Preferential hole defect formation in monolayer WSe2 by electron-beam irradiation

2021 ◽  
Vol 5 (4) ◽  
Author(s):  
Donghan Shin ◽  
Gang Wang ◽  
Mengjiao Han ◽  
Zeyu Lin ◽  
Andrew O'Hara ◽  
...  
2011 ◽  
Vol 1344 ◽  
Author(s):  
Desalegne Teweldebrhan ◽  
Guanxiong Liu ◽  
Alexander A. Balandin

ABSTRACTGraphene reveals many extraordinary properties including extremely high room temperature carrier mobility and intrinsic thermal conductivity. Understanding how to controllably modify graphene’s properties is essential for its proposed applications. Here we report on a method for tuning the electrical properties of graphene via electron beam irradiation. It was observed that single-layer graphene is highly susceptible to the low-energy electron beams. We demonstrated that by controlling the irradiation dose one can change, by desired amount, the carrier mobility, shift the charge neutrality point, increase the resistance at the minimum conduction point, induce the “transport gap” and achieve current saturation in graphene. The change in graphene properties is due to defect formation on the graphene surface and in the graphene lattice. The changes are reversible by annealing until some critical irradiation dose is reached.


1993 ◽  
Vol 316 ◽  
Author(s):  
D. L. Doering ◽  
K. H. Siek ◽  
P. Xiong-Skiba ◽  
D. L. Carroll

ABSTRACTElectron beam irradiation at energies between 0.5 and 4 keV has been found to produce defects in oxide materials including SiO2, Al2O3 and ZrO2. These defects trap excess charge in the materials and affect their electronic and optical properties. Measurements of the thermally stimulated exoelectron emission following irradiation provides information on relative defect concentrations, defect creation mechanisms, electron trap binding energies, electron emission mechanisms and annealing properties of these materials. Electron emission during sample heating occurs via a variety of mechanisms including the thermionic emission of excess charge from defects at temperatures characteristic of each trap binding energy. By measuring relative trap concentrations as a function of beam parameters, we have identified electron beam energy thresholds for the creation of some types of defects which correlate with core level electronic transitions. Also, electron emission which occurs during defect annealing or diffusion to a surface shows the conditions for the elimination of defects. The ability to control and characterize defect formation and annihilation provides the possibility of engineering specific surface defect conditions. In addition, defect creation by electronic processes is very selective as compared with momentum transfer in ion beam damage of surfaces.


Author(s):  
B. L. Armbruster ◽  
B. Kraus ◽  
M. Pan

One goal in electron microscopy of biological specimens is to improve the quality of data to equal the resolution capabilities of modem transmission electron microscopes. Radiation damage and beam- induced movement caused by charging of the sample, low image contrast at high resolution, and sensitivity to external vibration and drift in side entry specimen holders limit the effective resolution one can achieve. Several methods have been developed to address these limitations: cryomethods are widely employed to preserve and stabilize specimens against some of the adverse effects of the vacuum and electron beam irradiation, spot-scan imaging reduces charging and associated beam-induced movement, and energy-filtered imaging removes the “fog” caused by inelastic scattering of electrons which is particularly pronounced in thick specimens.Although most cryoholders can easily achieve a 3.4Å resolution specification, information perpendicular to the goniometer axis may be degraded due to vibration. Absolute drift after mechanical and thermal equilibration as well as drift after movement of a holder may cause loss of resolution in any direction.


Author(s):  
Wei-Chih Wang ◽  
Jian-Shing Luo

Abstract In this paper, we revealed p+/n-well and n+/p-well junction characteristic changes caused by electron beam (EB) irradiation. Most importantly, we found a device contact side junction characteristic is relatively sensitive to EB irradiation than its whole device characteristic; an order of magnitude excess current appears at low forward bias region after 1kV EB acceleration voltage irradiation (Vacc). Furthermore, these changes were well interpreted by our Monte Carlo simulation results, the Shockley-Read Hall (SRH) model and the Generation-Recombination (G-R) center trap theory. In addition, four essential examining items were suggested and proposed for EB irradiation damage origins investigation and evaluation. Finally, by taking advantage of the excess current phenomenon, a scanning electron microscope (SEM) passive voltage contrast (PVC) fault localization application at n-FET region was also demonstrated.


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