scholarly journals Using Electron Backscatter Diffraction (EBSD) to Investigate Causes of Seismic Anisotropy in Earth Materials: A Case Study Using Antigorite Serpentinite

2013 ◽  
Vol 19 (S2) ◽  
pp. 722-723
Author(s):  
S.J. Brownlee ◽  
B.R. Hacker ◽  
G.E. Harlow ◽  
G. Seward

Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.

Minerals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 399
Author(s):  
Seungsoon Choi ◽  
Olivier Fabbri ◽  
Gültekin Topuz ◽  
Aral I. Okay ◽  
Haemyeong Jung

Lawsonite is an important mineral for understanding seismic anisotropy in subducting oceanic crust due to its large elastic anisotropy and prevalence in cold subduction zones. However, there is insufficient knowledge of how lawsonite twinning affects seismic anisotropy, despite previous studies demonstrating the presence of twins in lawsonite. This study investigated the effect of lawsonite twinning on the crystal preferred orientation (CPO), CPO strength, and seismic anisotropy using lawsonite blueschists from Alpine Corsica (France) and the Sivrihisar Massif (Turkey). The CPOs of the minerals are measured with an electron backscatter diffraction instrument attached to a scanning electron microscope. The electron backscatter diffraction analyses of lawsonite reveal that the {110} twin in lawsonite is developed, the [001] axes are strongly aligned subnormal to the foliation, and both the [100] and [010] axes are aligned subparallel to the foliation. It is concluded that the existence of twins in lawsonite could induce substantial seismic anisotropy reduction, particularly for the maximum S-wave anisotropy in lawsonite and whole rocks by up to 3.67% and 1.46%, respectively. Lawsonite twinning needs to be considered when determining seismic anisotropy in the subducting oceanic crust in cold subduction zones.


Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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