scholarly journals Effect of rapid thermal shock cycle on the thermomechanical reliability of 20Sn-80Pb solder bumps

2021 ◽  
Vol 2108 (1) ◽  
pp. 012100
Author(s):  
Shiqi Chen ◽  
Guisheng Gan ◽  
Qianzhu Xu ◽  
Zhaoqi Jiang ◽  
Tian Huang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Thermal Shock ◽  
Solder Bump ◽  
Lead Free ◽  
Fall Rate ◽  
Reflow Soldering ◽  
Solder Bumps ◽  
Mixed Fracture ◽  
Thermomechanical Reliability

Abstract The influence of rapid thermal shock(RTS) cycles on 20Sn-80Pb solder bumps was studied. In the study, 20Sn-80Pb solder bumps were prepared by desktop nitrogen lead-free reflow soldering machine. The prepared 20Sn-80Pb solder bumps were used for RTS test in the temperature rang of 0°C ~ 150°C. One cycle of RTS is 24 seconds, and the temperature rise and fall rate of RTS is 12.5 C/s. The result indicated that when the cycle of RTS reached 1500T (here T is cycle, the same below), the shear strength of Sn-80Pb solder bump dropped by drastically 48.6%. Whereas, when the cycle of RTS reached 5500T, 20Sn-80Pb solder bumps’ shear strength decreased to 18.35 MPa, which increased by 7.5% compared with that of l6.97 MPa at 4500T. With the increase of RTS cycles, 20Sn-80Pb solder bumps’ shear strength was a decreasing trend and the fracture mechanism changed from ductile fracture to ductile-brittle mixed fracture, which could be subject to the thickening of the interfaical IMCs and the stress concentration caused by the growth of interfacial IMCs. To understand the changes of the mechanical properties of 20Sn-80Pb solder bumps, the influences of RTS on the crack and interfacial IMC of 20Sn-80Pb solder bumps were studied in details.

KAISER ALUMINUM ALLOY KA62

Alloy Digest ◽  
1999 ◽  
Vol 48 (10) ◽  
Keyword(s):  
Mechanical Properties ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
Aluminum Alloy ◽  
Physical Properties ◽  
Surface Treatment ◽  
Physical And Mechanical Properties ◽  
Heat Treating ◽  
Lead Free ◽  
Kaiser Aluminum

Abstract Kaiser Aluminum alloy KA62 (Tennalum alloy KA62) is a lead-free alternative to 6262. It offers good machinability and corrosion resistance and displays good acceptance of coatings (anodize response). It can be used in place of 6262 because its physical and mechanical properties are equivalent to those of 6262 (see Alloy Digest Al-361, September 1999). This datasheet provides information on composition, physical properties, hardness, tensile properties, and shear strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and surface treatment. Filing Code: AL-362. Producer or source: Tennalum, A Division of Kaiser Aluminum.

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter

2012 ◽  
Vol 2012 (1) ◽  
pp. 000891-000905 ◽  
Author(s):  
Rainer Dohle ◽  
Stefan Härter ◽  
Andreas Wirth ◽  
Jörg Goßler ◽  
Marek Gorywoda ◽  
...  
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Solder Bump ◽  
Void Formation ◽  
Lead Free ◽  
Large Temperature ◽  
Flip Chips ◽  
Solder Bumps ◽  
Current Densities

As the solder bump sizes continuously decrease with scaling of the geometries, current densities within individual solder bumps will increase along with higher operation temperatures of the dies. Since electromigration of flip-chip interconnects is highly affected by these factors and therefore an increasing reliability concern, long-term characterization of new interconnect developments needs to be done regarding the electromigration performance using accelerated life tests. Furthermore, a large temperature gradient exists across the solder interconnects, leading to thermomigration. In this study, a comprehensive overlook of the long-term reliability and analysis of the achieved electromigration performance of flip-chip test specimen will be given, supplemented by an in-depth material science analysis. In addition, the challenges to a better understanding of electromigration and thermomigration in ultra fine-pitch flip-chip solder joints are discussed. For all experiments, specially designed flip-chips with a pitch of 100 μm and solder bump diameters of 30–60 μm have been used [1]. Solder spheres can be made of every lead-free alloy (in our case SAC305) and are placed on a UBM which has been realized for our test chips in an electroless nickel process [2]. For the electromigration tests within this study, multiple combinations of individual current densities and temperatures were adapted to the respective solder sphere diameters. Online measurements over a time period up to 10,000 hours with separate daisy chain connections of each test coupon provide exact lifetime data during the electromigration tests. As failure modes have been identified: UBM consumption at the chip side or depletion of the Nickel layer at the substrate side, interfacial void formation at the cathode contact interface, and - to a much lesser degree - Kirkendall-like void formation at the anode side. A comparison between calculated life time data using Weibull distribution and lognormal distribution will be given.

Property of Sn-37Pb solder bumps with different diameter during thermal shock

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guisheng Gan ◽  
Donghua Yang ◽  
Yi-ping Wu ◽  
Xin Liu ◽  
Pengfei Sun ◽  
...  
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Thermal Shock ◽  
Solder Joints ◽  
Test Method ◽  
Content Type ◽  
Ball Size ◽  
Solder Bumps ◽  
Free Solder ◽  
The Impact

Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored. Design/methodology/approach In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively. Originality/value Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

2015 ◽  
Vol 754-755 ◽  
pp. 535-539
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
M.N. Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sintering Process ◽  
Homogeneous Microstructure ◽  
Free Solder

This research has investigated the microstructural analysis and shear strength of Sn-1.0Ag-0.7Cu (SAC107) alloy used as matrix while silicon nitride (Si3N4) as reinforcement particles with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %). The composite solders were fabricated using powder metallurgy (PM) method consisting of mixing, compaction and sintering process. With additions of Si3N4 particles, the composite solders experienced a corresponding increase in strength due to fine and homogeneous microstructure. This is signified that the presence of Si3N4 particles effectively refines the microstructure.

Mechanical Properties and Fracture Behavior of the Cu and Cu6Sn5–Dispersed Sn-Pb Solder Bumps Processed by Screen Printing

2001 ◽  
Vol 682 ◽  
Author(s):  
Ho-Seob Cha ◽  
Kwang-Eung Lee ◽  
Jin-Won Choi ◽  
Tae-Sung Oh
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Crack Propagation ◽  
Screen Printing ◽  
Failure Surface ◽  
Critical Crack ◽  
Propagation Length ◽  
Lower Shear ◽  
Solder Bumps ◽  
Ball Shear Test

ABSTRACTThe mechanical properties of the 1-9 vol % Cu and Cu6Sn5-dispersed 63Sn-37Pb solder alloys were characterized with tensile test. Also, the Cu and Cu6Sn5-dispersed 63Sn-37Pb solder bumps of 760 μm size were fabricated on the Au(5 μm)/Ni(5 μm)/Cu(27 μm) BGA substrates by screen printing process, and their shear strength were characterized with variations of the dwell time at the reflow peak temperature(220°C) and aging time at 150°C. The yield strength and ultimate tensile strength of the 63Sn-37Pb solder alloy increased with dispersion of 1-9 vol % Cu and Cu6Sn5. In general, however, the Cu and Cu6Sn5-dispersed solder bumps exhibited lower shear strengths than those of the 63Sn-37Pb solder bumps The failure surface of the solder bumps after ball shear test could be divided into two regions of slow crack propagation and critical crack propagation, and the shear strength of solder bumps was inversely proportional to the slow crack propagation length.

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