scholarly journals Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 117997-118004
Author(s):  
Byungjin Bae ◽  
Jingook Kim ◽  
Ki Jin Han
2012 ◽  
Vol E95.C (7) ◽  
pp. 1276-1284 ◽  
Author(s):  
Satoshi YOSHIDA ◽  
Shoichi TANIFUJI ◽  
Suguru KAMEDA ◽  
Noriharu SUEMATSU ◽  
Tadashi TAKAGI ◽  
...  

Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


Energies ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2402
Author(s):  
David S. Ching ◽  
Cosmin Safta ◽  
Thomas A. Reichardt

Bayesian inference is used to calibrate a bottom-up home PLC network model with unknown loads and wires at frequencies up to 30 MHz. A network topology with over 50 parameters is calibrated using global sensitivity analysis and transitional Markov Chain Monte Carlo (TMCMC). The sensitivity-informed Bayesian inference computes Sobol indices for each network parameter and applies TMCMC to calibrate the most sensitive parameters for a given network topology. A greedy random search with TMCMC is used to refine the discrete random variables of the network. This results in a model that can accurately compute the transfer function despite noisy training data and a high dimensional parameter space. The model is able to infer some parameters of the network used to produce the training data, and accurately computes the transfer function under extrapolative scenarios.


2020 ◽  
Vol 590 ◽  
pp. 125267
Author(s):  
Foad Vosoughi ◽  
Gholamreza Rakhshandehroo ◽  
Mohammad Reza Nikoo ◽  
Mojtaba Sadegh

Sign in / Sign up

Export Citation Format

Share Document