Emerging atomic layer deposition (ALD) processes for low thermal budget flexible electronics

2015 ◽  
Author(s):  
Dillon Gregory ◽  
George Marshall ◽  
Eric Eisenbraun
Keyword(s):  
Atomic Layer Deposition ◽  
Flexible Electronics ◽  
Atomic Layer ◽  
Thermal Budget ◽  
Layer Deposition ◽  
Low Thermal Budget

Low Thermal Budget Heteroepitaxial Gallium Oxide Thin Films Enabled by Atomic Layer Deposition

2020 ◽  
Vol 12 (39) ◽  
pp. 44225-44237
Author(s):  
Elham Rafie Borujeny ◽  
Oles Sendetskyi ◽  
Michael D. Fleischauer ◽  
Kenneth C. Cadien
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Gallium Oxide ◽  
Atomic Layer ◽  
Oxide Thin Films ◽  
Thermal Budget ◽  
Layer Deposition ◽  
Low Thermal Budget

scholarly journals Si surface passivation by Al2O3 thin films deposited using a low thermal budget atomic layer deposition process

2013 ◽  
Vol 102 (13) ◽  
pp. 131603 ◽  
Author(s):  
G. Seguini ◽  
E. Cianci ◽  
C. Wiemer ◽  
D. Saynova ◽  
J. A. M. van Roosmalen ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Surface Passivation ◽  
Atomic Layer ◽  
Deposition Process ◽  
Thermal Budget ◽  
Atomic Layer Deposition Process ◽  
Layer Deposition ◽  
Low Thermal Budget

Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications

2014 ◽  
Vol 32 (5) ◽  
pp. 051603 ◽  
Author(s):  
Philipp S. Maydannik ◽  
Tommi O. Kääriäinen ◽  
Kimmo Lahtinen ◽  
David C. Cameron ◽  
Mikko Söderlund ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Flexible Electronics ◽  
Atomic Layer ◽  
Deposition Process ◽  
Atomic Layer Deposition Process ◽  
Roll To Roll ◽  
Layer Deposition

Low temperature and roll-to-roll spatial atomic layer deposition for flexible electronics

2012 ◽  
Vol 30 (1) ◽  
pp. 01A142 ◽  
Author(s):  
Paul Poodt ◽  
Raymond Knaapen ◽  
Andrea Illiberi ◽  
Fred Roozeboom ◽  
Almie van Asten
Keyword(s):  
Low Temperature ◽  
Atomic Layer Deposition ◽  
Flexible Electronics ◽  
Atomic Layer ◽  
Roll To Roll ◽  
Layer Deposition

scholarly journals Is Poly(methyl methacrylate) (PMMA) a Suitable Substrate for ALD?: A Review

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1346
Author(s):  
Marta Adriana Forte ◽  
Ricardo Manuel Silva ◽  
Carlos José Tavares ◽  
Rui Ferreira e Silva
Keyword(s):  
Thin Film ◽  
Atomic Layer Deposition ◽  
Methyl Methacrylate ◽  
Flexible Electronics ◽  
Surface Engineering ◽  
Chemical Deposition ◽  
Atomic Layer ◽  
Level Control ◽  
Poly Methyl Methacrylate ◽  
Layer Deposition

Poly (methyl methacrylate) (PMMA) is a thermoplastic synthetic polymer, which displays superior characteristics such as transparency, good tensile strength, and processability. Its performance can be improved by surface engineering via the use of functionalized thin film coatings, resulting in its versatility across a host of applications including, energy harvesting, dielectric layers and water purification. Modification of the PMMA surface can be achieved by atomic layer deposition (ALD), a vapor-phase, chemical deposition technique, which permits atomic-level control. However, PMMA presents a challenge for ALD due to its lack of active surface sites, necessary for gas precursor reaction, nucleation, and subsequent growth. The purpose of this review is to discuss the research related to the employment of PMMA as either a substrate, support, or masking layer over a range of ALD thin film growth techniques, namely, thermal, plasma-enhanced, and area-selective atomic layer deposition. It also highlights applications in the selected fields of flexible electronics, biomaterials, sensing, and photocatalysis, and underscores relevant characterization techniques. Further, it concludes with a prospective view of the role of ALD in PMMA processing.

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