Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles

2021 ◽  
Vol 6 (3) ◽  
pp. 034006
Author(s):  
Min-Jung Son ◽  
Hyunchang Kim ◽  
Seongryul Maeng ◽  
Taik-Min Lee ◽  
Hoo-Jeong Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Ag Nanoparticles ◽  
Solder Bumps

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

scholarly journals Structure and Properties of Polyoxymethylene/Silver/Maleic Anhydride-Grafted Polyolefin Elastomer Ternary Nanocomposites

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1954
Author(s):  
Yang Liu ◽  
Xun Zhang ◽  
Quanxin Gao ◽  
Hongliang Huang ◽  
Yongli Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Maleic Anhydride ◽  
Ag Nanoparticles ◽  
Decomposition Temperature ◽  
Melt Mixing ◽  
Elongation At Break ◽  
Maximum Value ◽  
Polyolefin Elastomer ◽  
Local Defects

In the present study, silver (Ag) nanoparticles and maleic anhydride-grafted polyolefin elastomer (MAH-g-POE) were used as enhancement additives to improve the performance of the polyoxymethylene (POM) homopolymer. Specifically, the POM/Ag/MAH-g-POE ternary nanocomposites with varying Ag nanoparticles and MAH-g-POE contents were prepared by a melt mixing method. The effects of the additives on the microstructure, thermal stability, crystallization behavior, mechanical properties, and dynamic mechanical thermal properties of the ternary nanocomposites were studied. It was found that the MAH-g-POE played a role in the bridging of the Ag nanoparticles and POM matrix and improved the interfacial adhesion between the Ag nanoparticles and POM matrix, owing to the good compatibility between Ag/MAH-g-POE and the POM matrix. Moreover, it was found that the combined addition of Ag nanoparticles and MAH-g-POE significantly enhanced the thermal stability, crystallization properties, and mechanical properties of the POM/Ag/MAH-g-POE ternary nanocomposites. When the Ag/MAH-g-POE content was 1 wt.%, the tensile strength reached the maximum value of 54.78 MPa. In addition, when the Ag/MAH-g-POE content increased to 15wt.%, the elongation at break reached the maximum value of 64.02%. However, when the Ag/MAH-g-POE content further increased to 20 wt.%, the elongation at break decreased again, which could be attributed to the aggregation of excessive Ag nanoparticles forming local defects in the POM/Ag/MAH-g-POE ternary nanocomposites. Furthermore, when the Ag/MAH-g-POE content was 20 wt.%, the maximum decomposition temperature of POM/Ag/MAH-g-POE ternary nanocomposites was 398.22 °C, which was 71.39 °C higher than that of pure POM. However, compared with POM, the storage modulus of POM/Ag/MAH-g-POE ternary nanocomposites decreased with the Ag/MAH-g-POE content, because the MAH-g-POE elastomer could reduce the rigidity of POM.

Green synthesis of Ag nanoparticles from pomegranate seeds extract and synthesis of Ag-Starch nanocomposite and characterization of mechanical properties of the films

2020 ◽  
Vol 25 ◽  
pp. 101569 ◽  
Author(s):  
Maedeh Sadat Mohseni ◽  
Mohammad A. Khalilzadeh ◽  
Moein Mohseni ◽  
Fariba Zamani Hargalani ◽  
Muhammad Ibrahim Getso ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Green Synthesis ◽  
Ag Nanoparticles ◽  
Pomegranate Seeds

Mechanical properties of polycondensate epoxy nanocomposites filled with Ag nanoparticles synthesized in situ

2020 ◽  
Author(s):  
Liudmila Bogdanova ◽  
Valentina Lesnichaya ◽  
Maxim Spirin ◽  
Vitaly Shershnev ◽  
Vadim Irzhak ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Ag Nanoparticles ◽  
Epoxy Nanocomposites

scholarly journals Structural and Mechanical Properties of Silica Mesoporous Films Synthesized Using Deep X-Rays: Implications in the Construction of Devices

2021 ◽  
Vol 8 ◽  
Author(s):  
Paula Y. Steinberg ◽  
Diego F. Lionello ◽  
Daiana E. Medone Acosta ◽  
M. Mercedes Zalduendo ◽  
Heinz Amenitsch ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Thermal Treatment ◽  
Ag Nanoparticles ◽  
Structural Integrity ◽  
Sol Gel ◽  
Indentation Modulus ◽  
X Rays ◽  
Porous Films ◽  
Ordered Mesoporous

In recent years, the use of X-Rays (XR) irradiation for the production of ordered mesoporous thin films has been well established. This technique allows obtaining porous materials that contain thermal sensitive moieties or nanoparticles. Additionally, in combination with lithographic masks, the generation of high aspect ratio patterns of several geometrical shapes with micrometric resolution is possible. In this work, the structural and mechanical properties of porous silica thin films obtained by sol-gel method along with the exposure to high intensity XR is presented. Two templates (CTAB and Brij 58) and several irradiation doses and post-synthesis treatments were evaluated by a combination of characterization techniques, including grazing incidence small-angle XR scattering, electronic microscopies, XR reflectometry and nanoindentation. The results demonstrate that all the irradiated oxides presented a highly ordered mesoporous structure, independently of the XR dose and post thermal treatment. Their mechanical properties, on the other hand, clearly depend on the irradiation dose; high hardness values were measured on samples irradiated at low doses but higher doses are necessary to obtain films with indentation modulus values similar to the obtained for thermally treated coatings. The accessible porosity, essential for the application of these films in devices for micro- and nanofluidics, is also dependent on the dose and the thermal treatment performed afterward. The same tendency is observed for the films contraction and rigidity. After this characterization, it was concluded that thermal treatments are needed after the consolidation with XR to increase the accessibility and structural integrity of these porous oxides. Finally, the production of composites with metallic (Au and Ag) nanoparticles was tested which envisioned their applications in sensing and catalysis. Moreover, diverse geometrical patterns of both pure and Ag nanoparticles doped silica mesostructured films were obtained, demonstrating the feasibility of the proposed approach. The results presented in this work are of great importance to understand the transport mechanisms that operate in these silica porous films, in order to integrate them in different devices for lab-on-a-chip applications.

