethylaluminum and ammonia, is thermoplastic at elevated temperatures and a glassy solid at ambient temperature. As a thermoplastic it can be processed in certain shapes, solidified, cured and transformed to dense aluminum nitride with retention of its shape. Aluminum nitride fibers are prepared by melt spinning the polymer, pyrolyzing in ammonia and at high temperature in nitrogen. The AlN microstructure forms as very fine particles at 400–600°C, coarsens at higher temperature, and densifies at 1600–1800 °C into polycrystalline AlN with submicron grains. Mechanical strength, thermal expansion and dielectric constant are consistent with bulk ceramic values. Initial thermal conductivity deduced from composite measurements is 82 W/m°K in fibers containing 0.5 to 1.0 percent oxygen.

Antiphase domain boundaries in liquid-phase sintered aluminum nitride

1988 ◽  
Vol 46 ◽  
pp. 576-577
Author(s):  
R.A. Youngman
Keyword(s):  
Thermal Conductivity ◽  
Liquid Phase ◽  
Aluminum Nitride ◽  
Integrated Circuit ◽  
Charge Compensation ◽  
Antiphase Domain ◽  
Liquid Phase Sintering ◽  
Oxide Surface ◽  
Sintered Aluminum ◽  
Domain Boundaries

Liquid phase sintering of aluminum nitride is currently being developed for the production of Integrated circuit substrates In high power applications due to the high Inherent thermal conductivity of AIN. The sintering is usually conducted with oxide additives which form low melting eutectic compositions with AIN and its ever-present oxide surface layer. In this study Y2O3 (1-2wt/o) has been utilized for liquid phase formation where the eutectic compositions Y3Al5O12, YAlO3, and Al2Y4O9 form by reaction with “A12O3” on the surface of the AIN. The AIN particles themselves will contain oxygen (˜l-2wt/o)and this is also availible for reaction although not as readily since It has been accomodated In the bulk crystal. Since It has been established that the thermal conductivity of the resulting ceramic is controlled by the lattice oxygen content, which In turn controls the number of aluminum vacancies due to charge compensation, It Is important to understand the defect structure developed during sintering.

Mullite Ceramics for the Application to Advanced Packaging Technology

1989 ◽  
Vol 154 ◽  
Author(s):  
Jun Tanaka ◽  
Satoshi Kajita ◽  
Masami Terasawa
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Thermal Expansion ◽  
Aluminum Nitride ◽  
Heat Sink ◽  
High Thermal Conductivity ◽  
System A ◽  
Lower Dielectric Constant ◽  
Advanced Packaging ◽  
Mullite Ceramics

AbstractMullite ceramics were developed for multilayered packages, which have a lower dielectric constant and a nearer thermal expansion to that of silicon than those of alumina. The multilayered mullite packages are manufactured by using a similar cofired technology with tungsten or molybdenum to the conventionally used alumina system. A new brazing material and a new lead material were developed to be combined with the mullite ceramics Multilayered mullite packages with a brazed aluminum nitride heat sink, which has a high thermal conductivity, were developed to compensate a low thermal conductivity of the mullite itself. The packages are one of the highest performance packages.

A Study of Some Mechanical and Physical Properties for Palm Fiber/Polyester Composite

2020 ◽  
Vol 38 (3B) ◽  
pp. 104-114
Author(s):  
Samah M. Hussein
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Date Palm ◽  
Volume Fraction ◽  
Unsaturated Polyester ◽  
Dielectric Strength ◽  
Palm Fiber ◽  
Mechanical And Physical Properties ◽  
Polyester Composite

This research has been done by reinforcing the matrix (unsaturated polyester) resin with natural material (date palm fiber (DPF)). The fibers were exposure to alkali treatment before reinforcement. The samples have been prepared by using hand lay-up technique with fiber volume fraction of (10%, 20% and 30%). After preparation of the mechanical and physical properties have been studied such as, compression, flexural, impact strength, thermal conductivity, Dielectric constant and dielectric strength. The polyester composite reinforced with date palm fiber at volume fraction (10% and 20%) has good mechanical properties rather than pure unsaturated polyester material, while the composite reinforced with 30% Vf present poor mechanical properties. Thermal conductivity results indicated insulator composite behavior. The effect of present fiber polar group induces of decreasing in dielectric strength, and increasing dielectric constant. The reinforcement composite 20% Vf showed the best results in mechanical, thermal and electrical properties.

Densification and Thermal Conductivity of Y2O3-Doped AlN Ceramics by Spark Plasma Sintering

2007 ◽  
Vol 352 ◽  
pp. 227-231 ◽  
Author(s):  
Qiang Shen ◽  
Z.D. Wei ◽  
Mei Juan Li ◽  
Lian Meng Zhang
Keyword(s):  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Spark Plasma Sintering ◽  
Particle Surface ◽  
Boundary Phase ◽  
Homogeneous Microstructure ◽  
Densification Mechanism ◽  
Sintering Additive ◽  
Plasma Sintering ◽  
Spark Plasma

AlN ceramics doped with yttrium oxide (Y2O3) as the sintering additive were prepared via the spark plasma sintering (SPS) technique. The sintering behaviors and densification mechanism were mainly investigated. The results showed that Y2O3 addition could promote the AlN densification. Y2O3-doped AlN samples could be densified at low temperatures of 1600-1700oC in 20-25 minutes. The AlN samples were characterized with homogeneous microstructure. The Y-Al-O compounds were created on the grain boundaries due to the reactions between Y2O3 and Al2O3 on AlN particle surface. With increasing the sintering temperature, AlN grains grew up, and the location of grain boundaries as well as the phase compositions changed. The Y/Al ratio in the aluminates increased, from Y3Al5O12 to YAlO3 and to Y4Al2O9. High-density, the growth of AlN grains and the homogenous dispersion of boundary phase were helpful to improve the thermal conductivity of AlN ceramics. The thermal conductivity of 122Wm-1K-1 for the 4.0 mass%Y2O3-doped AlN sample was reached.

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