Novel developments in rapid thermal processing (RTP) temperature measurement and control

Author(s):  
B. E. Adams ◽  
A. M. Hunter
1991 ◽  
Vol 224 ◽  
Author(s):  
Hisham Z. Massoud ◽  
Ronald K. Sampson ◽  
Kevin A. Conrad ◽  
Yao-Zhi Hu ◽  
Eugene A. Irene

AbstractThe applications of in situ automated ellipsometry in the measurement and control of temperature in rapid-thermal processing (RTP) equipment are investigated. This technique relies on the accurate measurement of the index of refraction of a wafer using ellipsometry and the strong temperature dependence of the index of refraction to determine the wafer temperature. In principle, this technique is not limited to silicon wafer processing and could be applied to any surface whose index of refraction has a strong and well known temperature dependence. This technique is non-invasive, non-contact, fast, accurate, compatible with ultraclean processing, and lends itself to monitoring the dynamic heating and cooling cycles encountered in rapid-thermal processing.


1987 ◽  
Vol 92 ◽  
Author(s):  
T.O. Sedgwick

ABSTRACTThe use of Rapid Thermal Processing (RTP) as a processing tool in semiconductor technology is still increasing and and becoming more diverse. The use of RTP in a reactive mode for film growth and deposition is an important new direction. The strong interest in III-V compound annealing studies represents one of the most important application areas. Although RTP is predominantly exploratory and developmental in nature it is slowly being introduced into the manufacture of Si devices. The technological necessity for the greater use of RTP in routine production will depend on either demonstrated productivity/cost advantages or on some intrinsic advantage of RTP. The intrinsic advantages of RTP are due to the single wafer processing nature of the operation or due to the possibility of selectively enhancing one desired process over another undesired reaction in a partically fabricated structure. Although significant impovements in commercially available reactors have been made in the last several years, better temperature measurement and control and particularly temperature uniformity of the wafer are still sorely needed.


1994 ◽  
Vol 141 (11) ◽  
pp. 3200-3209 ◽  
Author(s):  
Charles D. Schaper ◽  
Mehrdad M. Moslehi ◽  
Krishna C. Saraswat ◽  
Thomas Kailath

1995 ◽  
Vol 387 ◽  
Author(s):  
J. L. Hoyt ◽  
P. Kuo ◽  
K. Rim ◽  
J. J. Welser ◽  
R. M. Emerson ◽  
...  

AbstractMaterial and device challenges for Rapid Thermal Processing (RTP) of heterostructures are discussed, focusing on RTP-based epitaxy in the Si/Si1−xGex system. While RTP-based heteroepitaxy offers enhanced processing flexibility, it also poses significant challenges for temperature measurement and control. Several examples of Si/Si1−xGex device structures are discussed from the point of view of the sensitivity of device parameters to variations in layer thickness and composition. The measured growth kinetics for Si and Si1−xGex are then used to estimate growth temperature tolerances for these structures. Demanding applications are expected to require temperature control and uniformity to within 0.5°C.Future research challenges include the fabrication of structures with monolayer thickness control using self-limited growth techniques. Atomic layer epitaxy (ALE) is a well-known example of such a growth technique. In ALE, the wafer is cyclically exposed to different reactants, to achieve layer-by-layer growth. An RTP-based atomic layer epitaxy process, and its application to the growth of CdTe films, is briefly discussed. The extension to Column IV alloys follows readily. The RTP-based process enables self-limited growth for precursor combinations for which isothermal ALE is not feasible.


Author(s):  
Peter Rodgers ◽  
Arman Molki

Hands-on laboratory skills play a vital role in providing students with a sound understanding of the scientific fundamentals and their application in solving real-life engineering problems. One of the essential laboratory based courses taught at our Institute is Introduction to Measurements and Instrumentation. The design and implementation of such a course has been well documented in Western engineering education, but presents specific challenges in the Gulf region due to economical, social and cultural factors. This paper discusses the adaptation of corresponding Western courses to undergraduate mechanical engineering studies in the Gulf region. Laboratory exercises for temperature measurement and control are described, which consist of four modules, each building upon the other. In each module, students learn how to design an accurate measuring system, and process and interpret collected data. In the first module, the students are required to build a thermocouple reader using an AD620 instrumentation amplifier and to compare measurements with NIST reference tables. The second module is an introduction to LabVIEW, a graphical data acquisition programming language. The students are required to write a LabVIEW program to record multiple thermocouple signals from a heated plate under varying convective cooling conditions, using a high resolution temperature logger with on-board signal conditioning. The third and fourth modules focus on temperature control techniques. In the third laboratory exercise, the students are required to construct an electrical circuit using a low-power PCB relay and NPN bipolar transistor to develop a bang-bang linear temperature controller. The program created in module two is modified to have the heater operation automatically controlled for a fixed temperature set point. In module four, the students replace the bang-bang controller built in the previous lab with a commercially available PID controller and explore the differences between PID and linear temperature control systems. For each module, students are required to submit a formal report covering the theoretical background, the experimental procedure employed, uncertainty analysis, and conclusions and recommendations. An effective teaching strategy is outlined that covers the fundamental concepts of temperature measurement and control through carefully designed experiments, with sample results presented. Emphasis is placed on the tailoring of the course topics to engineering education in the Gulf region.


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