scholarly journals Design of 3D volumetric display

2021 ◽  
Vol 2070 (1) ◽  
pp. 012204
Author(s):  
Aravind P Madhu ◽  
C Akhil Balu ◽  
Akshay Krishnan ◽  
Adithya Aravind ◽  
Jibin Noble ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Display Device ◽  
Stereoscopic Display ◽  
3D Images ◽  
Light Emitting ◽  
3D Objects ◽  
3D Space ◽  
Swept Volume ◽  
Visual Clues

Abstract Stereoscopic, or multi-view, display systems that can give significant visual clues for the human brain to understand three-dimensional (3D) objects, they are regarded as better alternatives to traditional two-dimensional (2D) displays. A device that can render 3D images for viewers without the use of specific headgear or glasses is known as an auto-stereoscopic display. Manipulation of light rays via Light engines is also used to create 3D images in 3D space. We introduce a new auto-stereoscopic swept-volume display (SVD) system based on light-emitting diode (LED) arrays in this research. A display device plus a graphics control sub-system makes up this system. The display device is a 2D revolving panel of LEDs that generates 3D images using “persistence of vision”.

Extended Kalman Filter-Aided Active Beam Tracking for LED Communication in 3D Space

2017 ◽  
Author(s):  
Pratap Bhanu Solanki ◽  
Xiaobo Tan
Keyword(s):  
Kalman Filter ◽  
Extended Kalman Filter ◽  
Communication Systems ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Free Space Optical ◽  
Light Emitting ◽  
3D Space ◽  
Alignment System ◽  
Space Optical Communication

Maintaining Line-Of-Sight (LOS) between the receiver and the transmitter is an inherent challenge associated with light-emitting diode (LED)-based free space optical communication systems, especially when such systems are used by mobile robots. Due to constant movement of underlying robotic platforms and other unwanted disturbances, there is a need for an active alignment system that allows the receiver to constantly track the direction of the transmitting device. In this paper, we propose an active alignment control system, equipped with two degree-of-freedom (DOF) actuation and capable of tracking a transmitting source moving in the three-dimensional (3D) space. A 3D extension of a previously proposed Extended Kalman Filter-based algorithm is used to estimate the components of the angle between the receiver orientation and the receiver-transmitter line, which are used subsequently to adjust the receiver orientation. The algorithm uses only the measured light intensity from a single photo-diode, where successive measurements are obtained via a circular scanning technique. Simulation results are presented to illustrate the proposed approach and explore the tradeoffs in the design of the scanning pattern. In particular, a scheme with adaptively adjusted scanning amplitude is shown to deliver satisfactory alignment performance with actuation effort.

scholarly journals Comparative Study of Four TiO2-Based Photocatalysts to Degrade 2,4-D in a Semi-Passive System

Water ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 621 ◽  
Author(s):  
Gisoo Heydari ◽  
Jordan Hollman ◽  
Gopal Achari ◽  
Cooper Langford
Keyword(s):  
Energy Consumption ◽  
Degradation Rate ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Dichlorophenoxyacetic Acid ◽  
Light Emitting ◽  
Glass Spheres ◽  
Degradation Rate Constant ◽  
2,4 Dichlorophenoxyacetic Acid ◽  
Mode Energy

In this study, the relative efficiency of four forms of supported titanium dioxide (TiO2) as a photocatalyst to degrade 2,4-dichlorophenoxyacetic acid (2,4-D) in Killex®, a commercially available herbicide was studied. Coated glass spheres, anodized plate, anodized mesh, and electro-photocatalysis using the anodized mesh were evaluated under an ultraviolet – light-emitting diode (UV-LED) light source at λ = 365 nm in a semi-passive mode. Energy consumption of the system was used to compare the efficiency of the photocatalysts. The results showed both photospheres and mesh consumed approximately 80 J/cm3 energy followed by electro-photocatalysis (112.2 J/cm3), and the anodized plate (114.5 J/cm3). Although electro-photocatalysis showed the fastest degradation rate (K = 5.04 mg L−1 h−1), its energy consumption was at the same level as the anodized plate with a lower degradation rate constant of 3.07 mg L−1 h−1. The results demonstrated that three-dimensional nanotubes of TiO2 surrounding the mesh provide superior degradation compared to one-dimensional arrays on the planar surface of the anodized plate. With limited broad-scale comparative studies between varieties of different TiO2 supports, this study provides a comparative analysis of relative degradation efficiencies between the four photocatalytic configurations.

Nanorod Array Structure Through a Nanomolding Process for Semiconductor Lighting and Display Applications

NANO ◽  
2019 ◽  
Vol 14 (12) ◽  
pp. 1950153 ◽  
Author(s):  
Je Won Kim
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Nanorod Array ◽  
Dimensional Structure ◽  
Single Chip ◽  
Semiconductor Processing ◽  
Light Emitting ◽  
Multiple Wavelengths ◽  
Array Structure ◽  
Wavelength Control

Three-dimensional structure and growth can be more appropriately realized through a nanomanufacturing process that uses a mask patterning and etching process. Unlike conventional single-wavelength semiconductor lighting sources, the uniformity and reproducibility of the nanomolding process in this study enable multiple wavelengths to be used in lighting and display applications. This study shows the various wavelength characteristics through a newly developed nanomold and its nanorod array and also proves the feasibility of a white light without phosphors for emitting multiple wavelengths from a single chip. In this study, we proposed the possibility of wavelength control by fabricating a light-emitting diode with a three-dimensional nanostructure, using a nanomold with semiconductor processing.

Color three-dimensional display with omnidirectional view based on a light-emitting diode projector

2009 ◽  
Vol 48 (22) ◽  
pp. 4490 ◽  
Author(s):  
Caijie Yan ◽  
Xu Liu ◽  
Haifeng Li ◽  
Xinxing Xia ◽  
Haixia Lu ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Light Emitting ◽  
Three Dimensional Display

Reflector designed for light-emitting-diode lighting source in three-dimensional space

Optik ◽  
2015 ◽  
Vol 126 (23) ◽  
pp. 4534-4538 ◽  
Author(s):  
Guangzhen Wang ◽  
Yu Hou ◽  
Lichun Hu ◽  
Wanwei Tang ◽  
Jian Gao ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Dimensional Space ◽  
Three Dimensional ◽  
Light Emitting ◽  
Three Dimensional Space

Low-Power Flexible Organic Light-Emitting Diode Display Device

2011 ◽  
Vol 23 (31) ◽  
pp. 3511-3516 ◽  
Author(s):  
Sunkook Kim ◽  
Hyuk-Jun Kwon ◽  
Sunghun Lee ◽  
Hongshik Shim ◽  
Youngtea Chun ◽  
...  
Keyword(s):  
Low Power ◽  
Light Emitting Diode ◽  
Display Device ◽  
Light Emitting ◽  
Organic Light Emitting Diode ◽  
Organic Light

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

High-efficiency vertical-structure GaN-based light-emitting diodes on Si substrates

2018 ◽  
Vol 6 (7) ◽  
pp. 1642-1650 ◽  
Author(s):  
Wenliang Wang ◽  
Yunhao Lin ◽  
Yuan Li ◽  
Xiaochan Li ◽  
Liegen Huang ◽  
...  
Keyword(s):  
High Efficiency ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Chemical Vapor ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Light Emitting ◽  
Si Substrates ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

High-quality GaN-based light-emitting diode (LED) wafers have been grown on Si substrates by metal–organic chemical vapor deposition by designing epitaxial structures with AlN/Al0.24Ga0.76N buffer layers and a three-dimensional (3D) GaN layer.

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