In-process measurement of the grinding force in silicon wafer self-rotating grinding process

2020 ◽  
Author(s):  
Lixiang Zhang ◽  
Fei Qin ◽  
Pei Chen ◽  
Tong An ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Force ◽  
Grinding Process ◽  
Process Measurement

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

2021 ◽  
Vol 154 ◽  
pp. 107550
Author(s):  
Fei Qin ◽  
Lixiang Zhang ◽  
Pei Chen ◽  
Tong An ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Force ◽  
Grinding Process ◽  
Wireless Measurement

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

Grinding Force Model for Low-Speed Grinding Based on Impact Principle

2013 ◽  
Vol 797 ◽  
pp. 123-128
Author(s):  
Ming He Liu ◽  
Xiu Ming Zhang ◽  
Shi Chao Xiu
Keyword(s):  
Sliding Friction ◽  
Impact Load ◽  
Grinding Force ◽  
Calculation Model ◽  
Force Model ◽  
Grinding Process ◽  
Low Speed ◽  
Impact Area ◽  
Force Mechanism ◽  
The Impact

In the low-speed grinding process, the force generated when the wheel grinding the workpiece is the result of sliding friction, plough and cutting. While in the actual study, the cutting process has attracted extensive attention. Impact effect to the entire grinding process on the contact is ignored so that the error exists between the calculation grinding force and the measured grinding force. Basing on the shock effect to the grinding process, the paper divides the contact area into impact area and cutting area. And the model of impact load generated from single grit is built. Moreover, the grinding force theoretical calculation model and total grinding force mathematical model is also constructed by analyzing the impact load affecting on the grinding force mechanism. Finally experimental study verifies the correctness of theoretical analysis.

Prozessüberwachung beim ultraschallunterstützten Schleifen*/Influence of the tool-workpiece contact on the ultrasonic amplitudes in the grinding process

2018 ◽  
Vol 108 (07-08) ◽  
pp. 513-518
Author(s):  
J. Bruckhoff ◽  
E. Uhlmann
Keyword(s):  
High Hardness ◽  
Grinding Process ◽  
Process Measurement ◽  
Hard Materials ◽  
Grinding Processes ◽  
Technical Ceramics

Hinsichtlich Zähigkeit verbesserte technische Keramiken führen in Kombination mit der materialspezifischen hohen Härte dieser sprödharten Werkstoffe zu Herausforderungen bei der Bearbeitung. Das präzise sowie wirtschaftliche Bearbeiten geschieht daher vorwiegend mit Schleifverfahren. Die Ultraschallunterstützung kann die Produktivität von Schleifprozessen erhöhen. In-Prozess-Messungen der Ultraschallamplitude sollen Aufschluss über die Wechselwirkungen von Werkstück und Werkzeug geben.   Due to improved toughness and material-specific high hardness of technical ceramics, the machining of these brittle-hard materials is challenging. Therefore, precise and economical processing is mainly done by grinding. Ultrasonic support can increase the productivity of grinding processes. In-process measurement of ultrasonic amplitudes provides information about the interaction between the workpiece and the tool.

Development of Three-Dimensional Dynamometer for Wafer Grinder

2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo
Keyword(s):  
Three Dimensional ◽  
High Sensitivity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Performance Parameters ◽  
Grinding Forces ◽  
Grinding Method ◽  
Static Performance ◽  
Good Repeatability

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.

Prediction of Surface/Subsurface Crack Damage of Ground Ceramics

2006 ◽  
Vol 304-305 ◽  
pp. 271-275
Author(s):  
Bin Lin ◽  
Hong Tao Zhu ◽  
L. Han ◽  
S.Y. Yu
Keyword(s):  
Crack Propagation ◽  
Grinding Force ◽  
Grinding Process ◽  
Subsurface Crack ◽  
Layer Depth ◽  
Predicting Model ◽  
Damage Layer

Ceramic is prone to engender surface/subsurface crack damage layer because of great grinding force and high brittle. Prediction of crack damage of ground ceramic is important for design and assessment of grinding process. In this paper, an investigation for surface/subsurface crack damage of ground ceramic is introduced. Depth of crack damage layer can predicted by calculating crack propagation balance size and a predicting model of crack damage layer depth is obtained.

701 Study on grinding process of ultra-thin silicon wafer

2011 ◽  
Vol 2011.19 (0) ◽  
pp. 177-178
Author(s):  
Haruma Chiba ◽  
Yutaro Ebina ◽  
Takeyuki Yamamoto ◽  
Hirotaka Ojima ◽  
Teppei Onuki ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Process ◽  
Thin Silicon

The Adaptive Control of Grinding Force of CNC Cam Grinder Based on Neural Network

2012 ◽  
Vol 217-219 ◽  
pp. 2051-2055
Author(s):  
Ming Li Xie ◽  
Ling Lu
Keyword(s):  
Neural Network ◽  
Adaptive Control ◽  
Control Method ◽  
Metal Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Control Measures ◽  
Numerical Control ◽  
Grinding Wheel ◽  
Grinding Process

In the process of cam grinding, the fluctuation of grinding force can lead to the abnormal wear of the grinding wheel, the decrease of the grinding surface quality and even the damage of the grinding process system. The paper took the grinding process of numerical control cam grinding machine as research subject, the grinding force mathematical model was built, the indirect test and control measures were researched and an adaptive control method based on neural network was proposed and applied to the grinding force control of the cam grinding process. At last, the controller was designed and the grinding simulation was performed with MATLAB, which proved that the system could solve the fluctuation of grinding force during the process of cam grinding and the controller was equipped with good dynamic characteristic. The results indicate that the method can realize the purpose of optimal metal removal rate and enhance the grinding quality of cams.

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