Mechanical Properties and Fracture Behavior of the Cu and Cu6Sn5–Dispersed Sn-Pb Solder Bumps Processed by Screen Printing

2001 ◽  
Vol 682 ◽  
Author(s):  
Ho-Seob Cha ◽  
Kwang-Eung Lee ◽  
Jin-Won Choi ◽  
Tae-Sung Oh
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Crack Propagation ◽  
Screen Printing ◽  
Failure Surface ◽  
Critical Crack ◽  
Propagation Length ◽  
Lower Shear ◽  
Solder Bumps ◽  
Ball Shear Test

ABSTRACTThe mechanical properties of the 1-9 vol % Cu and Cu6Sn5-dispersed 63Sn-37Pb solder alloys were characterized with tensile test. Also, the Cu and Cu6Sn5-dispersed 63Sn-37Pb solder bumps of 760 μm size were fabricated on the Au(5 μm)/Ni(5 μm)/Cu(27 μm) BGA substrates by screen printing process, and their shear strength were characterized with variations of the dwell time at the reflow peak temperature(220°C) and aging time at 150°C. The yield strength and ultimate tensile strength of the 63Sn-37Pb solder alloy increased with dispersion of 1-9 vol % Cu and Cu6Sn5. In general, however, the Cu and Cu6Sn5-dispersed solder bumps exhibited lower shear strengths than those of the 63Sn-37Pb solder bumps The failure surface of the solder bumps after ball shear test could be divided into two regions of slow crack propagation and critical crack propagation, and the shear strength of solder bumps was inversely proportional to the slow crack propagation length.

Improvement of Electrical and Mechanical Properties of Inkjet-Printed Ag Tracks by Adding SiO2 to High Loading Ag Inks

2012 ◽  
Vol 590 ◽  
pp. 216-221
Author(s):  
A. Kosmala ◽  
Q. Zhang ◽  
R. Wright ◽  
P. Kirby
Keyword(s):  
Mechanical Properties ◽  
Physical Properties ◽  
Aqueous Medium ◽  
Inkjet Printing ◽  
Ag Nanoparticles ◽  
Sio2 Nanoparticles ◽  
Pluronic F127 ◽  
High Loading ◽  
Silver Films ◽  
Sintered Silver

Monodispersed Ag nanoparticles with sizes down to 10 nm were synthesised in an aqueous medium. These nanoparticles were then successfully dispersesd up to 45 wt% in aqueous medium with the aid of a copolymer, Pluronic F127. SiO2 nanoparticles were added to the ink formula in order to improve the physical properties of the ink after inkjet printing. The effect of the different SiO2 concentrations in the ink on the adhesion, resistivity and microstructure of the film at several sintered temperatures was investigated. The percentage of the SiO2 added in the ink was responsible for the development of microstructure for the sintered silver films and improving adhesion of the films to the substrate. The addition of SiO2 had also significant effect on improving the conductivity of the films. The conductivity is, though, better when only a small amount of SiO2 was added.

scholarly journals Effect of rapid thermal shock cycle on the thermomechanical reliability of 20Sn-80Pb solder bumps

2021 ◽  
Vol 2108 (1) ◽  
pp. 012100
Author(s):  
Shiqi Chen ◽  
Guisheng Gan ◽  
Qianzhu Xu ◽  
Zhaoqi Jiang ◽  
Tian Huang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Thermal Shock ◽  
Solder Bump ◽  
Lead Free ◽  
Fall Rate ◽  
Reflow Soldering ◽  
Solder Bumps ◽  
Mixed Fracture ◽  
Thermomechanical Reliability

Abstract The influence of rapid thermal shock(RTS) cycles on 20Sn-80Pb solder bumps was studied. In the study, 20Sn-80Pb solder bumps were prepared by desktop nitrogen lead-free reflow soldering machine. The prepared 20Sn-80Pb solder bumps were used for RTS test in the temperature rang of 0°C ~ 150°C. One cycle of RTS is 24 seconds, and the temperature rise and fall rate of RTS is 12.5 C/s. The result indicated that when the cycle of RTS reached 1500T (here T is cycle, the same below), the shear strength of Sn-80Pb solder bump dropped by drastically 48.6%. Whereas, when the cycle of RTS reached 5500T, 20Sn-80Pb solder bumps’ shear strength decreased to 18.35 MPa, which increased by 7.5% compared with that of l6.97 MPa at 4500T. With the increase of RTS cycles, 20Sn-80Pb solder bumps’ shear strength was a decreasing trend and the fracture mechanism changed from ductile fracture to ductile-brittle mixed fracture, which could be subject to the thickening of the interfaical IMCs and the stress concentration caused by the growth of interfacial IMCs. To understand the changes of the mechanical properties of 20Sn-80Pb solder bumps, the influences of RTS on the crack and interfacial IMC of 20Sn-80Pb solder bumps were studied in details.

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