Ultra-Slim Packages

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001477-001506
Author(s):  
Bernd K. Appelt
Keyword(s):  
Cross Section ◽  
Double Layer ◽  
Thermal Performance ◽  
Cycle Time ◽  
Single Layer ◽  
Reliability Data ◽  
Number Of Layers ◽  
Low Profile

What does thin or ultra-slim packaging mean? That of course depends on the particular cross-section of the substrate e.g. single layer vs. double layer vs. coreless or embedded component substrate, etc. The thinnest prepreg based substrate and concomitant package is a single layer substrate termed a-S3 ™ and can be as thin as 90 μ and 400 μ, respectively, with the appropriate mold cap. The manufacturing concept for a-S3 has inspired a new manufacturing concept for thin prepreg based coreless substrates with any number of layers. Layers two through five have been demonstrated successfully. The practical layer count is limited only by yield and cycle time. The same concept has been extended also to embedding active die as well as passives, a-EASI™. The total package height here is governed by the thickness of the embedded elements. The simplest embedded substrate is a two layer substrate with a MOSFET die. The advantage is a very low profile power package with excellent electrical and thermal performance. The interconnections to the die/passives are formed by plated laser vias as is common practice. Process flows and concepts will be introduced here. Thin substrates do pose many challenges during substrate manufacturing as well as during assembly. Some of the handling concepts will be elucidated. Sample pictures will be shown to demonstrate successful builds and some reliability data will be presented as well.

Thin Substrates Bursting into the Market

2012 ◽  
Vol 2012 (1) ◽  
pp. 001149-001154
Author(s):  
Bernd K Appelt ◽  
Bruce Su ◽  
Dora Lee ◽  
Kidd Lee ◽  
Uno Yen
Keyword(s):  
Thermal Performance ◽  
Cycle Time ◽  
Mobile Applications ◽  
Single Layer ◽  
Reliability Data ◽  
Number Of Layers ◽  
Low Profile

The continued drive for miniaturization by mobile applications demands its toll also from packaging. Innovative packages are required to shrink volume and weight of packages. This has led to the development of single layer, coreless and embedded component substrates. The thinnest prepreg based substrate and concomitant package is a single layer substrate termed a-S3 ™ and can be as thin as 90 μ and 400 μ, respectively, with the appropriate mold cap. The manufacturing concept for a-S3 has inspired a new manufacturing concept for thin prepreg based coreless substrates with any number of layers. Layers two through seven have been demonstrated successfully. The practical layer count is limited only by yield and cycle time. The same concept has been extended also to embedding active die as well as passives, a-EASI™. The total package height here is governed by the thickness of the embedded elements. The simplest embedded substrate is a two layer substrate with a MOSFET die. The advantage is a very low profile power package with excellent electrical and thermal performance. The interconnections to the die/passives are formed by plated laser vias as is a common practice. Process flows and concepts will be introduced here. Thin substrates do pose many challenges during substrate manufacturing as well as during assembly. Some of the handling concepts will be elucidated. Sample pictures will be shown to demonstrate successful builds and some reliability data will be presented as well.

Dynamic Countermeasure Fabrics for Post-Spaceflight Orthostatic Intolerance

2020 ◽  
Vol 91 (6) ◽  
pp. 525-531 ◽  
Author(s):  
Rachael M. Granberry ◽  
Kevin P. Eschen ◽  
Amy J. Ross ◽  
Julianna M. Abel ◽  
Bradley T. Holschuh
Keyword(s):  
Double Layer ◽  
High Performance ◽  
Orthostatic Intolerance ◽  
Dynamic Compression ◽  
Single Layer ◽  
Design Parameters ◽  
Layer System ◽  
Compression Garments ◽  
Air Supply ◽  
Low Profile

INTRODUCTION: Aerospace orthostatic intolerance garments (OIG) have historically been pneumatic (e.g., NASA’s antigravity suit), an approach that inhibits mobility and requires connection to an air supply. Elastic compression garments, an alternative technology, are difficult to don/doff and cannot be worn in a noncompressive state, resulting in discomfort and usability challenges. This research evaluates a novel technology—contractile shape memory alloy (SMA) knitted actuators—that can enable low-profile, dynamic compression for an aerospace OIG.METHODS: To characterize the functional capabilities of SMA knitted actuators, displacement control testing was conducted on 10 actuator samples with a range of geometric design parameters. Inactive (FI) and actuated forces (FA) were observed by repeatedly thermally cycling each sample at 0%, 15%, 30%, and 45% structural strain. Compression capabilities were approximated using medical compression hosiery standards and anthropometric data from a representative aerospace population (ANSUR 2012).RESULTS: Dynamic compression predictions reached 52 mmHg (single layer fabric) and 105 mmHg (double layer fabric) at the ankle. Low, inactive pressures (p < 20 mmHg) demonstrate that compression is controllable and can be dynamically increased upon actuation up to 33 mmHg in a single layer system and up to 67 mmHg in a double layer system.DISCUSSION: The results highlight the potential of SMA knitted actuators to enable low-profile, dynamic compression garments that can reach medically therapeutic pressures on an aerospace population to counteract OI symptoms. In addition to astronautic applications, this technology demonstrates widespread terrestrial medical and high-performance aircraft applicability.Granberry RM, Eschen KP, Ross AJ, Abel JM, Holschuh BT. Dynamic countermeasure fabrics for post-spaceflight orthostatic intolerance. Aerosp Med Hum Perform. 2020; 91(6):525–531.

