scholarly journals Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

2014 ◽  
Vol 11 (99) ◽  
pp. 20140573 ◽  
Author(s):  
H. Droogendijk ◽  
R. A. Brookhuis ◽  
M. J. de Boer ◽  
R. G. P. Sanders ◽  
G. J. M. Krijnen
Keyword(s):  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Fast Response ◽  
Gyroscopic System ◽  
Drive Mode ◽  
Mems Gyroscope ◽  
Coriolis Forces ◽  
Mems Technology ◽  
Large Measurement ◽  
Theoretical Performance

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed.

scholarly journals Sensitivity Analysis of Single-Drive, 3-axis MEMS Gyroscope Using COMSOL Multiphysics

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1030
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Microelectromechanical Systems ◽  
Angular Rate ◽  
Mode Analysis ◽  
Comsol Multiphysics ◽  
Mechanical Sensitivity ◽  
Drive Mode ◽  
Element Analysis ◽  
Mems Gyroscope ◽  
Fea Model ◽  
Mode Split

In this paper, a COMSOL Multiphysics-based methodology is presented for evaluation of the microelectromechanical systems (MEMS) gyroscope. The established finite element analysis (FEA) model was successfully validated through a comparison with analytical and Matlab/Simulink analysis results. A simplified single-drive, 3-axis MEMS gyroscope was analyzed using a mode split approach, having a drive resonant frequency of 24,918 Hz, with the x-sense, y-sense, and z-sense being 25,625, 25,886, and 25,806 Hz, respectively. Drive-mode analysis was carried out and a maximum drive-displacement of 4.0 μm was computed for a 0.378 μN harmonic drive force. Mechanical sensitivity was computed at 2000 degrees per second (dps) input angular rate while the scale factor for roll, pitch, and yaw was computed to be 0.014, 0.011, and 0.013 nm/dps, respectively.

scholarly journals Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 862 ◽  
Author(s):  
Syed Ali Raza Bukhari ◽  
Muhammad Mubasher Saleem ◽  
Umar Shahbaz Khan ◽  
Amir Hamza ◽  
Javaid Iqbal ◽  
...  
Keyword(s):  
Dynamic Response ◽  
Microelectromechanical Systems ◽  
System Modeling ◽  
Silicon On Insulator ◽  
System Level ◽  
Voltage Sensitivity ◽  
Thermally Stable ◽  
Sense Mode ◽  
Drive Mode ◽  
Mems Gyroscope

This paper presents microfabrication process-driven design of a multi-degree of freedom (multi-DoF) non-resonant electrostatic microelectromechanical systems (MEMS) gyroscope by considering the design constraints of commercially available low-cost and widely-used silicon-on-insulator multi-user MEMS processes (SOIMUMPs), with silicon as a structural material. The proposed design consists of a 3-DoF drive mode oscillator with the concept of addition of a collider mass which transmits energy from the drive mass to the passive sense mass. In the sense direction, 2-DoF sense mode oscillator is used to achieve dynamically-amplified displacement in the sense mass. A detailed analytical model for the dynamic response of MEMS gyroscope is presented and performance characteristics are validated through finite element method (FEM)-based simulations. The effect of operating air pressure and temperature variations on the air damping and resulting dynamic response is analyzed. The thermal stability of the design and corresponding effect on the mechanical and capacitive sensitivity, for an operating temperature range of −40 °C to 100 °C, is presented. The results showed that the proposed design is thermally stable, robust to environmental variations, and process tolerances with a wide operational bandwidth and high sensitivity. Moreover, a system-level model of the proposed gyroscope and its integration with the sensor electronics is presented to estimate the voltage sensitivity under the constraints of the readout electronic circuit.

Stability of Ring-Type MEMS Gyroscopes Subjected to Stochastic Angular Speed Fluctuation

2017 ◽  
Vol 139 (4) ◽  
Author(s):  
Samuel F. Asokanthan ◽  
Soroush Arghavan ◽  
Mohamed Bognash
Keyword(s):  
Angular Velocity ◽  
Degrees Of Freedom ◽  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Operating Conditions ◽  
System Stability ◽  
System Response ◽  
Ring Type ◽  
Mems Gyroscopes ◽  
The Stability

Effect of stochastic fluctuations in angular velocity on the stability of two degrees-of-freedom ring-type microelectromechanical systems (MEMS) gyroscopes is investigated. The governing stochastic differential equations (SDEs) are discretized using the higher-order Milstein scheme in order to numerically predict the system response assuming the fluctuations to be white noise. Simulations via Euler scheme as well as a measure of largest Lyapunov exponents (LLEs) are employed for validation purposes due to lack of similar analytical or experimental data. The response of the gyroscope under different noise fluctuation magnitudes has been computed to ascertain the stability behavior of the system. External noise that affect the gyroscope dynamic behavior typically results from environment factors and the nature of the system operation can be exerted on the system at any frequency range depending on the source. Hence, a parametric study is performed to assess the noise intensity stability threshold for a number of damping ratio values. The stability investigation predicts the form of threshold fluctuation intensity dependence on damping ratio. Under typical gyroscope operating conditions, nominal input angular velocity magnitude and mass mismatch appear to have minimal influence on system stability.

scholarly journals Design Approach for Reducing Cross-Axis Sensitivity in a Single-Drive Multi-Axis MEMS Gyroscope

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 902
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Microelectromechanical Systems ◽  
Reduction Rate ◽  
Design Technique ◽  
Matching Method ◽  
Mems Gyroscope ◽  
Mode Split ◽  
The Cross ◽  
The Individual ◽  
Cross Axis ◽  
Ratio Matching

