scholarly journals Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Ying Cui ◽  
Zihao Qin ◽  
Huan Wu ◽  
Man Li ◽  
Yongjie Hu
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Rational Design ◽  
State Of The Art ◽  
Biological Tissues ◽  
Great Promise ◽  
Thermal Interface ◽  
Current State ◽  
Boron Arsenide ◽  
Self Assembled

AbstractThermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.

Behavioral Genetics: Concepts for Research and Practice in Language Development and Disorders

1995 ◽  
Vol 38 (5) ◽  
pp. 1126-1142 ◽  
Author(s):  
Jeffrey W. Gilger
Keyword(s):  
Language Development ◽  
Behavioral Genetics ◽  
State Of The Art ◽  
Genetic Research ◽  
Great Promise ◽  
Behavioral Genetic ◽  
Fine Grained ◽  
Future Goals ◽  
Current State ◽  
Research Designs

This paper is an introduction to behavioral genetics for researchers and practioners in language development and disorders. The specific aims are to illustrate some essential concepts and to show how behavioral genetic research can be applied to the language sciences. Past genetic research on language-related traits has tended to focus on simple etiology (i.e., the heritability or familiality of language skills). The current state of the art, however, suggests that great promise lies in addressing more complex questions through behavioral genetic paradigms. In terms of future goals it is suggested that: (a) more behavioral genetic work of all types should be done—including replications and expansions of preliminary studies already in print; (b) work should focus on fine-grained, theory-based phenotypes with research designs that can address complex questions in language development; and (c) work in this area should utilize a variety of samples and methods (e.g., twin and family samples, heritability and segregation analyses, linkage and association tests, etc.).

Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities

2020 ◽  
Vol 8 (31) ◽  
pp. 10568-10586 ◽  
Author(s):  
Ying Cui ◽  
Man Li ◽  
Yongjie Hu
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
State Of The Art ◽  
Interface Materials

State-of-the-art experiments and modeling, challenges, and future opportunities for developing high-performance interface materials for electronics thermal management.

High-performance computing systems: Status and outlook

Acta Numerica ◽  
2012 ◽  
Vol 21 ◽  
pp. 379-474 ◽  
Author(s):  
J. J. Dongarra ◽  
A. J. van der Steen
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
State Of The Art ◽  
Computing Systems ◽  
Future Developments ◽  
Steady Growth ◽  
Current State ◽  
Near Future ◽  
Performance Computing ◽  
Shed Light

This article describes the current state of the art of high-performance computing systems, and attempts to shed light on near-future developments that might prolong the steady growth in speed of such systems, which has been one of their most remarkable characteristics. We review the different ways devised to speed them up, both with regard to components and their architecture. In addition, we discuss the requirements for software that can take advantage of existing and future architectures.

System integration of high intensity energy subsystems – a thermal management challenge

2008 ◽  
Vol 112 (1134) ◽  
pp. 477-482
Author(s):  
D. M. Pratt ◽  
D. Moorhouse
Keyword(s):  
Thermal Management ◽  
Air Force ◽  
System Integration ◽  
High Intensity ◽  
State Of The Art ◽  
Cooling Capacity ◽  
Future Research ◽  
Current State ◽  
Management Capability ◽  
Management Challenge

Current and future Air Force weapons systems lack the necessary power and cooling capacity to provide full systems level capability as a result of energy and thermal management limitations. Cooling capacity of fuel is already fully utilised leaving little room for additional cooling needs. Additionally, increasing speed, power, and miniaturisation of future systems continue to stress any thermal management capability that we can now deliver. Thus, the focus of this paper is a conceptual assessment of the key energy and thermal management technologies to meet the future energy challenges. It presents an overview of the current state of the art and also possible future research.

scholarly journals Development of Nanostructured-based Composites as Advanced Thermal Interface Materials

2020 ◽  
Vol 5 (1) ◽  
Keyword(s):  
Boron Nitride ◽  
Thermal Management ◽  
Filler Material ◽  
Filler Materials ◽  
Thermal Interface Materials ◽  
High Heat Flux ◽  
Thermal Interface ◽  
Air Gaps ◽  
Boron Arsenide ◽  
Interface Materials

Thermal management is one of the most critical issues in electronics due to increasing power densities. This problem is getting even worse for small and sophisticated devices due to air gaps present between the heat source and heat sink. Thermal interface materials (TIM) are used to reduce the air gaps and significantly increase the heat transfer capability of the system. A high-thermal-performance, cost-effective and reliable TIM would be needed to dissipate the generated heat, which could enable significant reductions in weight, volume and cost of the thermal management system. In this study a number of different nanostructured materials are reviewed for potential use as a filler material in our effort to develop advanced TIM composite. Some of the candidate filler materials considered is Carbon Nanotubes, Graphene and Few Layer Graphene (FLG), Boron Nitride Nanotubes (BNNT) and Boron Nitride Nanomesh (BNNM) and Boron Arsenide (BAs). Objective is to identify composition of boron arsenide as filler in polymer-nanostructured material composite TIM for high heat flux applications. In order to design boron-arsenide-based TIM composite with enhanced effective thermal conductivity, a number of metallic and nonmetallic base-filler material composites are considered with varying filler fractions. Empirical mixture models based on effective medium theories (EMT) are evaluated for estimating effective conductivity of the two-component boron arsenide-filler composite TIM structure.

