High-voltage amorphous silicon thin-film transistors

1993 ◽  
Vol 40 (3) ◽  
pp. 634-644 ◽  
Author(s):  
R.A. Martin ◽  
V.M. Da Costa ◽  
M. Hack ◽  
J.G. Shaw
1991 ◽  
Vol 69 (4) ◽  
pp. 2667-2672 ◽  
Author(s):  
John G. Shaw ◽  
Michael G. Hack ◽  
Russel A. Martin

1990 ◽  
Vol 192 ◽  
Author(s):  
M. Hack ◽  
W. B. Jackson ◽  
R. Lujan

ABSTRACTWe have developed a means to speed up the recovery of both the threshold voltage shift of hydrogenated amorphous silicon (a-Si:H) transistors and the Vx shift of high voltage a-Si devices. This is accomplished by placing a lightly doped compensated layer adjacent to the active layer in these transistors. This proximity recovery layer does not alter the initial characteristics of a-Si:H transistors and is completely process compatible with standard fabrication procedures.


2000 ◽  
Vol 621 ◽  
Author(s):  
N. Tosic ◽  
F. G. Kuper ◽  
T. Mouthaan

ABSTRACTIn this paper, an analysis of the high voltage induced degradation in top gate amorphous silicon Thin Film Transistors (TFT) will be shown, including the aspect of self-heating. It will be shown through experimental results that the degradation level under high voltages on drain and gate is different for TFT's with different channel lengths. In addition, the temperature distribution over the TFT area for devices with different channel length is simulated. Simulation shows that the peak of temperature distribution is located at the drain/channel edge and that level of thermal heating depends on the channel length.


1997 ◽  
Vol 36 (Part 1, No. 10) ◽  
pp. 6226-6229 ◽  
Author(s):  
Huang-Chung Cheng ◽  
Jun-Wei Tsai ◽  
Chun-Yao Huang ◽  
Fang-Chen Luo ◽  
Hsing-Chien Tuan

1996 ◽  
Vol 424 ◽  
Author(s):  
R. E. I. Schropp ◽  
K. F. Feenstra ◽  
C. H. M. Van Der Werf ◽  
J. Holleman ◽  
H. Meiling

AbstractWe present the first thin film transistors (TFTs) incorporating a low hydrogen content (5 - 9 at.-%) amorphous silicon (a-Si:H) layer deposited by the Hot-Wire Chemical Vapor Deposition (HWCVD) technique. This demonstrates the possibility of utilizing this material in devices. The deposition rate by Hot-Wire CVD is an order of magnitude higher than by Plasma Enhanced CVD. The switching ratio for TFTs based on HWCVD a-Si:H is better than 5 orders of magnitude. The field-effect mobility as determined from the saturation regime of the transfer characteristics is still quite poor. The interface with the gate dielectric needs further optimization. Current crowding effects, however, could be completely eliminated by a H2 plasma treatment of the HW-deposited intrinsic layer. In contrast to the PECVD reference device, the HWCVD device appears to be almost unsensitive to bias voltage stressing. This shows that HW-deposited material might be an approach to much more stable devices.


2009 ◽  
Vol 105 (12) ◽  
pp. 124504 ◽  
Author(s):  
S. L. Rumyantsev ◽  
Sung Hun Jin ◽  
M. S. Shur ◽  
Mun-Soo Park

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