Specific gravity and dielectric permittivity characteristics of mesoporous-silica/epoxy composites

Author(s):  
Y. Yamashita ◽  
M. Kurimoto ◽  
T. Kato ◽  
T. Funabashi ◽  
Y. Suzuoki

2015 ◽  
Vol 815 ◽  
pp. 67-71
Author(s):  
Gang Li ◽  
Peng Li Zhu ◽  
Tao Zhao ◽  
Rong Sun ◽  
Daniel Lu

In the present study, epoxy based composite filled with meso and non-porous silica microspheres with similar size were prepared respectively and their rheological and thermo-mechanical properties were studied systematically. The results showed that the mesoporous silica/epoxy composites showed much higher viscosity, storage modulus and glass transition temperature (Tg) while lower coefficient of thermal expansion (CTE) than did epoxy composites with nonporous silica particles, which could be attributed to the stronger interface interaction between the mesoporous silica filler with larger specific surface area (BET) and the epoxy matrix.



2020 ◽  
Vol 14 (4) ◽  
pp. 7528-7539
Author(s):  
F. Bajuri ◽  
N. Mazlan ◽  
M. R. Ishak ◽  
M. K. A. Uyup

In this work, mesoporous silica with designated amount was added in kenaf/epoxy composites to improve the mechanical properties of the composite and reduce the water uptake of fabricated composites. The composites were fabricated using hot press method (HP) and impregnation method (IMP). For HP specimens, silica was dispersed into epoxy resin using homogenizer before being applied to the kenaf mat and subsequently hot pressed. While for IMP specimens, the kenaf mat was placed inside the silica/epoxy solution under 600 mm Hg impregnation pressure before being hot pressed. The results for flexural properties revealed that IMP specimen with 40 vol% of kenaf fibre and 5 vol% of silica have the highest strength and modulus at 78.6 MPa and 5.11 GPa respectively. Same trend can be seen for compressive properties as the same specimen had the highest compressive strength and modulus at 69.3 MPa and 1.81 GPa respectively. Finally for water absorption properties, IMP specimens had a reduction in water uptake compared to its HP specimen counterparts with the same kenaf and silica content. IMP specimen with 60 vol% kenaf and 5 vol% silica had the lowest water uptake after 90 days of immersion in distilled water at 13.5% increase in weight.



Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5251
Author(s):  
Yutao Hao ◽  
Qihan Li ◽  
Xianhai Pang ◽  
Bohong Gong ◽  
Chengmei Wei ◽  
...  

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m−1 K−1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.





2018 ◽  
Vol 51 (24) ◽  
pp. 245301 ◽  
Author(s):  
Anupam Maity ◽  
Subha Samanta ◽  
Soumi Chatterjee ◽  
Ramaprasad Maiti ◽  
Debasish Biswas ◽  
...  


2020 ◽  
Vol 56 (6) ◽  
pp. 4254-4265 ◽  
Author(s):  
Wenqiang Zhang ◽  
Xiaotong Zhu ◽  
Liang Liang ◽  
Peng Yin ◽  
Peitao Xie ◽  
...  




2016 ◽  
Vol 29 (1) ◽  
pp. 3-12 ◽  
Author(s):  
Zijun Wang ◽  
Wenying Zhou ◽  
Xuezhen Sui ◽  
Lina Dong ◽  
Qingguo Chen ◽  
...  

The broadband dielectric spectroscopy was carried out in the frequency range of 1–107 Hz at the −20–200°C range to investigate the effect of temperature on the dynamic thermal–dielectric behavior of the aluminum (Al)/epoxy composite. The epoxy composites with core-shell–structured Al particles were prepared by solution method. The results show that the dielectric permittivity of the composites increased smoothly with a rise of filler content and reduced with an increase in frequency at room temperature. While the dielectric loss and conductivity still remained at low level owing to the nanoscale alumina insulating shell serving as a barrier layer to control the dielectric loss. The dielectric permittivity, dissipation factor, and conductivity of the composites increased with temperature and exhibited an abrupt rise around the glass transition temperature ( Tg). A large increase in the dissipation factor and conductivity with temperature is attributed to the direct current conduction of thermal-activated charge carriers resulting from pure epoxy above Tg. The observed temperature-dependent dielectric relaxations of the composites indicated a thermally activated behavior of the relaxation time of epoxy chain segments.



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