Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits

Author(s):  
E. Beyne
Diagnostics ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 962
Author(s):  
Dario de Biase ◽  
Matteo Fassan ◽  
Umberto Malapelle

Next-Generation Sequencing (NGS) allows for the sequencing of multiple genes at a very high depth of coverage [...]


2022 ◽  
Vol 17 (01) ◽  
pp. C01040
Author(s):  
C. Zhao ◽  
D. Guo ◽  
Q. Chen ◽  
N. Fang ◽  
Y. Gan ◽  
...  

Abstract This paper presents the design and the test results of a 25 Gbps VCSEL driving ASIC fabricated in a 55 nm CMOS technology as an attempt for the future very high-speed optical links. The VCSEL driving ASIC is composed of an input equalizer stage, a pre-driver stage and a novel output driver stage. To achieve high bandwidth, the pre-driver stage combines the inductor-shared peaking structure and the active-feedback technique. A novel output driver stage uses the pseudo differential CML driver structure and the adjustable FFE pre-emphasis technique to improve the bandwidth. This VCSEL driver has been integrated in a customized optical module with a VCSEL array. Both the electrical function and optical performance have been fully evaluated. The output optical eye diagram has passed the eye mask test at the data rate of 25 Gbps. The peak-to-peak jitter of 25 Gbps optical eye is 19.5 ps and the RMS jitter is 2.9 ps.


Author(s):  
Eugene M. Chow

Lithographically defined spring electrical contacts have many applications for next generation electronics test and packaging. The springs can lower the cost of multi-chip modules because their rework ability addresses the known-good-die problem. Lower height chip stacking for mobile electronics markets is enabled because a sliding spring can have a much shorter profile than solder. Larger die can be directly bonded to the board because the compliance absorbs thermal expansion mismatches between substrates. Significant stress isolation is possible, which is important for mechanically sensitive die such as MEMS and low K die. Very high density is possible, as 6 (am pitch has been demonstrated. Fabrication is scalable and assembly is low temperature. This paper reviews our prototype demonstrations for these applications as well as relevant reliability data and contact studies.


Author(s):  
Brian D. Krosschell ◽  
Stephen J. Klick ◽  
John J. Moskwa

The goal of this research is to use a hydrostatic transient dynamometer combined with new control techniques to replicate multi-cylinder engine dynamics which occur while the engine is started by an electric starting system. The transient engine dynamometer test system in the Powertrain Control Research Laboratory (PCRL) uses a torque tube and extremely stiff driveline in order to provide a very high bandwidth of torque actuation. The design and nature of this low inertia, stiff system requires that a standard electrical starting system be omitted. One of the objectives of this research was to assemble a new engine on the hydrostatic dynamometer and model the starting dynamics which occur during an engine cold start. The other objective was to verify and compare data collected by the PCRL and Ford to validate testing. This information will then be used in support of development of a cold start testing procedure on the single-cylinder engine transient test system in the PCRL.


Author(s):  
Robert M. Versluis ◽  
Francesco Venneri ◽  
David Petti ◽  
Lance Snead ◽  
Donald McEachern

The helium-cooled, graphite-moderated Very High Temperature Reactor (VHTR) has become the centerpiece of the U.S. Department of Energy’s (DOE) Next Generation Nuclear Plant (NGNP) program. The NGNP program aims to construct a VHTR prototype, with the participation of industry, by the year 2021.


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