Silicon-on-insulator-based high-voltage, high-temperature integrated circuit gate driver for silicon carbide-based power field effect transistors

2010 ◽  
Vol 3 (6) ◽  
pp. 1001 ◽  
Author(s):  
M.A. Huque ◽  
L.M. Tolbert ◽  
B.J. Blalock ◽  
S.K. Islam
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
High Voltage ◽  
Integrated Circuit ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Silicon On Insulator ◽  
Gate Driver

scholarly journals A UNIVERSAL SOI-BASED HIGH TEMPERATURE GATE DRIVER INTEGRATED CIRCUIT FOR SiC POWER SWITCHES WITH ON-CHIP SHORT CIRCUIT PROTECTION

2011 ◽  
Vol 20 (03) ◽  
pp. 471-484 ◽  
Author(s):  
LIANG ZUO ◽  
ROBERT GREENWELL ◽  
SYED K. ISLAM ◽  
M. A. HUQUE ◽  
BENJAMIN J. BLALOCK ◽  
...  
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Low Cost ◽  
Short Circuit ◽  
Silicon On Insulator ◽  
Successful Operation ◽  
Power Switches ◽  
Gate Driver

In recent years, increasing demand for hybrid electric vehicles (HEVs) has generated the need for reliable and low-cost high-temperature electronics which can operate at the high temperatures under the hood of these vehicles. A high-voltage and high temperature gate-driver integrated circuit for SiC FET switches with short circuit protection has been designed and implemented in a 0.8-micron silicon-on-insulator (SOI) high-voltage process. The prototype chip has been successfully tested up to 200°C ambient temperature without any heat sink or cooling mechanism. This gate-driver chip can drive SiC power FETs of the DC-DC converters in a HEV, and future chip modifications will allow it to drive the SiC power FETs of the traction drive inverter. The converter modules along with the gate-driver chip will be placed very close to the engine where the temperature can reach up to 175ΰC. Successful operation of the chip at this temperature with or without minimal heat sink and without liquid cooling will help achieve greater power-to-volume as well as power-to-weight ratios for the power electronics module.

SOI-Based Integrated Gate Driver Circuit for High-Temperature Applications

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000233-000244
Author(s):  
R. L. Greenwell ◽  
B.M. McCue ◽  
M.I. Laurence ◽  
C.L. Fandrich ◽  
B.J. Blalock ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Field Effect Transistors ◽  
Silicon On Insulator ◽  
Successful Operation ◽  
Ambient Temperatures ◽  
Gate Driver ◽  
Traction Drives ◽  
On Chip

The growing demand for hybrid electric vehicles (HEVs) has increased the need for high-temperature electronics that can operate at the temperatures that exist under the hood of these vehicles. In many cases this requires the use of thermal management systems to allow for the use of components not designed to operate at the ambient temperatures found in the engine compartment of an HEV. These systems add weight and complexity, which can increase the overall cost and reduce the efficiency of the vehicle. The alternative is to develop circuits and systems capable of operating with reduced or no thermal management. To this end, the latest version of our high-temperature gate driver integrated circuit (IC) has been developed. Designed and implemented on a 0.8-micron bipolar-CMOS-DMOS (BCD) on silicon-on-insulator (SOI) process, this gate driver chip is intended to drive silicon carbide (SiC) and other wide-bandgap (WBG) power field-effect transistors (FETs) for DC-DC converters and traction drives in HEVs. To enable this, the gate driver IC, which includes on-chip voltage regulators and protection circuitry, has been designed to operate at and successfully tested up to 200°C ambient temperature. Successful operation of the circuit at this temperature with minimal or no heat sink, and without liquid cooling, will help to achieve higher power-to-volume as well as power-to-weight ratios for the power electronics modules in HEVs.

scholarly journals Modelling of Dynamic Properties of Silicon Carbide Junction Field-Effect Transistors (JFETs)

Energies ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 187 ◽  
Author(s):  
Kamil Bargieł ◽  
Damian Bisewski ◽  
Janusz Zarębski
Keyword(s):  
Silicon Carbide ◽  
Integrated Circuit ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Dynamic Properties ◽  
Modified Model ◽  
Spice Model ◽  
Capacitance Voltage ◽  
Effect Transistor ◽  
Switching Characteristics

The paper deals with the problem of modelling and analyzing the dynamic properties of a Junction Field Effect Transistor (JFET) made of silicon carbide. An examination of the usefulness of the built-in JFET Simulation Program with Integrated Circuit Emphasis (SPICE) model was performed. A modified model of silicon carbide JFET was proposed to increase modelling accuracy. An evaluation of the accuracy of the modified model was performed by comparison of the measured and calculated capacitance–voltage characteristics as well as the switching characteristics of JFETs.

Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application

2016 ◽  
Vol 13 (4) ◽  
pp. 143-154 ◽  
Author(s):  
Jim Holmes ◽  
A. Matthew Francis ◽  
Ian Getreu ◽  
Matthew Barlow ◽  
Affan Abbasi ◽  
...  
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Logic Synthesis ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Timing Models ◽  
High Temperature Operation

In the last decade, significant effort has been expended toward the development of reliable, high-temperature integrated circuits. Designs based on a variety of active semiconductor devices including junction field-effect transistors and metal-oxide-semiconductor (MOS) field-effect transistors have been pursued and demonstrated. More recently, advances in low-power complementary MOS (CMOS) devices have enabled the development of highly integrated digital, analog, and mixed-signal integrated circuits. The results of elevated temperature testing (as high as 500°C) of several building block circuits for extended periods (up to 100 h) are presented. These designs, created using the Raytheon UK's HiTSiC® CMOS process, present the densest, lowest-power integrated circuit technology capable of operating at extreme temperatures for any period. Based on these results, Venus nominal temperature (470°C) transistor models and gate-level timing models were created using parasitic extracted simulations. The complete CMOS digital gate library is suitable for logic synthesis and lays the foundation for complex integrated circuits, such as a microcontroller. A 16-bit microcontroller, based on the OpenMSP 16-bit core, is demonstrated through physical design and simulation in SiC-CMOS, with an eye for Venus as well as terrestrial applications.

Silicon Carbide Power Field-Effect Transistors

MRS Bulletin ◽  
2005 ◽  
Vol 30 (4) ◽  
pp. 293-298 ◽  
Author(s):  
Jian H. Zhao
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Field Effect ◽  
Recent Progress ◽  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
High Power Density ◽  
Advantages And Disadvantages ◽  
Power Switches

AbstractSilicon carbide power field-effect transistors, including power vertical-junction FETs (VJFETs) and metal oxide semiconductor FETs (MOSFETs), are unipolar power switches that have been investigated for high-temperature and high-power-density applications. Recent progress and results will be reviewed for different device designs such as normally-OFF and normally-ON VJFETs, double-implanted MOSFETs, and U-shaped-channel MOSFETs. The advantages and disadvantages of SiC VJFETs and MOSFETs will be discussed. Remaining challenges will be identified.

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