Study on Thermal Performance of Single-layer and Multi-layer Stone Aluminum Honeycomb Composite Panels

In this paper, two kinds of suspended micro hotplate with novel shapes of multibeam structure and reticular structure are designed. These designs have a reliable mechanical strength, so they can be designed and fabricated on single-layer SiO2 suspended film through a simplified process. Single-layer suspended film helps to reduce power consumption. Based on the new film shapes, different resistance heaters with various widths and thicknesses are designed. Then, the temperature uniformity and power consumption of different micro hotplates are compared to study the effect of these variables and obtain the one with the optimal thermal performance. We report the simulations of temperature uniformity and give the corresponding infrared images in measurement. The experimental temperature differences are larger than those of the simulation. Experimental results show that the lowest power consumption and the minimum temperature difference are 43 mW and 50 °C, respectively, when the highest temperature on the suspended platform (240 × 240 μm2) is 450 °C. Compared to the traditional four-beam micro hotplate, temperature non-uniformity is reduced by about 30–50%.

Download Full-text

Ultra-Slim Packages

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2012dpc-wa21 ◽

2012 ◽

Vol 2012 (DPC) ◽

pp. 001477-001506

Author(s):

Bernd K. Appelt

Keyword(s):

Cross Section ◽

Double Layer ◽

Thermal Performance ◽

Cycle Time ◽

Single Layer ◽

Reliability Data ◽

Number Of Layers ◽

Low Profile

What does thin or ultra-slim packaging mean? That of course depends on the particular cross-section of the substrate e.g. single layer vs. double layer vs. coreless or embedded component substrate, etc. The thinnest prepreg based substrate and concomitant package is a single layer substrate termed a-S3 ™ and can be as thin as 90 μ and 400 μ, respectively, with the appropriate mold cap. The manufacturing concept for a-S3 has inspired a new manufacturing concept for thin prepreg based coreless substrates with any number of layers. Layers two through five have been demonstrated successfully. The practical layer count is limited only by yield and cycle time. The same concept has been extended also to embedding active die as well as passives, a-EASI™. The total package height here is governed by the thickness of the embedded elements. The simplest embedded substrate is a two layer substrate with a MOSFET die. The advantage is a very low profile power package with excellent electrical and thermal performance. The interconnections to the die/passives are formed by plated laser vias as is common practice. Process flows and concepts will be introduced here. Thin substrates do pose many challenges during substrate manufacturing as well as during assembly. Some of the handling concepts will be elucidated. Sample pictures will be shown to demonstrate successful builds and some reliability data will be presented as well.

Download Full-text

Thin Substrates Bursting into the Market

International Symposium on Microelectronics ◽

10.4071/isom-2012-thp45 ◽

2012 ◽

Vol 2012 (1) ◽

pp. 001149-001154

Author(s):

Bernd K Appelt ◽

Bruce Su ◽

Dora Lee ◽

Kidd Lee ◽

Uno Yen

Keyword(s):

Thermal Performance ◽

Cycle Time ◽

Mobile Applications ◽

Single Layer ◽

Reliability Data ◽

Number Of Layers ◽

Low Profile

The continued drive for miniaturization by mobile applications demands its toll also from packaging. Innovative packages are required to shrink volume and weight of packages. This has led to the development of single layer, coreless and embedded component substrates. The thinnest prepreg based substrate and concomitant package is a single layer substrate termed a-S3 ™ and can be as thin as 90 μ and 400 μ, respectively, with the appropriate mold cap. The manufacturing concept for a-S3 has inspired a new manufacturing concept for thin prepreg based coreless substrates with any number of layers. Layers two through seven have been demonstrated successfully. The practical layer count is limited only by yield and cycle time. The same concept has been extended also to embedding active die as well as passives, a-EASI™. The total package height here is governed by the thickness of the embedded elements. The simplest embedded substrate is a two layer substrate with a MOSFET die. The advantage is a very low profile power package with excellent electrical and thermal performance. The interconnections to the die/passives are formed by plated laser vias as is a common practice. Process flows and concepts will be introduced here. Thin substrates do pose many challenges during substrate manufacturing as well as during assembly. Some of the handling concepts will be elucidated. Sample pictures will be shown to demonstrate successful builds and some reliability data will be presented as well.

Download Full-text

Numerical Predictions of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Microchannel Heat Sinks

Numerical Heat Transfer Part A Applications ◽

10.1080/10407782.2013.730445 ◽

2013 ◽

Vol 63 (3) ◽

pp. 201-225 ◽

Cited By ~ 66

Author(s):

Gongnan Xie ◽

Zhiyong Chen ◽

Bengt Sunden ◽

Weihong Zhang

Keyword(s):

Double Layer ◽

Thermal Performance ◽

Single Layer ◽

Heat Sinks ◽

Numerical Predictions ◽

Microchannel Heat Sinks

Download Full-text

Energy Absorption and Crush Behavior of the Layered Aluminum Honeycomb

The Open Civil Engineering Journal ◽

10.2174/1874149501711010033 ◽

2017 ◽

Vol 11 (1) ◽

pp. 33-42

Author(s):

Weiming Luo ◽

Shaoqing Shi ◽

Zipeng Chen ◽

Jianhu Sun

Keyword(s):

Energy Absorption ◽

Surface Density ◽

Static Load ◽

Single Layer ◽

Honeycomb Structure ◽

Soft Layer ◽

Aluminum Honeycomb ◽

The Mean ◽

Absorption Characteristics ◽

Better Than

To investigate the energy absorption characteristics and crush behavior of layered aluminum honeycomb, the experiments of layered aluminum honeycomb structure under quasi-static load had been carried out, mainly includes single, double, triple, four layer combinations. The results showed that: the peak force and the mean plateau force of single-layer aluminum honeycomb structure are proportional to the surface density, however they decline slightly with increase of the height; unequal height double layered aluminum honeycomb structure has more advantage in cushion performance; with the increase of layers, the MP ratio will decrease; the combination of placing soft layer between hard layers is better than the others.

Download Full-text