scholarly journals Pilot demonstration of correlation-domain LiDAR for high-speed vibration detection

APL Photonics ◽  
2021 ◽  
Vol 6 (10) ◽  
pp. 101302
Author(s):  
Takaki Kiyozumi ◽  
Tomoya Miyamae ◽  
Kohei Noda ◽  
Heeyoung Lee ◽  
Kentaro Nakamura ◽  
...  
Keyword(s):  
High Speed ◽  
Vibration Detection

A laser-optical sensor system for blade vibration detection of high-speed compressors

2015 ◽  
Vol 64-65 ◽  
pp. 337-346 ◽  
Author(s):  
Mathias Neumann ◽  
Florian Dreier ◽  
Philipp Günther ◽  
Ulrich Wilke ◽  
Andreas Fischer ◽  
...  
Keyword(s):  
Optical Sensor ◽  
High Speed ◽  
Sensor System ◽  
Blade Vibration ◽  
Vibration Detection

scholarly journals Vibration Detection and Experiment of PMSM High Speed Grinding Motorized Spindle Based on Frequency Domain Technology

2019 ◽  
Vol 19 (3) ◽  
pp. 109-125 ◽  
Author(s):  
Mingke Cheng ◽  
Feng Gao ◽  
Yan Li
Keyword(s):  
Power Spectrum ◽  
Spectrum Analysis ◽  
High Speed ◽  
Least Square Method ◽  
Least Square ◽  
Motorized Spindle ◽  
Vibration Detection ◽  
Vibration Model ◽  
High Speed Grinding ◽  
Spindle Structure

Abstract The spindle vibrations of the high-speed grinding motorized spindle largely determine the machining quality and precision. In order to accurately predict the spindle vibrations of the PMSM high-speed grinding motorized spindle, the vibration causes are explored and analyzed. The radial vibration, inclined vibration, and axial vibration model are established. The experimental modal analysis method is proposed to analyze the dynamic response of the spindle and to identify the modal parameters of the spindle structure. Thereafter, the frequency response function (FRF) is calculated by self-power spectrum and cross-power spectrum. It is transformed into the vibration spectrum analysis of the spindle. The least-square method is used to fit the radial trajectory of the spindle. This paper aims to propose double standard spheres for 5- DOF spindle vibrations used to detect the spindle vibrations. In the experiment, the method proposed in this paper can effectively and accurately determine the causes of the spindle vibrations. The spectrum analysis and the trajectory are common tools in the spindle vibration detection.

Modal Identification of High-Speed Railway Bridges through Free-Vibration Detection

2020 ◽  
Vol 146 (9) ◽  
pp. 04020107
Author(s):  
Xiao-Mei Yang ◽  
Ting-Hua Yi ◽  
Chun-Xu Qu ◽  
Hong-Nan Li ◽  
Hua Liu
Keyword(s):  
Free Vibration ◽  
High Speed ◽  
Modal Identification ◽  
High Speed Railway ◽  
Railway Bridges ◽  
Vibration Detection

Based on Signal Processing and Diagnosis for Large Port Crane Condition Monitoring System Vibration Detection of High Speed Heavy-Duty Crane

2014 ◽  
Vol 494-495 ◽  
pp. 825-829
Author(s):  
Min Hui Tong ◽  
Hui Qing Qiu ◽  
Yue Min Wang
Keyword(s):  
Signal Processing ◽  
Condition Monitoring ◽  
High Speed ◽  
Heavy Duty ◽  
Monitoring And Diagnosis ◽  
Sensing System ◽  
Vibration Detection ◽  
System Vibration ◽  
Condition Monitoring System ◽  
Operation Status

In order to master the safety status of the large port crane and diagnosis and predict the fault in advance for alerting, the condition monitoring and diagnosis & sensing system is used in this paper. By using sorts of sensors and accelerate meters installing on the crane, acquire all kind of signals of the machine, then put the data to the signal processing and diagnosis sensing system, the operation status of the crane can be found out, and the potential fault or failure can be diagnosis and detected in advance. The condition monitoring and diagnosis & sensing sys-tem can acquired the condition status from the large port crane and diagnosis the potential fault or failure for the machine. Thus, the problem how to master the condition of the large crane port crane and provided the safety alerting for the huge machine is solved.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

An atomic-resolution microscope study of Al contracts on GaAs

1986 ◽  
Vol 44 ◽  
pp. 726-727
Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
High Speed ◽  
Schottky Contacts ◽  
Detailed Knowledge ◽  
The Past ◽  
Semiconductor Interfaces ◽  
Deposited Metal ◽  
Microwave Applications ◽  
Free Interfaces ◽  
Potential Use

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions

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