scholarly journals Non-destructive high-resolution thermal imaging techniques to evaluate wildlife and delicate biological samples

2009 ◽  
Vol 178 ◽  
pp. 012040 ◽  
Author(s):  
C Lavers ◽  
P Franklin ◽  
P Franklin ◽  
A Plowman ◽  
G Sayers ◽  
...  
Keyword(s):  
High Resolution ◽  
Biological Samples ◽  
Thermal Imaging ◽  
Imaging Techniques ◽  
Non Destructive

Fruit Ripeness Estimation for Avocado Using Thermal Imaging

2018 ◽  
Author(s):  
Sathish K. Gurupatham ◽  
Erhan Ilksoy ◽  
Nick Jacob ◽  
Kevin Van Der Horn ◽  
Fahad Fahad
Keyword(s):  
Thermal Imaging ◽  
Imaging Techniques ◽  
Scientific Enterprise ◽  
Thermal Images ◽  
Novel Technologies ◽  
Different Temperatures ◽  
Visible Images ◽  
Specific Heat Capacities ◽  
Analytical Approaches ◽  
Non Destructive

Novel technologies have always been an indispensable part of the scientific enterprise and a catalyst for new discoveries. The invisible radiation patterns of objects are converted into visible images called thermograms or thermal images. Thermal images can be utilized to estimate the ripeness of some fruits which do not change their color from yellow to green when they are ripe. Thermal imaging techniques are very helpful since color and fluorescent analytical approaches cannot be applied to these fruits. In this work, it is shown that different ripeness levels of avocado (Hall type) using a non-destructive method called thermal imaging, in two dimensional spaces. The work is based on the fact that fruits have different specific heat capacities at different temperatures, thus making their thermal images clear indicators of ripeness.

scholarly journals Non-Destructive Characterization of Railway Materials and Components with Infrared Thermography Technique

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4077 ◽  
Author(s):  
Jeongguk Kim
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Hot Spot ◽  
Imaging Techniques ◽  
Brake Disc ◽  
Ir Thermography ◽  
Contact Mode ◽  
Non Destructive Evaluation ◽  
Non Destructive

Infrared (IR) thermography technology is one of the leading non-destructive evaluation (NDE) techniques based on infrared detection. Infrared thermography, in particular, has the advantage of not only being used in non-contact mode but also provides full images, real-time inspection, and relatively fast results. These advantages make it possible to perform thermal imaging analysis of railway materials and/or components, such as brake disc simulation, monitoring of abnormal heat generation, and monitoring of temperature changes, during mechanical tests. This study introduces the current state of research on railway materials and/or components using IR thermography technology. An attempt was made to characterize the deterioration of electrical equipment of diesel electric locomotives using infrared thermal imaging techniques. In addition, surface temperature monitoring was performed during tensile testing of railway steels using a high-speed infrared camera. Damage evolution due to the hot spot generation of railway brake discs was successfully monitored using high-speed IR cameras. In this paper, IR thermal imaging technology, used as a non-destructive evaluation analysis in the railway field, was introduced, and the results of recent research are presented.

High-resolution topographic SEM and radiation damage: The rationale for using low beam voltage

1992 ◽  
Vol 50 (2) ◽  
pp. 1278-1279
Author(s):  
James Pawley ◽  
David Joy
Keyword(s):  
High Resolution ◽  
Imaging Techniques ◽  
Morphological Structure ◽  
Radiation Sensitivity ◽  
Beam Specimen ◽  
Measured Signal ◽  
Practical Consideration ◽  
Interaction Volume ◽  
Impact Area ◽  
Signal Contrast

The scanning electron microscope (SEM) builds up an image by sampling contiguous sub-volumes near the surface of the specimen. A fine electron beam selectively excites each sub-volume and then the intensity of some resulting signal is measured and then plotted as a corresponding intensity in an image. The spatial resolution of such an image is limited by at least three factors. Two of these determine the size of the interaction volume: the size of the electron probe and the extent to which detectable signal is excited from locations remote from the beam impact area. A third limitation emerges from the fact that the probing beam is composed of a number of discrete particles and therefore that the accuracy with which any detectable signal can be measured is limited by Poisson statistics applied to this number (or to the number of events actually detected if this is smaller). As in all imaging techniques, the limiting signal contrast required to recognize a morphological structure is constrained by this statistical consideration. The only way to overcome this limit is to increase either the contrast of the measured signal or the number of beam/specimen interactions detected. Unfortunately, these interactions deposit ionizing radiation that may damage the very structure under investigation. As a result, any practical consideration of the high resolution performance of the SEM must consider not only the size of the interaction volume but also the contrast available from the signal producing the image and the radiation sensitivity of the specimen.

Recent applications of TEM to the study of interfaces

1990 ◽  
Vol 48 (4) ◽  
pp. 308-309
Author(s):  
C. Barry Carter
Keyword(s):  
High Resolution ◽  
Sample Preparation ◽  
Grain Boundaries ◽  
Diffuse Scattering ◽  
Imaging Techniques ◽  
Amorphous Material ◽  
Contrast Imaging ◽  
Current State ◽  
Actual Nature ◽  
High Resolution Images

This paper will review the current state of understanding of interface structure and highlight some of the future needs and problems which must be overcome. The study of this subject can be separated into three different topics: 1) the fundamental electron microscopy aspects, 2) material-specific features of the study and 3) the characteristics of the particular interfaces. The two topics which are relevant to most studies are the choice of imaging techniques and sample preparation. The techniques used to study interfaces in the TEM include high-resolution imaging, conventional diffraction-contrast imaging, and phase-contrast imaging (Fresnel fringe images, diffuse scattering). The material studied affects not only the characteristics of the interfaces (through changes in bonding, etc.) but also the method used for sample preparation which may in turn have a significant affect on the resulting image. Finally, the actual nature and geometry of the interface must be considered. For example, it has become increasingly clear that the plane of the interface is particularly important whenever at least one of the adjoining grains is crystalline.A particularly productive approach to the study of interfaces is to combine different imaging techniques as illustrated in the study of grain boundaries in alumina. In this case, the conventional imaging approach showed that most grain boundaries in ion-thinned samples are grooved at the grain boundary although the extent of this grooving clearly depends on the crystallography of the surface. The use of diffuse scattering (from amorphous regions) gives invaluable information here since it can be used to confirm directly that surface grooving does occur and that the grooves can fill with amorphous material during sample preparation (see Fig. 1). Extensive use of image simulation has shown that, although information concerning the interface can be obtained from Fresnel-fringe images, the introduction of artifacts through sample preparation cannot be lightly ignored. The Fresnel-fringe simulation has been carried out using a commercial multislice program (TEMPAS) which was intended for simulation of high-resolution images.

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

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