The multianalytic approach; or yes, you can get there from here! Problem solving in semiconductor manufacturing

1995 ◽  
Vol 53 ◽  
pp. 690-691
Author(s):  
M. M. Ecker
Keyword(s):  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Analytical Techniques ◽  
Mode Analysis ◽  
Challenges And Opportunities ◽  
Failure Mode Analysis ◽  
Additional Processing ◽  
Optical Measure ◽  
Oxide Removal ◽  
Robust Processing

Manufacturing, development and failure mode analysis problems, in the semiconductor industry, present unique challenges and opportunities, not only to utilize several analytical techniques, but to process and deprocess samples into an appropriate format for analysis. In today' s' cleanrooms a great deal of development is integrated into the manufacturing line. This, combined with the ever decreasing size and increasing density of components on a single integrated circuit, creates the need for accurate as well as precise measurements. The method of measure must be appropriate to the task, compatible with the manufacturing environment, and useful in a process control system.Current complimentary bipolar technologies, utilizing shallow junction implants, require additional as well as less robust processing in order to maintain the depth and latitude of the junction. Additional processing includes the formation of a contact window spacer. The spacer is formed, following implant and thermal anneal, by growing and subsequently removing a thermal oxide layer. In the manufacturing process, oxide removal is verified by optical measure using visible light.

scholarly journals Challenges and opportunities for semiconductor and electronic design automation industry in post-Covid-19 years

2021 ◽  
Vol 1208 (1) ◽  
pp. 012036
Author(s):  
Galia I Marinova ◽  
Aida K Bitri
Keyword(s):  
Design Automation ◽  
State Of The Art ◽  
Semiconductor Industry ◽  
Bullwhip Effect ◽  
Decision Makers ◽  
Innovative Solutions ◽  
Challenges And Opportunities ◽  
The Usa ◽  
The Right ◽  
The Internet Of Things

Abstract The coronavirus pandemic found the semiconductor industry and the chip production supply chain ecosystem unprepared. Companies and main actors in the sector could not read the signs. The decision-makers suffered to deal with the challenges in time and take the right actions. The bullwhip effect caused by the COVID-19 destabilized the operations and some of the experts say that these problems might last and on the other side, this might open doors to innovative solutions that might change the game. The global shutdowns, the misread of the demand for electronics, underestimating customers’ demand for the automotive sector, and the Internet of Things in general, were some of the main problems causing chaos in the industry. The paper studies the state-of-the-art and the solutions offered by the semiconductor industry and by the initiatives that Europe, the USA, and especially China, took to make companies and their countries take the most out of this situation.

Applications of SIMS to electronic materials and devices

1992 ◽  
Vol 50 (2) ◽  
pp. 1682-1683
Author(s):  
S.F. Corcoran
Keyword(s):  
Depth Distribution ◽  
Secondary Ion Mass Spectrometry ◽  
Semiconductor Device ◽  
Electronic Materials ◽  
Profile Analysis ◽  
Semiconductor Industry ◽  
Small Diameter ◽  
Depth Resolution ◽  
Detection Sensitivity

Over the past decade secondary ion mass spectrometry (SIMS) has played an increasingly important role in the characterization of electronic materials and devices. The ability of SIMS to provide part per million detection sensitivity for most elements while maintaining excellent depth resolution has made this technique indispensable in the semiconductor industry. Today SIMS is used extensively in the characterization of dopant profiles, thin film analysis, and trace analysis in bulk materials. The SIMS technique also lends itself to 2-D and 3-D imaging via either the use of stigmatic ion optics or small diameter primary beams.By far the most common application of SIMS is the determination of the depth distribution of dopants (B, As, P) intentionally introduced into semiconductor materials via ion implantation or epitaxial growth. Such measurements are critical since the dopant concentration and depth distribution can seriously affect the performance of a semiconductor device. In a typical depth profile analysis, keV ion sputtering is used to remove successive layers the sample.

Analysis of completed commercial semiconductors using EPMA

1996 ◽  
Vol 54 ◽  
pp. 502-503
Author(s):  
R. Packwood ◽  
M.W. Phaneuf ◽  
V. Weatherall ◽  
I. Bassignana
Keyword(s):  
Electron Probe Microanalysis ◽  
Electron Probe ◽  
Semiconductor Industry ◽  
Detection Limits ◽  
High Technology ◽  
Depth Resolution ◽  
Analytical Instruments ◽  
Wide Range ◽  
Numerous Element ◽  
Choice Method

The development of specialized analytical instruments such as the SIMS, XPS, ISS etc., all with truly incredible abilities in certain areas, has given rise to the notion that electron probe microanalysis (EPMA) is an old fashioned and rather inadequate technique, and one that is of little or no use in such high technology fields as the semiconductor industry. Whilst it is true that the microprobe does not possess parts-per-billion sensitivity (ppb) or monolayer depth resolution it is also true that many times these extremes of performance are not essential and that a few tens of parts-per-million (ppm) and a few tens of nanometers depth resolution is all that is required. In fact, the microprobe may well be the second choice method for a wide range of analytical problems and even the method of choice for a few.The literature is replete with remarks that suggest the writer is confusing an SEM-EDXS combination with an instrument such as the Cameca SX-50. Even where this confusion does not exist, the literature discusses microprobe detection limits that are seldom stated to be as low as 100 ppm, whereas there are numerous element combinations for which 10-20 ppm is routinely attainable.

Continuous hydrogenolysis of acetal-stabilized lignin in flow

2021 ◽  
Author(s):  
Wu Lan ◽  
Yuan Peng Du ◽  
Songlan Sun ◽  
Jean Behaghel de Bueren ◽  
Florent Héroguel ◽  
...  
Keyword(s):  
Steady State ◽  
Challenges And Opportunities

We performed a steady state high-yielding depolymerization of soluble acetal-stabilized lignin in flow, which offered a window into challenges and opportunities that will be faced when continuously processing this feedstock.

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