A Study of Adhesion Interface about Die Bonding Structure with Conductive Silver Paste

Author(s):  
Naoaki Tsurumi ◽  
Noriyuki Masago ◽  
Taiki Baba ◽  
Hiroyuki Murata ◽  
Yuta Tsuji ◽  
...  
Author(s):  
Kisho Ashida ◽  
Kenya Kawano ◽  
Naotaka Tanaka ◽  
Atsushi Nishikizawa ◽  
Nobuya Koike

Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure. First, we assumed that the fracturing was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the silver paste fracture strength using a three-point bending test and a bonded specimen with silver paste. Finally, we predicted the occurrence of silver paste fracturing by calculating the silver paste stress during reflow soldering process and comparing it with the measured fracture strength. Results obtained in strength evaluation analysis were consistent with those obtained in package reflow tests, indicating that this method can be used to predict the occurrence of silver paste fracturing.


2015 ◽  
Vol 36 (8) ◽  
pp. 835-837 ◽  
Author(s):  
Li-Chin Cheng ◽  
Chih-Ming Chen ◽  
Ming-Guan Chen ◽  
Chi-Chang Hu ◽  
Hsin-Yi Jiang ◽  
...  

Author(s):  
Y. Okabe ◽  
A. Kusuhara ◽  
M. Mizuno ◽  
K. Horiuchi

2020 ◽  
pp. 1-25
Author(s):  
Naoaki Tsurumi ◽  
Yuta Tsuji ◽  
Taiki Baba ◽  
Hiroyuki Murata ◽  
Noriyuki Masago ◽  
...  

2018 ◽  
Vol 140 ◽  
pp. 64-72 ◽  
Author(s):  
Jie Li ◽  
Xin Li ◽  
Lei Wang ◽  
Yun-Hui Mei ◽  
Guo-Quan Lu

Author(s):  
L. Wan ◽  
R. F. Egerton

INTRODUCTION Recently, a new compound carbon nitride (CNx) has captured the attention of materials scientists, resulting from the prediction of a metastable crystal structure β-C3N4. Calculations showed that the mechanical properties of β-C3N4 are close to those of diamond. Various methods, including high pressure synthesis, ion beam deposition, chemical vapor deposition, plasma enhanced evaporation, and reactive sputtering, have been used in an attempt to make this compound. In this paper, we present the results of electron energy loss spectroscopy (EELS) analysis of composition and bonding structure of CNX films deposited by two different methods.SPECIMEN PREPARATION Specimens were prepared by arc-discharge evaporation and reactive sputtering. The apparatus for evaporation is similar to the traditional setup of vacuum arc-discharge evaporation, but working in a 0.05 torr ambient of nitrogen or ammonia. A bias was applied between the carbon source and the substrate in order to generate more ions and electrons and change their energy. During deposition, this bias causes a secondary discharge between the source and the substrate.


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