scholarly journals Ultra-high lattice thermal conductivity and the effect of pressure in superhard hexagonal BC2N

2020 ◽  
Vol 8 (44) ◽  
pp. 15705-15716
Author(s):  
Safoura Nayeb Sadeghi ◽  
S. Mehdi Vaez Allaei ◽  
Mona Zebarjadi ◽  
Keivan Esfarjani
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
First Principles ◽  
Heat Sink ◽  
Lattice Thermal Conductivity ◽  
Electronic Devices ◽  
Thermomechanical Properties ◽  
High Thermal Conductivity ◽  
Effect Of Pressure

Using first-principles methods to calculate thermomechanical properties of BC2N, we investigate the effect of pressure on its high thermal conductivity and show that its thermal expansion matches that of Si, making it a good candidate as a heat sink for electronic devices.

Ultrahigh and anisotropic thermal transport in the hybridized monolayer (BC2N) of boron nitride and graphene: a first-principles study

2019 ◽  
Vol 21 (31) ◽  
pp. 17306-17313 ◽  
Author(s):  
Aamir Shafique ◽  
Young-Han Shin
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
First Principles ◽  
Thermal Transport ◽  
Lattice Thermal Conductivity ◽  
Electronic Devices ◽  
Heat Removal ◽  
Band Gaps ◽  
Semiconducting Materials ◽  
Significant Challenge

Heat removal has become a significant challenge in the miniaturization of electronic devices, especially in power electronics, so semiconducting materials with suitable band gaps and high lattice thermal conductivity are highly desired.

Mullite Ceramics for the Application to Advanced Packaging Technology

1989 ◽  
Vol 154 ◽  
Author(s):  
Jun Tanaka ◽  
Satoshi Kajita ◽  
Masami Terasawa
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Thermal Expansion ◽  
Aluminum Nitride ◽  
Heat Sink ◽  
High Thermal Conductivity ◽  
System A ◽  
Lower Dielectric Constant ◽  
Advanced Packaging ◽  
Mullite Ceramics

AbstractMullite ceramics were developed for multilayered packages, which have a lower dielectric constant and a nearer thermal expansion to that of silicon than those of alumina. The multilayered mullite packages are manufactured by using a similar cofired technology with tungsten or molybdenum to the conventionally used alumina system. A new brazing material and a new lead material were developed to be combined with the mullite ceramics Multilayered mullite packages with a brazed aluminum nitride heat sink, which has a high thermal conductivity, were developed to compensate a low thermal conductivity of the mullite itself. The packages are one of the highest performance packages.

Strain tuned high thermal conductivity in boron phosphide at nanometer length scales – a first-principles study

2020 ◽  
Vol 22 (36) ◽  
pp. 20914-20921 ◽  
Author(s):  
Rajmohan Muthaiah ◽  
Jivtesh Garg
Keyword(s):  
Thermal Conductivity ◽  
First Principles ◽  
High Thermal Conductivity ◽  
Biaxial Strain ◽  
Length Scales ◽  
First Principles Study ◽  
Boron Phosphide

We report novel pathways to significantly enhance the thermal conductivity at nanometer length scales in boron phosphide through biaxial strain.

scholarly journals First-principles predictions of low lattice thermal conductivity and high thermoelectric performance of AZnSb (A = Rb, Cs)

RSC Advances ◽  
2021 ◽  
Vol 11 (25) ◽  
pp. 15486-15496
Author(s):  
Enamul Haque
Keyword(s):  
Thermal Conductivity ◽  
Debye Temperature ◽  
Layered Structure ◽  
First Principles ◽  
Lattice Thermal Conductivity ◽  
Phonon Scattering ◽  
Thermoelectric Performance

The layered structure, and presence of heavier elements Rb/Cs and Sb induce high anharmonicity, low Debye temperature, intense phonon scattering, and hence, low lattice thermal conductivity.

Metal phosphide CuP2 as a promising thermoelectric material: an insight from first-principles study

2021 ◽  
Author(s):  
Un-Gi Jong ◽  
Chol-Hyok Ri ◽  
Chol-Jin Pak ◽  
Chol-Hyok Kim ◽  
Stefaan Cottenier ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Material ◽  
Thermoelectric Materials ◽  
First Principles ◽  
Lattice Thermal Conductivity ◽  
Metal Phosphide ◽  
First Principles Study ◽  
Metal Phosphides ◽  
Large Lattice

In the search for better thermoelectric materials, metal phosphides have not been considered to be viable candidates so far, due to their large lattice thermal conductivity. Here we study thermoelectric...

Thermal expansion induced reduction of lattice thermal conductivity in light crystals

2017 ◽  
Vol 381 (40) ◽  
pp. 3514-3518 ◽  
Author(s):  
Xiuxian Yang ◽  
Yinchang Zhao ◽  
Zhenhong Dai ◽  
Muhammad Zulfiqar ◽  
Jingzhong Zhu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Lattice Thermal Conductivity

Design and Optimization of a Composite Heat Spreader to Improve the Thermal Management of a 3D Integrated Circuit

2021 ◽  
Author(s):  
Andisheh Tavakoli ◽  
Kambiz Vafai
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Variable Temperature ◽  
Heat Removal ◽  
High Conductivity ◽  
High Thermal Conductivity ◽  
Maximum Temperature ◽  
Optimal Distribution ◽  
Heat Spreader ◽  
The Impact

Abstract The present study analyzes the optimal distribution of a limited amount of high thermal conductivity material to enhance the heat removal of circular 3D integrated circuits, IC. The structure of the heat spreader is designed as a composite of high thermal conductivity (Boron Arsenide) and moderate thermal conductivity (copper) materials. The volume ratio of high-conductivity inserts to the total volume of the spreader is set at a fixed pertinent ratio. Two different boundary conditions of constant and variable temperature are considered for the heat sink. To examine the impact of adding high-conductivity inserts on the cooling performance of the heat spreader, various patterns of the single and double ring inserts are studied. A parametric study is performed to find the optimal location of the rings. Moreover, the optimal distribution of the high-conductivity material between the inner and outer rings is found. The results show that for the optimal conditions, the maximum temperature of the 3D IC is reduced up to 10%; while the size of the heat sink, and heat spreader can be diminished by as much as 200%.

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