In situ infrared spectroscopy study of the interface self-cleaning during the atomic layer deposition of HfO2 on GaAs(100) surfaces

2014 ◽  
Vol 105 (12) ◽  
pp. 121604 ◽  
Author(s):  
Liwang Ye ◽  
Theodosia Gougousi
2010 ◽  
Vol 22 (17) ◽  
pp. 4867-4878 ◽  
Author(s):  
S. K. Park ◽  
R. Kanjolia ◽  
J. Anthis ◽  
R. Odedra ◽  
N. Boag ◽  
...  

2015 ◽  
Vol 27 (14) ◽  
pp. 4943-4949 ◽  
Author(s):  
Karla Bernal-Ramos ◽  
Mark J. Saly ◽  
Ravindra K. Kanjolia ◽  
Yves J. Chabal

2018 ◽  
Vol 20 (39) ◽  
pp. 25343-25356 ◽  
Author(s):  
Michiel Van Daele ◽  
Christophe Detavernier ◽  
Jolien Dendooven

Thermal atomic layer deposition (ALD) and plasma-enhanced ALD (PE-ALD) of Pt, using MeCpPtMe3 as the precursor and O2 gas or O2 plasma as the reactant, are studied with in situ reflection Fourier transform infrared spectroscopy (FTIR) at different substrate temperatures.


2002 ◽  
Vol 745 ◽  
Author(s):  
Martin M. Frank ◽  
Yves J. Chabal ◽  
Glen D. Wilk

ABSTRACTThere is great need for a mechanistic understanding of growth chemistry during atomic layer deposition (ALD) of films for electronic applications. Since commercial ALD reactors are presently not equipped for in situ spectroscopy, we have constructed a model reactor that enables single-pass transmission infrared spectroscopy to be performed in situ on a layer-by-layer basis. We demonstrate the viability of this approach for the study of aluminum oxide growth on silicon surfaces, motivated by alternative gate oxide applications. Thanks to submonolayer dielectric and adsorbate sensitivity, we can quantify oxide thicknesses and hydroxyl areal densities on thermal and chemical SiO2/Si(100) substrates. Methyl formation and hydroxyl consumption upon initial trimethylaluminum (TMA) reaction can also be followed. We verify that in situ grown Al2O3 films are compatible in structure to films grown in a commercial ALD reactor.


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