scholarly journals Effect of in situ stress on grain growth and texture evolution in sputtered YSZ/Si films

RSC Advances ◽  
2017 ◽  
Vol 7 (29) ◽  
pp. 17832-17840 ◽  
Author(s):  
Amiya Banerjee ◽  
K. V. L. V. Narayanachari ◽  
Srinivasan Raghavan

Annealing leads to grain growth and associated tensile strain in YSZ film, so initial compressive stress helps to grow larger grains.

2007 ◽  
Vol 990 ◽  
Author(s):  
Chia-Jeng Chung ◽  
David Field ◽  
No-Jin Park ◽  
Christy Woo

ABSTRACTGrain growth in polycrystalline films is controlled by the energetics of the surface, interface and grain boundaries as well as strain energy. The unique character of damascene lines fabricated from electroplated Cu films introduces the additional considerations of bath chemistry and geometric constraints. The moderate stacking fault energy of Cu allows for the development of a substantial twin fraction for certain growth conditions. This paper discusses in-situ observation of grain growth in Cu films and lines under various processing conditions. It is shown that for thicker films and for structures constrained within damascene trenches the energetics of twin boundary formation play a large role in texture development of these structures.


1996 ◽  
Vol 441 ◽  
Author(s):  
W. F. Qu ◽  
A. Kitagawa ◽  
Y. Masaki ◽  
M. Suzuki

AbstractPoly-Si films with the preferential orientation to a random, a (100) and a (110) texture were annealed using a flat gas flame. Remarkable lateral grain growth of (111) grains was observed for poly-Si films with a random and a (110) texture, while in (100) texture films the growth of (100) grains predominated over other grains. There existed tensile stress in as-prepared films. Grains with different orientation were under a different tensile stresses, and such stress distributions on the orientation of grains were different for different textures. The tensile stress was found to become larger in grown grains after high temperature annealing, while the stress on shrunken grains decreased or turned to compressive stress after annealing. These results indicate that strain energy stored in grains is one of the important driving forces in secondary grain growth.


2003 ◽  
Vol 766 ◽  
Author(s):  
D.P. Field ◽  
M.M. Nowell ◽  
O.V. Kononenko

AbstractRecrystallization, grain growth and crystallographic texture evolution in Cu films is an area of importance for IC interconnect fabrication as the film characteristics influence the resulting line microstructure. This study examines Cu films deposited by partially ionized beam deposition onto a sublayer of tantalum nitride and additionally onto alpha- C:H. The films were annealed in-situ in the SEM chamber and intermittent orientation imaging was used to characterize the grain growth and crystallographic texture evolution in the films. Both initial and final textures are weak in each of the films analyzed, but are a function of sublayer material and thickness. Grain size in the Cu films is significantly smaller for the tantalum nitride sublayer than for the á-C:H sublayer.


2003 ◽  
Vol 781 ◽  
Author(s):  
Donglei Fan ◽  
Frank Q. Zhu ◽  
Ingrid X. Shao ◽  
P. C. Searson ◽  
R. C. Cammarata

AbstractBismuth, a semi-metal with very long mean free path and large magnetoresistance (MR) effect, is a novel candidate material for thin film spintronic devices. Electrochemical deposition followed by a post-deposition anneal has resulted in highly textured bismuth films as characterized by x-ray diffractometry and pole figure measurements. A highly sensitive, real time in-situ stress measurement system was designed and employed to study stress generation during bismuth film growth. Bismuth films displayed a monotonically increasing compressive stress during deposition. The magnitude of the compressive stress decreased with the deposition rate in the range 1.5 Å/sec to 50 Å/sec.


2008 ◽  
Vol 584-586 ◽  
pp. 263-268 ◽  
Author(s):  
Bartlomiej J. Bonarski ◽  
Erhard Schafler ◽  
Borys Mikułowski ◽  
Michael Zehetbauer

Single crystals of technical purity Magnesium (99.8 wt.%) of initial orientations [ ] 2 1 10 and [ ] 2 2 11 were subjected to HPT deformation at room temperature up to strains of 10. The microstructural evolution has been analyzed by X-ray microtexture investigations and by in-situ stress-strain measurements. The results can be described in terms of shear arising from HPT deformation and - with higher strains - in terms of recrystallization. In crystals with hard orientation[ ] 2 2 11 , these features occur at smaller strains than in crystals with soft orientation [ ] 2 1 10 , i.e. with higher symmetry. In general, the observed textures and strength variations are much stronger than those reported for fcc HPT deformed metals.


2011 ◽  
Vol 702-703 ◽  
pp. 854-857
Author(s):  
Gideon C. Obasi ◽  
R.J. Moat ◽  
D. G. Leo Prakash ◽  
W. Kockelmann ◽  
Joao Quinta da Fonseca ◽  
...  

In the present study, in situ phase transformation experiments have been carried out using neutron diffraction to monitor the texture evolution during the α→ß→α phase transformation in Ti-6Al-4V with and without 0.4% yttrium additions. The aim of adding yttrium was to control ß grain growth above the transus ß by grain boundary pinning. In the present case, strengthening of the ß texture, occurring during ß grain coarsening resulted in strengthening of particular ß texture components, which increases the likelihood of α texture modification by selective growth of α variants on the common (110) ß grain boundaries into unoccupied large β grains.


2011 ◽  
Vol 702-703 ◽  
pp. 635-638
Author(s):  
Christoph Günster ◽  
Dmitri A. Molodov ◽  
Günter Gottstein

The magnetically driven motion of planar symmetrical and asymmetrical <> tilt grain boundaries in high purity (99,995%) zinc bicrystals was measured in-situ by means of a po­la­rization microscopy probe in the temperature range between 330°C and 415°C and the corres­pon­ding migration activation parameters were obtained. The results revealed that grain boundary mobi­lity essentially depends on the misorientation angle and the inclination of the boundary plane. The magnetic annealing of the cold rolled (90%) Zn-1.1%Al sheet specimens resulted in an asymmetry of the two major texture components. This effect is attributed to a magnetic driving force for grain growth. The grain microstructure evolution was also essentially affected by a magnetic field.


1987 ◽  
Vol 106 ◽  
Author(s):  
L. R. Zheng ◽  
L. S. Hung ◽  
J. W. Mayer

ABSTRACTThe diffusion behavior of arsenic and the grain growth of Si in arsenic doped poly-Si were investigated by MeV4 He2+ backscattering techniques and transmission electron microscopy. By implanting arsenic ions into poly-Si films the surface portion was made amorphous and crystallized upon annealing. In-situ mssurements showed crystal nucleation and growth at temperatures of 650 – 700° C with a dimension comparable to the thickness of the amorphous layer. Annealing at temperatures up to 850°C increased the number of the large grains, but the average grain size did not change significantly. In the unimplanted region grains retained their initial size until 885°C, although implanted arsenic was found to diffuse into this region along grain boundaries. At 885°C penetration of arsenic into the interior of grains caused significant grain growth. We also found that single implants of boron somewhat increased grain size, whereas boron codoped with arsenic appeared to reduce the effect of arsenic doping. These observations support the hypothesis that the enhanced growth rate and the electrical activity of Si near the grain boundary are closely interrelated.


1993 ◽  
Vol 173 (1-2) ◽  
pp. 377-380 ◽  
Author(s):  
J.P Guillemet ◽  
B de Mauduit ◽  
B Pieraggi ◽  
D Bielle-Daspet ◽  
E Scheid

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