Point-of-care blood coagulation assay enabled by printed circuit board-based digital microfluidics

Lab on a Chip ◽  
2022 ◽  
Author(s):  
Donghao Li ◽  
Xinyu Liu ◽  
Yujuan Chai ◽  
Jieying Shan ◽  
Yihan Xie ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Point Of Care ◽  
Digital Microfluidics ◽  
Circuit Board ◽  
Clinical Settings ◽  
Point Of Care Testing ◽  
Printed Circuit ◽  
Coagulation Assays ◽  
Coagulation Function ◽  
Coagulation Assay

The monitoring of coagulation function has great implications in many clinical settings. However, existing coagulation assays are simplex, sample-consuming, and slow in turnaround, making them less suitable for point-of-care testing....

scholarly journals A Novel Microfluidic Point-of-Care Biosensor System on Printed Circuit Board for Cytokine Detection

Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 4011 ◽  
Author(s):  
Daniel Evans ◽  
Konstantinos Papadimitriou ◽  
Nikolaos Vasilakis ◽  
Panagiotis Pantelidis ◽  
Peter Kelleher ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Point Of Care ◽  
Reference Electrode ◽  
Circuit Board ◽  
Enzyme Linked Immunosorbent Assay ◽  
Interferon Gamma Release Assay ◽  
Counter Electrodes ◽  
Printed Circuit ◽  
Cytokine Detection ◽  
Biosensor System

Point of Care (PoC) diagnostics have been the subject of considerable research over the last few decades driven by the pressure to detect diseases quickly and effectively and reduce healthcare costs. Herein, we demonstrate a novel, fully integrated, microfluidic amperometric enzyme-linked immunosorbent assay (ELISA) prototype using a commercial interferon gamma release assay (IGRA) as a model antibody binding system. Microfluidic assay chemistry was engineered to take place on Au-plated electrodes within an assay cell on a printed circuit board (PCB)-based biosensor system. The assay cell is linked to an electrochemical reporter cell comprising microfluidic architecture, Au working and counter electrodes and a Ag/AgCl reference electrode, all manufactured exclusively via standard commercial PCB fabrication processes. Assay chemistry has been optimised for microfluidic diffusion kinetics to function under continual flow. We characterised the electrode integrity of the developed platforms with reference to biological sampling and buffer composition and subsequently we demonstrated concentration-dependent measurements of H2O2 depletion as resolved by existing FDA-validated ELISA kits. Finally, we validated the assay technology in both buffer and serum and demonstrate limits of detection comparable to high-end commercial systems with the addition of full microfluidic assay architecture capable of returning diagnostic analyses in approximately eight minutes.

scholarly journals Characterization of Inkjet-Printed Digital Microfluidics Devices

Sensors ◽  
2021 ◽  
Vol 21 (9) ◽  
pp. 3064
Author(s):  
Shiyu Chen ◽  
Zhidong He ◽  
Suhwan Choi ◽  
Igor V. Novosselov
Keyword(s):  
Printed Circuit Board ◽  
Dielectric Breakdown ◽  
Point Of Care ◽  
Low Cost ◽  
Digital Microfluidics ◽  
Actuation Voltage ◽  
Circuit Board ◽  
Pmma Layer ◽  
Design Iteration ◽  
Droplet Movement

Digital microfluidics (DMF) devices enable precise manipulation of small liquid volumes in point-of-care testing. A printed circuit board (PCB) substrate is commonly utilized to build DMF devices. However, inkjet printing can be used to fabricate DMF circuits, providing a less expensive alternative to PCB-based DMF designs while enabling more rapid design iteration cycles. We demonstrate the cleanroom-free fabrication process of a low-cost inkjet-printed DMF circuit. We compare Kapton and polymethyl methacrylate (PMMA) as dielectric coatings by measuring the minimal droplet actuation voltage for a range of actuation frequencies. A minimum actuation voltage of 5.6 V was required for droplet movement with the PMMA layer thickness of 0.2 μm and a hydrophobic layer of 0.17 μm. Significant issues with PMMA dielectric breakdown were observed at actuation voltages above 10 V. In comparison, devices that utilized Kapton were found to be more robust, even at an actuation voltage up to 100 V.

scholarly journals Characterization of Inkjet-printed Digital Microfluidics Devices

2021 ◽  
Author(s):  
Shiyu Chen ◽  
Zhidong He ◽  
Suhwan Choi ◽  
Igor Novosselov
Keyword(s):  
Printed Circuit Board ◽  
Dielectric Breakdown ◽  
Point Of Care ◽  
Digital Microfluidics ◽  
Actuation Voltage ◽  
Circuit Board ◽  
Pmma Layer ◽  
Design Iteration ◽  
Droplet Movement

Digital microfluidics (DMF) devices enable precise manipulation of small liquid volumes in point-of-care testing. Printed circuit board (PCB) substrate is commonly utilized to build DMF devices. However, inkjet printing can be used to fabricate DMF circuits, providing a less expensive alternative to PCB-based DMF designs while enabling more rapid design iteration cycles. We demonstrate the fabrication process of the inkjet-printed DMF circuit. We compare Kapton and polymethyl methacrylate (PMMA) as dielectric coatings by measuring the minimal droplet actuation voltage for a range of actuation frequencies. The minimum actuation voltage of 5.6 V was required for droplet movement with the PMMA layer thickness of 0.2 μm and a hydrophobic layer of 0.17 μm. Significant issues with PMMA dielectric breakdown were observed at actuation voltages above 10 V. In comparison, devices that utilized Kapton were found to be more robust even at the actuation voltage up to 100 V.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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