scholarly journals Microchannel Heat Sink with High Thermal Conductivity Path for Diode Partially End-Pumped Slab Laser

2021 ◽  
Vol 1739 ◽  
pp. 012033
Author(s):  
Zhanfeng Guo ◽  
Yongjin Wu ◽  
Yunna Sun ◽  
Yan Wang ◽  
Guifu Ding
2021 ◽  
Author(s):  
Andisheh Tavakoli ◽  
Kambiz Vafai

Abstract The present study analyzes the optimal distribution of a limited amount of high thermal conductivity material to enhance the heat removal of circular 3D integrated circuits, IC. The structure of the heat spreader is designed as a composite of high thermal conductivity (Boron Arsenide) and moderate thermal conductivity (copper) materials. The volume ratio of high-conductivity inserts to the total volume of the spreader is set at a fixed pertinent ratio. Two different boundary conditions of constant and variable temperature are considered for the heat sink. To examine the impact of adding high-conductivity inserts on the cooling performance of the heat spreader, various patterns of the single and double ring inserts are studied. A parametric study is performed to find the optimal location of the rings. Moreover, the optimal distribution of the high-conductivity material between the inner and outer rings is found. The results show that for the optimal conditions, the maximum temperature of the 3D IC is reduced up to 10%; while the size of the heat sink, and heat spreader can be diminished by as much as 200%.


Author(s):  
Yoshikazu Hayashi ◽  
Gordon Yip ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim

Galinstan is a eutectic alloy of gallium, indium, and tin, of which thermal conductivity is ∼27 times higher than that of water, while the dynamic viscosity is only twice. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the direct use of galinstan can suffer from practical issues such as oxidation and low specific heat. Therefore, galinstan is mixed with a coolant as an additive to form a colloidal fluid; i.e., dispersion of nanoscale galinstan droplets in a coolant to enhance the thermal conductivity. It is expected that this “metallic nanoemulsion” can contribute to substantial improvement in heat transfer capability. Also, the common issues with colloidal fluids such as rapid sedimentation, erosion, and clogging, can be minimized by the “fluidity” of the liquid metal. It was shown that ultrasonic emulsification can yield few hundreds scale nanodroplets. However, the long exposure of galinstan to oxygen in water inevitably results in severe oxidation of the droplets. Theoretical analysis was also conducted to examine the feasibility of the metallic nanoemulsion as a microchannel heat-sink working fluid. Effective medium theory was used to evaluate the thermal conductivity of the mixture. The viscosity change was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Under one-dimensional laminar flow assumption, mass, momentum, and energy conservation equations were analytically solved. The effect of high thermal conductivity of galinstan was evident; the convection heat transfer capability was greatly enhanced, while the viscosity increase due to the nanoscale blending and the low specific heat of galinstan counteracts and reduce the flow rate and thus increase the caloric thermal resistance.


Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1186
Author(s):  
Michal Guzej ◽  
Martin Zachar ◽  
Jan Kominek ◽  
Petr Kotrbacek ◽  
Robert Brachna

Polymers with highly conductive fillers could possibly replace standardly used materials, such as aluminum and copper alloys, for passive cooling purposes. The main problem of the composite polymer-based heat sinks is that their high thermal conductivity is uneven. The orientation of this anisotropy is set according to the position of the highly thermally conductive filler. Its orientation is influenced by the melt flow during the polymer heat sink molding process. This article shows that change of the melt flow inside the mold cavity can improve the overall cooling efficiency of a polymer heat sink, which leads to lower temperatures on the heat source used. Two polymer heat sinks of identical geometries were produced. Their high thermal conductivity was given by the use of graphite flakes as the filler. The only difference between the heat sinks was in the position of the fan gate during their production. Different temperatures of the heat source between the two heat sinks were observed for the same measurement conditions. The measurements were conducted at Heatlab, BUT/Brno.


Author(s):  
Zhanfeng Guo ◽  
Yunna Sun ◽  
Yan Wang ◽  
Guangyuan Wang ◽  
Xutong Song ◽  
...  

With the power level of diode-pumped solid-state laser (DPSSL) rising continuously, its thermal effect has become the main problem limiting the laser performance. In this paper, based on the heat distribution of diode partially end-pumped slab(Innoslab) laser, a shunt rectangular microchannel heat sink with locally enhanced heat dissipation is designed. Firstly, multi-stage parallel short channels are designed in the heat concentration area to enhance the solid-liquid heat exchange in this area, and the effects of structure and working conditions on its heat dissipation performance are investigated. Secondly, the copper layer is introduced into the end face of the low thermal conductivity crystal to form a high thermal conductivity path, which alleviates the heat accumulation inside the crystal. Compared with the traditional liquid-cooled plate system, the maximum temperature of the laser crystal is reduced from 169.62℃ to 118.18℃, the pressure drop is reduced by 66.75%, and the total mass of the system is reduced to 4.87% of the original system, which effectively improves the practical performance of the device.


2020 ◽  
Vol 8 (44) ◽  
pp. 15705-15716
Author(s):  
Safoura Nayeb Sadeghi ◽  
S. Mehdi Vaez Allaei ◽  
Mona Zebarjadi ◽  
Keivan Esfarjani

Using first-principles methods to calculate thermomechanical properties of BC2N, we investigate the effect of pressure on its high thermal conductivity and show that its thermal expansion matches that of Si, making it a good candidate as a heat sink for electronic devices.


Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.


1989 ◽  
Vol 154 ◽  
Author(s):  
Jun Tanaka ◽  
Satoshi Kajita ◽  
Masami Terasawa

AbstractMullite ceramics were developed for multilayered packages, which have a lower dielectric constant and a nearer thermal expansion to that of silicon than those of alumina. The multilayered mullite packages are manufactured by using a similar cofired technology with tungsten or molybdenum to the conventionally used alumina system. A new brazing material and a new lead material were developed to be combined with the mullite ceramics Multilayered mullite packages with a brazed aluminum nitride heat sink, which has a high thermal conductivity, were developed to compensate a low thermal conductivity of the mullite itself. The packages are one of the highest performance packages.


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