Cracking at the fold in double layer coated paper: the influence of latex and starch composition

TAPPI Journal ◽  
2019 ◽  
Vol 18 (2) ◽  
pp. 93-99
Author(s):  
SEYYED MOHAMMAD HASHEMI NAJAFI ◽  
DOUGLAS BOUSFIELD, ◽  
MEHDI TAJVIDI
Keyword(s):  
Mechanical Properties ◽  
Double Layer ◽  
Starch Content ◽  
Single Layer ◽  
Double Layers ◽  
Coated Paper ◽  
Coated Papers ◽  
Coating Layers ◽  
Scanned Images ◽  
Packaging Paper

Cracking at the fold of publication and packaging paper grades is a serious problem that can lead to rejection of product. Recent work has revealed some basic mechanisms and the influence of various parameters on the extent of crack area, but no studies are reported using coating layers with known mechanical properties, especially for double-coated systems. In this study, coating layers with different and known mechanical properties were used to characterize crack formation during folding. The coating formulations were applied on two different basis weight papers, and the coated papers were folded. The binder systems in these formulations were different combinations of a styrene-butadiene latex and mixtures of latex and starch for two different pigment volume concentrations (PVC). Both types of papers were coated with single and double layers. The folded area was scanned with a high-resolution scanner while the samples were kept at their folded angle. The scanned images were analyzed within a constant area. The crack areas were reported for different types of papers, binder system and PVC values. As PVC, starch content, and paper basis weight increased, the crack area increased. Double layer coated papers with high PVC and high starch content at the top layer had more cracks in comparison with a single layer coated paper, but when the PVC of the top layer was low, cracking area decreased. No measurable cracking was observed when the top layer was formulated with a 100% latex layer.

Single layer versus double layer suture for anastomosis of the gastrointestinal tract

2009 ◽  
Author(s):  
Alvaro Sanabria ◽  
Gabriel Gomez ◽  
Eduardo Valdivieso ◽  
C Bermudez
Keyword(s):  
Gastrointestinal Tract ◽  
Double Layer ◽  
Single Layer ◽  
Layer Versus

Single layer versus double layer suture for anastomosis of the gastrointestinal tract

2005 ◽  
Author(s):  
Alvaro Sanabria ◽  
Gabriel Gomez ◽  
Eduardo Valdivieso ◽  
C Bermudez
Keyword(s):  
Gastrointestinal Tract ◽  
Double Layer ◽  
Single Layer ◽  
Layer Versus

scholarly journals Stochastic Thermal Properties of Laminates Filled with Long Fibers

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2511
Author(s):  
Jan Turant
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Cross Section ◽  
Circular Cross Section ◽  
Saturation Density ◽  
Composite Matrix ◽  
Number Of Layers ◽  
Stochastic Parameters ◽  
Multilayer Composites ◽  
Long Fibers

In this paper, the stochastic parameters of the effective thermal conductivity of multilayer composites are considered. The examined specimens of composites were built with a different number of layers and each had a different saturation density of a composite matrix with fibers. For each case of laminate built with a prescribed number of layers and assumed saturation density, 10,000 tests of its effective thermal conductivity were carried out using numerical experiments. It was assumed that the fibers located in each layer were rectilinear, had a circular cross-section and that they could take random positions in their repeatable volume elements (RVEs). In view of the mentioned assumptions, the heat flux passing throughout a cross-section of a composite sample, perpendicular to the fibers’ direction, was considered. The probability density functions were fitted to the obtained data and then the chosen stochastic parameters of the effective thermal conductivity coefficients were determined.

scholarly journals Electron-phonon interaction in In-induced √7 ×√3 structures on Si(111) from first-principles

2021 ◽  
Author(s):  
I. Yu. Sklyadneva ◽  
Rolf Heid ◽  
Pedro Miguel Echenique ◽  
Evgueni Chulkov
Keyword(s):  
Density Functional Theory ◽  
Double Layer ◽  
First Principles ◽  
Linear Response ◽  
Density Functional ◽  
Single Layer ◽  
Phonon Interaction ◽  
Functional Theory ◽  
Electron Phonon Interaction ◽  
The Density Functional Theory

Electron-phonon interaction in the Si(111)-supported rectangular √(7 ) ×√3 phases of In is investigated within the density-functional theory and linear-response. For both single-layer and double-layer √(7 ) ×√3 structures, it...

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