Stress and shape evolution of irregularities in oxide films on elastic–plastic substrates due to thermal cycling and film growth

2001 ◽  
Vol 49 (9) ◽  
pp. 1577-1588 ◽  
Author(s):  
J.M. Ambrico ◽  
M.R. Begley ◽  
E.H. Jordan
2000 ◽  
Author(s):  
M. R. Begley ◽  
J. M. Ambrico ◽  
E. H. Jordan

Abstract In some oxide thin film systems, such thermal barrier coating systems (TBCs), thermal cycling leads to the development of geometric irregularities in the film. The evolution of these irregularities involves very large changes in aspect-ratio and often occurs rapidly over several hundreds of cycles. A key aspect of this behavior is the development of tensile stresses in the irregularity due to plastic yielding of the surrounding metal. These stresses can accelerate the elongation of the oxide (which translates into shape evolution of the irregularity) by various mechanisms, including enhanced oxide formation, inelastic stretching (creep) and failure of the oxide. An idealized analytical model consisting of a thin elastic shell embedded in an elastic-plastic matrix is used to explore the interactions between geometry, thermal strains, plasticity and oxide growth. Boundaries between purely elastic deformation, uni-directional yielding and reversed plasticity are shown to have a strong dependence on the size of the irregularity relative to the oxide thickness. For any given thermal strain, there is a critical aspect ratio of the irregularity that leads to maximum tensile stress in the oxide. The resulting closed-form solutions allow for quick and easy evaluations of various oxide-growth scenarios, including stress-dependent oxide formation. This talk will present the application of these models to TBC thermal cycling experiments, and discuss how stress-dependent oxide formation plays a role in the rapid evolution of these irregularities. A variety of oxide growth scenarios will be illustrated, and used to demonstrate that oxide failure and subsequent oxide formation in the cracked region is the most likely explanation for the rapid shape evolution seen in the experiments.


It is now well established that a large class of important chemical reactions is controlled by the growth of obstructive films, but our knowledge of the mechanism of the growth of such films—especially at low temperatures—is still very imperfect. The present paper describes a detailed study of a particularly instructive case of film-growth, the action of iodine on silver; this reaction was chosen because silver iodide films—in contrast with oxide films—reach visible thickness rapidly at ordinary temperatures. The optical properties of these films have already been studied by Wernick, whilst much information regarding the velocity of film-growth has been obtained by Tammanm by Kohlschutter and Krahenbiihl, and by Hartung. Tammann used the interference colour as the means of arriving at the thickness of the film; this method has certain unique advantages, but the more recent work of Tammann and Bockow has indicated that—in the case of oxide-films at least—the particular form of the method employed gives values for the thickness differing widely from those obtained by the gravimetric method. Tammann expressed the relation between the thickness ( y ) and the time ( t ) by the parabolic equation y 2 = 2 pt , where p is a. constant. Kohlschütter and Krähenbiihl, and also Hartung, used microgravimetric methods to determine the amount of iodine taken up, and obtained curves connecting thickness and time ; these curves do not appear to follow the parabolic equation. All the experimenters mentioned used iodine vapour to attack the silver, but the concentration of iodine in the gas phase was not directly determined. In all cases the surfaces were prepared in air, and the possible effect of exposure to oxygen was not considered; yet in several of the reactions of copper and iron, pre-exposure to air or oxygen is known greatly to modify the result, owing to the fact that an oxide-film may become protective before reaching the thickness needed for interference colours. It may be mentioned that after exposure to vapour, the colour produced on metallic specimens is usually not uniform, but indicates a greater film-thickness near the edge. In the present research, it was decided to use a solution of iodine in an organic solvent; in this case, the concentration could be fixed or varied at will, and in general uniform colouration (indicating uniform thickness) could be obtained. Moreover, abrasion could be conducted, if required, below the surface of the solvent, instead of in air. Chloroform was .found to be a suitable liquid, since, whilst freely dissolving iodine, it had no appreciable solvent action on a silver iodide film.


2019 ◽  
Vol 180-181 ◽  
pp. 176-188 ◽  
Author(s):  
I. Ben Cheikh ◽  
G. Parry ◽  
D. Dalmas ◽  
R. Estevez ◽  
J. Marthelot

2008 ◽  
Vol 516 (14) ◽  
pp. 4598-4602 ◽  
Author(s):  
Yasushi Sato ◽  
Mikihiro Taketomo ◽  
Norihiro Ito ◽  
Amica Miyamura ◽  
Yuzo Shigesato

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