In this paper, a new design technique is presented to estimate and reduce the cross-axis sensitivity (CAS) in a single-drive multi-axis microelectromechanical systems (MEMS) gyroscope. A simplified single-drive multi-axis MEMS gyroscope, based on a mode-split approach, was analyzed for cross-axis sensitivity using COMSOL Multiphysics. A design technique named the “ratio-matching method” of drive displacement amplitudes and sense frequency differences ratios was proposed to reduce the cross-axis sensitivity. Initially, the cross-axis sensitivities in the designed gyroscope for x and y-axis were calculated to be 0.482% and 0.120%, respectively, having an average CAS of 0.301%. Using the proposed ratio-matching method and design technique, the individual cross-axis sensitivities in the designed gyroscope for x and y-axis were reduced to 0.018% and 0.073%, respectively. While the average CAS was reduced to 0.045%, showing a reduction rate of 85.1%. Moreover, the proposed ratio-matching method for cross-axis sensitivity reduction was successfully validated through simulations by varying the coupling spring position and sense frequency difference variation analyses. Furthermore, the proposed methodology was verified experimentally using fabricated single-drive multi-axis gyroscope.

Novel die-sinking micro-electro discharge machining process using microelectromechanical systems technology

2006 ◽  
Vol 220 (9) ◽  
pp. 1481-1487 ◽  
Author(s):  
J-B Li ◽  
K Jiang ◽  
G J Davies
Keyword(s):  
Microelectromechanical Systems ◽  
Machining Process ◽  
Metallic Surface ◽  
Manufacturing Cost ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Electro Discharge Machining ◽  
Mems Technology ◽  
Fabrication Condition ◽  
Edm Process

A novel die-sinking micro-electro discharge machining (EDM) process is presented for volume fabrication of metallic microcomponents. In the process, a high-precision silicon electrode is fabricated using deep reactive ion etching (DRIE) process of microelectromechanical systems (MEMS) technology and then coated with a thin layer of copper to increase the conductivity. The metalized Si electrode is used in the EDM process to manufacture metallic microcomponents by imprinting the electrode onto a flat metallic surface. The two main advantages of this process are that it enables the fabrication of metallic microdevices and reduces manufacturing cost and time. The development of the new EDM process is described. A silicon component was produced using the Surface Technology Systems plasma etcher and the DRIE process. Such components can be manufactured with a precision in nanometres. The minimum feature of the component is 50 μm. In the experiments, the Si component was coated with copper and then used as the electrode on an EDM machine of 1 μm resolution. In the manufacturing process, 130 V and 0.2 A currents were used for a period of 5 min. The SEM images of the resulting device show clear etched areas, and the electric discharge wave chart indicates a good fabrication condition. The experimental results have been analysed and the new micro-EDM process is found to be able to fabricate 25 μm features.

New Hybrid Methodology for the Development of MEMS Multivariable Sensors

2001 ◽  
Author(s):  
Emily J. Pryputniewicz ◽  
John P. Angelosanto ◽  
Gordon C. Brown ◽  
Cosme Furlong ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Process Control ◽  
Microelectromechanical Systems ◽  
Absolute Pressure ◽  
Single Chip ◽  
Specific Test ◽  
Mems Sensor ◽  
Test Conditions ◽  
Mems Technology ◽  
Functional Operation ◽  
Hybrid Methodology

Abstract Using recent advances in microelectromechanical systems (MEMS) technology, a new multivariable sensor was developed. This MEMS sensor, capable of measuring temperature, absolute pressure, and differential pressure on a single chip, is particularly suitable for applications in process control industry. However, functional operation of the sensor depends on validation of its performance under specific test conditions. We have developed a hybrid methodology, based on analysis and measurements, that allows such validation. In this paper, the MEMS multivariable sensor is described, the hybrid methodology is outlined, and its use is illustrated with representative results.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

MEMS Design Education by Case Studies

2001 ◽  
Author(s):  
Ryszard J. Pryputniewicz
Keyword(s):  
Computer Science ◽  
Case Studies ◽  
Design Education ◽  
Laboratory Experiments ◽  
Microelectromechanical Systems ◽  
Academic Development ◽  
Academic Education ◽  
Graduate Courses ◽  
Mems Technology ◽  
Student Projects

Abstract Advances in microelectromechanical systems (MEMS) technology are based on understanding of the issues involved in design, analysis, fabrication, characterization, and use of the finished products. Although this understanding is being developed “on the job” to satisfy immediate needs of rapid advances in the emerging MEMS technology, there is also growing demand for “academic” education in MEMS. Whether on-the-job or academic, development of the required understanding is no easy task because the MEMS field is very multidisciplinary. Those involved should be able to work simultaneously with topics relating to physics, chemistry, materials, computer science, engineering, as well as other relevant disciplines. To facilitate preparation of future engineers for work with MEMS, we have developed undergraduate and graduate courses addressing some of the crucial issues relating to MEMS. These courses are based on case studies that we have developed in our laboratories. The courses include lectures, laboratory experiments, student projects, and presentations. This paper describes selected case studies used in our courses as they relate to design education with MEMS.

Microsystems Challenges for Engineering Education

2001 ◽  
Author(s):  
James J. Allen
Keyword(s):  
Engineering Education ◽  
Microelectromechanical Systems ◽  
New Products ◽  
The World ◽  
Mems Technology

Abstract Microelectromechanical systems (MEMS) have recently caught the national attention and are on the verge of producing many new products and applications in the world. This is a very multidisciplinary field that presents many unique challenges for engineering education. This paper will discuss the background of MEMS technology and the unique challenges MEMS pose to engineering education. The paper will also mention various approaches that are being taken to address MEMS education.

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