High-Performance Packaging of Power Electronics

MRS Bulletin ◽  
2003 ◽  
Vol 28 (1) ◽  
pp. 41-50 ◽  
Author(s):  
M. C. Shaw
Keyword(s):  
Heat Transfer ◽  
Solid State ◽  
Power Electronics ◽  
High Performance ◽  
Materials Science ◽  
State Of The Art ◽  
State Power ◽  
Electronics Packaging ◽  
Current State ◽  
Interdisciplinary Process

AbstractPackaging of solid-state power electronics is a highly interdisciplinary process requiring knowledge of electronics, heat transfer, mechanics, and materials science. Consequently, there are numerous opportunities for innovations at the interfaces of these complementary fields. This article offers a perspective of the current state of the art and identifies six specific areas for materials-based research in power electronics packaging. The emphasis is on identifying the underlying physical relationships that link the performance of the power electronics system to the microstructure and architectural arrangement of the constituents.

scholarly journals High-performance, Durable and Low-Cost Proton Exchange Membrane Electrolyser with Stainless Steel Components

2021 ◽  
Author(s):  
Svenja Stiber ◽  
Noriko Sata ◽  
Tobias Morawietz ◽  
Syed Asif Ansar ◽  
Thomas Jahnke ◽  
...  
Keyword(s):  
High Performance ◽  
Proton Exchange Membrane ◽  
State Of The Art ◽  
Low Cost ◽  
Polymer Electrolyte Membrane ◽  
Water Electrolysis ◽  
Proton Exchange ◽  
Electrolyte Membrane ◽  
Current State ◽  
Exchange Membrane

Polymer electrolyte membrane water electrolysis (PEMWE) is the most promising technology for sustainable hydrogen production. However, it has been too expensive to compete with current state-of-the-art technologies due to the...

scholarly journals Efficient Side-Channel Protections of ARX Ciphers

2018 ◽  
pp. 627-653 ◽  
Author(s):  
Bernhard Jungk ◽  
Richard Petri ◽  
Marc Stöttinger
Keyword(s):  
High Performance ◽  
State Of The Art ◽  
Side Channel ◽  
First Order ◽  
Current State ◽  
Assembly Instructions ◽  
Improved Performance ◽  
Good Trade ◽  
Published Result ◽  
Very High

The current state of the art of Boolean masking for the modular addition operation in software has a very high performance overhead. Firstly, the instruction count is very high compared to a normal addition operation. Secondly, until recently, the entropy consumed by such protections was also quite high. Our paper significantly improves both aspects, by applying the Threshold Implementation (TI) methodology with two shares and by reusing internal values as randomness source in such a way that the uniformity is always preserved. Our approach performs considerably faster compared to the previously known masked addition and subtraction algorithms by Coron et al. and Biryukov et al. improving the state of the art by 36%, if we only consider the number of ARM assembly instructions. Furthermore, similar to the masked adder from Biryukov et al. we reduce the amount of randomness and only require one bit additional entroy per addition, which is a good trade-off for the improved performance. We applied our improved masked adder to ChaCha20, for which we provide two new first-order protected implementations and achieve a 36% improvement over the best published result for ChaCha20 using an ARM Cortex-M4 microprocessor.

Restoring degraded microbiome function with self-assembled communities

2020 ◽  
Vol 96 (12) ◽  
Author(s):  
Carlos Fernando Gutierrez ◽  
Janeth Sanabria ◽  
Jos M Raaijmakers ◽  
Ben O Oyserman
Keyword(s):  
State Of The Art ◽  
Growth Promotion ◽  
Physicochemical Characteristics ◽  
Disease Suppression ◽  
Microbial Consortia ◽  
Soil Microbiome ◽  
Design Strategies ◽  
Operational Parameters ◽  
Current State ◽  
Self Assembled

ABSTRACT The natural microbial functions of many soils are severely degraded. Current state-of-the-art technology to restore these functions is through the isolation, screening, formulation and application of microbial inoculants and synthetic consortia. These approaches have inconsistent success, in part due to the incompatibility between the biofertilizer, crop, climate, existing soil microbiome and physicochemical characteristics of the soils. Here, we review the current state of the art in biofertilization and identify two key deficiencies in current strategies: the difficulty in designing complex multispecies biofertilizers and the bottleneck in scaling the production of complex multispecies biofertilizers. To address the challenge of producing scalable, multispecies biofertilizers, we propose to merge ecological theory with bioprocess engineering to produce ‘self-assembled communities’ enriched for particular functional guilds and adapted to a target soil and host plant. Using the nitrogen problem as an anchor, we review relevant ecology (microbial, plant and environmental), as well as reactor design strategies and operational parameters for the production of functionally enriched self-assembled communities. The use of self-assembled communities for biofertilization addresses two major hurdles in microbiome engineering: the importance of enriching microbes indigenous to (and targeted for) a specific environment and the recognized potential benefits of microbial consortia over isolates (e.g. functional redundancy). The proposed community enrichment model could also be instrumental for other microbial functions such as phosphorus solubilization, plant growth promotion or disease suppression.

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